Inventor · disambiguated record
Chung W. Ho
Also filed as: HO CHUNG W · HO CHUNG WEN
51 granted patents·7 pending applications·1,607 citations·filing 1978–2024
99Inventor score
Top patents by PatentIndex Score
58 records- 0197US4349862ACapacitive chip carrier and multilayer ceramic capacitorsIBM·Filed 1980·Granted Sep 14, 1982·157 cites·12 claims
- 0295US4328530AMultiple layer, ceramic carrier for high switching speed VLSI chipsIBM·Filed 1980·Granted May 4, 1982·108 cites·11 claims
- 0393US7223687B1Printed wiring board and method of fabricating the sameSUBTRON TECHNOLOGY CO LTD·Filed 2006·Granted May 29, 2007·36 cites·15 claims
- 0492US5998859APackaging and interconnect system for integrated circuitsMICROMODULE SYSTEMS INC·Filed 1995·Granted Dec 7, 1999·135 cites·4 claims
- 0592US4489364AChip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surfaceIBM·Filed 1981·Granted Dec 18, 1984·87 cites·6 claims
- 0691US6320256B1Quick turn around fabrication process for packaging substrates and high density cardsTHIN FILM MODULE INC·Filed 2001·Granted Nov 20, 2001·57 cites·2 claims
- 0790US6753600B1Structure of a substrate for a high density semiconductor packageTHIN FILM MODULE INC·Filed 2003·Granted Jun 22, 2004·59 cites·21 claims
- 0890US6424037B1Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ballAPTOS CORP·Filed 2001·Granted Jul 23, 2002·39 cites·6 claims
- 0990US4430690ALow inductance MLC capacitor with metal impregnation and solder bar contactIBM·Filed 1982·Granted Feb 7, 1984·56 cites·18 claims
- 1088US6242279B1High density wire bond BGATHIN FILM MODULE INC·Filed 1999·Granted Jun 5, 2001·112 cites·9 claims
- 1188US5422514APackaging and interconnect system for integrated circuitsMICROMODULE SYSTEMS INC·Filed 1993·Granted Jun 6, 1995·93 cites·13 claims
- 1287US8859912B2Coreless package substrate and fabrication method thereofTSENG TZYY-JANG·Filed 2011·Granted Oct 14, 2014·9 cites·16 claims
- 1383US11189501B1Chip package structure and manufacturing method thereofHO CHUNG W·Filed 2021·Granted Nov 30, 2021·1 cites·15 claims
- 1483US5402077ABare die carrierMICROMODULE SYSTEMS INC·Filed 1992·Granted Mar 28, 1995·73 cites·26 claims
- 1583US4254445ADiscretionary fly wire chip interconnectionIBM·Filed 1979·Granted Mar 3, 1981·45 cites·9 claims
- 1682US8624382B2Packaging substrate and method of fabricating the sameTSENG TZYY-JANG·Filed 2012·Granted Jan 7, 2014·5 cites·4 claims
- 1780US6562656B1Cavity down flip chip BGATHIN FILM MODULE INC·Filed 2001·Granted May 13, 2003·31 cites·26 claims
- 1879US10201099B1Manufacturing method of circuit substrate including electronic deviceHO CHUNG W·Filed 2018·Granted Feb 5, 2019·3 cites·18 claims
- 1978US5267867APackage for multiple removable integrated circuitsDIGITAL EQUIPMENT CORP·Filed 1992·Granted Dec 7, 1993·62 cites·16 claims
- 2077US6331447B1High density flip chip BGATHIN FILM MODULE INC·Filed 2001·Granted Dec 18, 2001·18 cites·13 claims
- 2176US9484223B2Coreless packaging substrate and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Nov 1, 2016·2 cites·11 claims
- 2274US4812191AMethod of forming a multilevel interconnection deviceDIGITAL EQUIPMENT CORP·Filed 1987·Granted Mar 14, 1989·53 cites·19 claims
- 2373US5796164APackaging and interconnect system for integrated circuitsMICROMODULE SYSTEMS INC·Filed 1996·Granted Aug 18, 1998·55 cites·36 claims
- 2471US9137899B2Process of electronic structure and electronic structureHO CHUNG W·Filed 2012·Granted Sep 15, 2015·3 cites·25 claims
- 2570US5508558AHigh density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portionDIGITAL EQUIPMENT CORP·Filed 1993·Granted Apr 16, 1996·43 cites·17 claims
- 2670US5456404AMethod of testing semiconductor chips with reusable test packageDIGITAL EQUIPMENT CORP·Filed 1993·Granted Oct 10, 1995·47 cites·12 claims
- 2769US4210885AThin film lossy line for preventing reflections in microcircuit chip package interconnectionsIBM·Filed 1978·Granted Jul 1, 1980·25 cites·8 claims
- 2868US6291268B1Low cost method of testing a cavity-up BGA substrateTHIN FILM MODULE INC·Filed 2001·Granted Sep 18, 2001·15 cites·27 claims
- 2968US6221693B1High density flip chip BGATHIN FILM MODULE INC·Filed 1999·Granted Apr 24, 2001·30 cites·18 claims
- 3067US6277672B1BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technologyTHIN FILM MODULE INC·Filed 1999·Granted Aug 21, 2001·30 cites·29 claims
- 3165US6586846B2Low cost decal material used for packagingTHIN FILM MODULE INC·Filed 2001·Granted Jul 1, 2003·11 cites·7 claims
- 3264US6937044B1Bare die carrierKULICKE & SOFFA IND INC·Filed 2000·Granted Aug 30, 2005·12 cites·28 claims
- 3363US2025226325A1Package structure and manufacturing method thereofHO CHUNG W·Filed 2024·Application pending·0 cites
- 3462US7540969B2High thermal conducting circuit substrate and manufacturing process thereofSUBTRON TECHNOLOGY CO LTD·Filed 2006·Granted Jun 2, 2009·2 cites·17 claims
- 3562US6281041B1Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ballAPTOS CORP·Filed 1999·Granted Aug 28, 2001·18 cites·12 claims
- 3662US2025226329A1Chip package structure and manufacturing method thereofHO CHUNG W·Filed 2024·Application pending·0 cites
- 3760US6455926B2High density cavity-up wire bond BGATHIN FILM MODULE INC·Filed 2001·Granted Sep 24, 2002·8 cites·4 claims
- 3860US6287890B1Low cost decal material used for packagingTHIN FILM MODULE INC·Filed 1999·Granted Sep 11, 2001·22 cites·20 claims
- 3960US2024250012A1Package carrier and manufacturing method thereof and chip package structureHO CHUNG W·Filed 2024·Application pending·0 cites
- 4060US2024243021A1Package carrier and manufacturing method thereof and chip package structureHO CHUNG W·Filed 2024·Application pending·0 cites
- 4159US7535098B2Structure of substrateUNIMICRON TECHNOLOGY CORP·Filed 2005·Granted May 19, 2009·1 cites·16 claims
- 4258US11227824B1Chip carrier and manufacturing method thereofHO CHUNG W·Filed 2021·Granted Jan 18, 2022·0 cites·23 claims
- 4355US11178774B1Method for manufacturing circuit boardHO CHUNG W·Filed 2021·Granted Nov 16, 2021·0 cites·12 claims
- 4455US6049215ABare die carrierKULICKE & SOFFA IND INC·Filed 1995·Granted Apr 11, 2000·19 cites·13 claims
- 4554US11217551B1Chip package structure and manufacturing method thereofHO CHUNG W·Filed 2021·Granted Jan 4, 2022·0 cites·13 claims
- 4654US7867908B2Method of fabricating substrateUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Jan 11, 2011·0 cites·15 claims
- 4753US10076039B2Method of fabricating packaging substrateUNIMICRON TECH CORPORATION·Filed 2014·Granted Sep 11, 2018·0 cites·9 claims
- 4853US9070616B2Method of fabricating packaging substrateUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Jun 30, 2015·0 cites·9 claims
- 4950US8912642B2Packaging substrate and fabrication method thereofTSENG TZYY-JANG·Filed 2012·Granted Dec 16, 2014·0 cites·4 claims
- 5049US9257379B2Coreless packaging substrate and method of fabricating the sameTSENG TZYY-JANG·Filed 2012·Granted Feb 9, 2016·0 cites·5 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →