Inventor · disambiguated record
Ching-Cheng Huang
Also filed as: HUANG CHING-CHENG
74 granted patents·8 pending applications·2,252 citations·filing 1996–2023
99Inventor score
Top patents by PatentIndex Score
82 records- 0199US6818545B2Low fabrication cost, fine pitch and high reliability solder bumpMEGIC CORP·Filed 2001·Granted Nov 16, 2004·271 cites·35 claims
- 0298US6649509B1Post passivation metal scheme for high-performance integrated circuit devicesMEGIC CORP·Filed 2001·Granted Nov 18, 2003·156 cites·110 claims
- 0398US6605528B1Post passivation metal scheme for high-performance integrated circuit devicesMEGIC CORP·Filed 2001·Granted Aug 12, 2003·151 cites·69 claims
- 0497US6917119B2Low fabrication cost, high performance, high reliability chip scale packageMEGIC CORP·Filed 2003·Granted Jul 12, 2005·106 cites·10 claims
- 0597US6756295B2Chip structure and process for forming the sameMEGIC CORP·Filed 2002·Granted Jun 29, 2004·141 cites·35 claims
- 0697US6673698B1Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layersMEGIC CORP·Filed 2002·Granted Jan 6, 2004·100 cites·15 claims
- 0797US6642136B1Method of making a low fabrication cost, high performance, high reliability chip scale packageMEGIC CORP·Filed 2001·Granted Nov 4, 2003·123 cites·36 claims
- 0896US8072070B2Low fabrication cost, fine pitch and high reliability solder bumpLEE JIN-YUAN·Filed 2009·Granted Dec 6, 2011·32 cites·23 claims
- 0996US7863739B2Low fabrication cost, fine pitch and high reliability solder bumpMEGICA CORP·Filed 2007·Granted Jan 4, 2011·28 cites·48 claims
- 1096US6746898B2Integrated chip package structure using silicon substrate and method of manufacturing the sameMEGIC CORP·Filed 2002·Granted Jun 8, 2004·99 cites·60 claims
- 1194US7413929B2Integrated chip package structure using organic substrate and method of manufacturing the sameMEGICA CORP·Filed 2002·Granted Aug 19, 2008·62 cites·75 claims
- 1294US6800941B2Integrated chip package structure using ceramic substrate and method of manufacturing the sameMEGIC CORP·Filed 2002·Granted Oct 5, 2004·76 cites·16 claims
- 1394US6798073B2Chip structure and process for forming the sameMEGIC CORP·Filed 2003·Granted Sep 28, 2004·78 cites·108 claims
- 1494US6762115B2Chip structure and process for forming the sameMEGIC CORP·Filed 2002·Granted Jul 13, 2004·90 cites·34 claims
- 1593US7355288B2Low fabrication cost, high performance, high reliability chip scale packageMEGICA CORP·Filed 2005·Granted Apr 8, 2008·20 cites·26 claims
- 1693US7338890B2Low fabrication cost, high performance, high reliability chip scale packageMEGICA CORP·Filed 2005·Granted Mar 4, 2008·23 cites·25 claims
- 1793US6815324B2Reliable metal bumps on top of I/O pads after removal of test probe marksMEGIC CORP·Filed 2001·Granted Nov 9, 2004·70 cites·28 claims
- 1892US7498196B2Structure and manufacturing method of chip scale packageMEGICA CORP·Filed 2001·Granted Mar 3, 2009·47 cites·141 claims
- 1992US7271033B2Method for fabricating chip packageMEGICA CORP·Filed 2004·Granted Sep 18, 2007·53 cites·28 claims
- 2090US7309920B2Chip structure and process for forming the sameMEGICA CORP·Filed 2005·Granted Dec 18, 2007·15 cites·20 claims
- 2190US6495912B1Structure of ceramic package with integrated passive devicesMEGIC CORP·Filed 2001·Granted Dec 17, 2002·64 cites·38 claims
- 2289US8471361B2Integrated chip package structure using organic substrate and method of manufacturing the sameLIN MOU-SHIUNG·Filed 2011·Granted Jun 25, 2013·7 cites·32 claims
- 2389US7345365B2Electronic component with die and passive deviceMEGICA CORP·Filed 2003·Granted Mar 18, 2008·37 cites·34 claims
- 2487US7977763B2Chip package with die and substrateMEGICA CORP·Filed 2004·Granted Jul 12, 2011·30 cites·29 claims
- 2587US7898058B2Integrated chip package structure using organic substrate and method of manufacturing the sameMEGICA CORP·Filed 2008·Granted Mar 1, 2011·10 cites·20 claims
- 2687US7468316B2Low fabrication cost, fine pitch and high reliability solder bumpMEGICA CORP·Filed 2007·Granted Dec 23, 2008·9 cites·20 claims
- 2785US7511376B2Circuitry component with metal layer over die and extending to place not over dieMEGICA CORP·Filed 2003·Granted Mar 31, 2009·30 cites·33 claims
- 2885US6700162B2Chip structure to improve resistance-capacitance delay and reduce energy loss of the chipMEGIC CORP·Filed 2003·Granted Mar 2, 2004·35 cites·121 claims
- 2985US5755913AAdhesive-free adhesion between polymer surfacesFiled 1996·Granted May 26, 1998·77 cites·35 claims
- 3084US7728090B2Norbornene compounds with cross-linkable groups and their derivativesUNIV NAT TAIWAN SCIENCE TECH·Filed 2006·Granted Jun 1, 2010·5 cites·1 claims
- 3183US9369175B2Low fabrication cost, high performance, high reliability chip scale packageLEE JIN-YUAN·Filed 2007·Granted Jun 14, 2016·9 cites·24 claims
- 3283US8368204B2Chip structure and process for forming the sameMEGICA CORP·Filed 2011·Granted Feb 5, 2013·5 cites·33 claims
- 3383US6936531B2Process of fabricating a chip structureMEGIC CORP·Filed 2003·Granted Aug 30, 2005·17 cites·34 claims
- 3481US9018774B2Chip packageLEE JIN-YUAN·Filed 2008·Granted Apr 28, 2015·6 cites·63 claims
- 3581US7465653B2Reliable metal bumps on top of I/O pads after removal of test probe marksMEGICA CORP·Filed 2004·Granted Dec 16, 2008·22 cites·19 claims
- 3681US7335704B2Functional norbornenes and polymeric derivatives and fabrication thereofUNIV NAT TAIWAN SCIENCE TECH·Filed 2007·Granted Feb 26, 2008·4 cites·4 claims
- 3779US8492870B2Semiconductor package with interconnect layersLIN MOU-SHIUNG·Filed 2011·Granted Jul 23, 2013·3 cites·14 claims
- 3878US8481418B2Low fabrication cost, high performance, high reliability chip scale packageLEE JIN-YUAN·Filed 2007·Granted Jul 9, 2013·6 cites·42 claims
- 3977US8835221B2Integrated chip package structure using ceramic substrate and method of manufacturing the sameMEGICA CORP·Filed 2013·Granted Sep 16, 2014·4 cites·36 claims
- 4077US7772341B2Norbornene compounds with cross-linkable groups and their derivativesUNIV NAT TAIWAN SCIENCE TECH·Filed 2009·Granted Aug 10, 2010·2 cites·3 claims
- 4176US8912666B2Structure and manufacturing method of chip scale packageMEGICA CORP·Filed 2013·Granted Dec 16, 2014·2 cites·22 claims
- 4276US8426982B2Structure and manufacturing method of chip scale packageLEE JIN-YUAN·Filed 2009·Granted Apr 23, 2013·4 cites·29 claims
- 4376US8008776B2Chip structure and process for forming the sameMEGICA CORP·Filed 2008·Granted Aug 30, 2011·4 cites·39 claims
- 4476US7470988B2Chip structure and process for forming the sameMEGICA CORP·Filed 2004·Granted Dec 30, 2008·11 cites·27 claims
- 4576US7271230B2Norbornene compounds with cross-linkable groups and their derivativesUNIV NAT TAIWAN SCIENCE TECH·Filed 2006·Granted Sep 18, 2007·2 cites·4 claims
- 4675US7796955B2Expandable wireless transceiverWISTRON NEWEB CORP·Filed 2007·Granted Sep 14, 2010·6 cites·13 claims
- 4775US7388055B2Functional norbornenes and polymeric derivatives and fabrication thereofUNIV NAT TAIWAN SCIENCE TECH·Filed 2007·Granted Jun 17, 2008·2 cites·4 claims
- 4874US7397117B2Chip package with die and substrateMEGICA CORP·Filed 2004·Granted Jul 8, 2008·14 cites·19 claims
- 4974US7297614B2Method for fabricating circuitry componentMEGICA CORP·Filed 2004·Granted Nov 20, 2007·13 cites·21 claims
- 5072USRE43674EPost passivation metal scheme for high-performance integrated circuit devicesLIN MOU-SHIUNG·Filed 2006·Granted Sep 18, 2012·1 cites·119 claims
Showing the top 50 of 82 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →