Inventor · disambiguated record
Chiu H. Ting
Also filed as: TING CHIU · TING CHIU H
34 granted patents·3 pending applications·6,865 citations·filing 1973–2005
99Inventor score
Files withINTEL CORP8ADVANCED MICRO DEVICES INC6CUTEK RESEARCH INC5CORNELL RES FOUNDATION INC4CUTEK RES INC4
Top patents by PatentIndex Score
37 records- 0199US5969422APlated copper interconnect structureADVANCED MICRO DEVICES INC·Filed 1997·Granted Oct 19, 1999·821 cites·37 claims
- 0299US5913147AMethod for fabricating copper-aluminum metallizationADVANCED MICRO DEVICES INC·Filed 1997·Granted Jun 15, 1999·497 cites·13 claims
- 0398US5972192APulse electroplating copper or copper alloysADVANCED MICRO DEVICES INC·Filed 1997·Granted Oct 26, 1999·381 cites·16 claims
- 0498US5891513AElectroless CU deposition on a barrier layer by CU contact displacement for ULSI applicationsCORNELL RES FOUNDATION INC·Filed 1996·Granted Apr 6, 1999·582 cites·25 claims
- 0598US5674787ASelective electroless copper deposited interconnect plugs for ULSI applicationsSEMATECH INC·Filed 1996·Granted Oct 7, 1997·838 cites·32 claims
- 0697US6077412ARotating anode for a wafer processing chamberCUTEK RESEARCH INC·Filed 1998·Granted Jun 20, 2000·192 cites·22 claims
- 0797US5830805AElectroless deposition equipment or apparatus and method of performing electroless depositionCORNELL RES FOUNDATION INC·Filed 1996·Granted Nov 3, 1998·358 cites·15 claims
- 0897US5824599AProtected encapsulation of catalytic layer for electroless copper interconnectCORNELL RES FOUNDATION INC·Filed 1996·Granted Oct 20, 1998·561 cites·22 claims
- 0997US5695810AUse of cobalt tungsten phosphide as a barrier material for copper metallizationCORNELL RES FOUNDATION INC·Filed 1996·Granted Dec 9, 1997·833 cites·21 claims
- 1096US6017820AIntegrated vacuum and plating cluster systemCUTEK RESEARCH INC·Filed 1998·Granted Jan 25, 2000·282 cites·18 claims
- 1196US6017437AProcess chamber and method for depositing and/or removing material on a substrateCUTEK RESEARCH INC·Filed 1997·Granted Jan 25, 2000·178 cites·30 claims
- 1295US5856705ASealed semiconductor chip and process for fabricating sealed semiconductor chipINTEL CORP·Filed 1996·Granted Jan 5, 1999·157 cites·14 claims
- 1394US3934057AHigh sensitivity positive resist layers and mask formation processIBM·Filed 1973·Granted Jan 20, 1976·53 cites·17 claims
- 1493US5169680AElectroless deposition for IC fabricationINTEL CORP·Filed 1992·Granted Dec 8, 1992·192 cites·50 claims
- 1591US5300461AProcess for fabricating sealed semiconductor chip using silicon nitride passivation filmINTEL CORP·Filed 1993·Granted Apr 5, 1994·101 cites·11 claims
- 1689US6794288B1Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activationBLUE29 CORP·Filed 2003·Granted Sep 21, 2004·56 cites·27 claims
- 1789US4885262AChemical modification of spin-on glass for improved performance in IC fabricationINTEL CORP·Filed 1989·Granted Dec 5, 1989·133 cites·10 claims
- 1888US6902605B2Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copperBLUE29 LLC·Filed 2003·Granted Jun 7, 2005·53 cites·34 claims
- 1988US6179982B1Introducing and reclaiming liquid in a wafer processing chamberCUTEK RES INC·Filed 1998·Granted Jan 30, 2001·62 cites·19 claims
- 2088US5742094ASealed semiconductor chipINTEL CORP·Filed 1994·Granted Apr 21, 1998·79 cites·12 claims
- 2186US6911067B2Solution composition and method for electroless deposition of coatings free of alkali metalsBLUE29 LLC·Filed 2003·Granted Jun 28, 2005·30 cites·43 claims
- 2285US6187152B1Multiple station processing chamber and method for depositing and/or removing material on a substrateCUTEK RES INC·Filed 1998·Granted Feb 13, 2001·67 cites·22 claims
- 2384US6153521AMetallized interconnection structure and method of making the sameADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 28, 2000·62 cites·14 claims
- 2483US6271591B1Copper-aluminum metallizationADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 7, 2001·54 cites·7 claims
- 2579US6365025B1Method for depositing and/or removing material on a substrateCUTEK RES INC·Filed 2000·Granted Apr 2, 2002·20 cites·9 claims
- 2679US5997712ACopper replenishment technique for precision copper plating systemCUTEK RESEARCH INC·Filed 1998·Granted Dec 7, 1999·41 cites·24 claims
- 2777US4700454AProcess for forming MOS transistor with buried oxide regions for insulationINTEL CORP·Filed 1985·Granted Oct 20, 1987·59 cites·12 claims
- 2873US6402592B1Electrochemical methods for polishing copper films on semiconductor substratesSTEAG CUTEK SYSTEMS INC·Filed 2001·Granted Jun 11, 2002·24 cites·39 claims
- 2967US6939403B2Spatially-arranged chemical processing stationBLUE29 LLC·Filed 2002·Granted Sep 6, 2005·10 cites·6 claims
- 3059US6022465AApparatus and method utilizing an electrode adapter for customized contact placement on a waferCUTEK RESEARCH INC·Filed 1998·Granted Feb 8, 2000·23 cites·27 claims
- 3158US4654958AProcess for forming isolated silicon regions and field-effect devices on a silicon substrateINTEL CORP·Filed 1985·Granted Apr 7, 1987·27 cites·16 claims
- 3257US6492722B1Metallized interconnection structureADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 10, 2002·6 cites·20 claims
- 3357US5183795AFully planar metalization processINTEL CORP·Filed 1991·Granted Feb 2, 1993·29 cites·13 claims
- 3449US2006076244A1Barrier enhancement process for copper interconnectsMATTSON TECH INC·Filed 2005·Application pending·0 cites
- 3547US2007051306A1Spatially-arranged chemical processing stationIVANOV IGOR C·Filed 2005·Application pending·0 cites
- 3641US2003010645A1Barrier enhancement process for copper interconnectsMATTSON TECH INC·Filed 2002·Application pending·0 cites
- 3734US6183611B1Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrateCUTEK RES INC·Filed 1998·Granted Feb 6, 2001·4 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Chiu H. Ting files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →