Inventor · disambiguated record
Daizo Oda
Also filed as: ODA DAIZO
44 granted patents·17 pending applications·53 citations·filing 2008–2023
96Inventor score
Files withNIPPON MICROMETAL CORP44NIPPON STEEL CHEMICAL & MAT CO LTD11TERASHIMA SHINICHI2UNO TOMOHIRO2NIPPON MICROMETAL COPORATION1
Top patents by PatentIndex Score
61 records- 0189US10137534B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Nov 27, 2018·5 cites·8 claims
- 0289US9887172B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Feb 6, 2018·6 cites·9 claims
- 0389US9773748B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Sep 26, 2017·5 cites·7 claims
- 0488US11721660B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted Aug 8, 2023·1 cites·13 claims
- 0587US11929343B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted Mar 12, 2024·1 cites·13 claims
- 0687US11612966B2Ag alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2020·Granted Mar 28, 2023·2 cites·8 claims
- 0786US12090578B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Sep 17, 2024·2 cites·2 claims
- 0886US10381320B2Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmiumNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Aug 13, 2019·6 cites·18 claims
- 0985US10610976B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Apr 7, 2020·1 cites·22 claims
- 1085US8742258B2Bonding wire for semiconductorTERASHIMA SHINICHI·Filed 2010·Granted Jun 3, 2014·9 cites·15 claims
- 1184US11373934B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Jun 28, 2022·4 cites·13 claims
- 1275US12300658B2Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted May 13, 2025·0 cites·3 claims
- 1372US9543266B2Bonding wire for semiconductor device use and method of production of sameNIPPON MICROMETAL CORP·Filed 2015·Granted Jan 10, 2017·2 cites·5 claims
- 1471US10737356B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2016·Granted Aug 11, 2020·1 cites·9 claims
- 1571US10414002B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2016·Granted Sep 17, 2019·1 cites·10 claims
- 1669US12412864B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·7 claims
- 1769US2023387066A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2023·Application pending·0 cites
- 1868US2024290745A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2023·Application pending·0 cites
- 1968US2023335528A1Bonding wire for semiconductor devicesNIPPON MICROMETAL COPORATION·Filed 2023·Application pending·0 cites
- 2066US10468370B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Nov 5, 2019·1 cites·7 claims
- 2166US9059003B2Power semiconductor device, method of manufacturing the device and bonding wireNIPPON MICROMETAL CORP·Filed 2013·Granted Jun 16, 2015·2 cites·24 claims
- 2264US10840208B2Bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Nov 17, 2020·1 cites·12 claims
- 2364US10672733B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
- 2463US2024297142A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2562US9812421B2Bonding wire for semiconductor devicesNIPPON STEEL & SUMIKIN MAT CO·Filed 2014·Granted Nov 7, 2017·1 cites·9 claims
- 2661US9427830B2Copper alloy bonding wire for semiconductorUNO TOMOHIRO·Filed 2010·Granted Aug 30, 2016·1 cites·8 claims
- 2761US8815019B2Bonding wire for semiconductorUNO TOMOHIRO·Filed 2010·Granted Aug 26, 2014·1 cites·21 claims
- 2860US10497663B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Granted Dec 3, 2019·0 cites·21 claims
- 2959US12290883B2Bonding wireNIPPON MICROMETAL CORP·Filed 2023·Granted May 6, 2025·0 cites·16 claims
- 3058US12166006B2Bonding wire for semiconductor devicesNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·9 claims
- 3158US2020013748A1Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Application pending·0 cites
- 3257US12334467B2Copper bonding wireNIPPON MICROMETAL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·7 claims
- 3357US2025372565A1Bonding wire for semiconductor devicesNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2023·Application pending·0 cites
- 3455US12388044B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Aug 12, 2025·0 cites·4 claims
- 3555US12132025B2Bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·4 claims
- 3655US10985130B2Cu alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·8 claims
- 3755US10121758B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Nov 6, 2018·0 cites·9 claims
- 3854US12463172B2AG alloy bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2021·Granted Nov 4, 2025·0 cites·8 claims
- 3954US12325901B2AI wiring materialNIPPON MICROMETAL CORP·Filed 2020·Granted Jun 10, 2025·0 cites·8 claims
- 4054US10236272B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Mar 19, 2019·0 cites·10 claims
- 4153US2025379177A1Al ALLOY BONDING WIRENIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2023·Application pending·0 cites
- 4252US2024290744A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 4351US11342299B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2016·Granted May 24, 2022·0 cites·8 claims
- 4451US10991672B2Cu alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2018·Granted Apr 27, 2021·0 cites·6 claims
- 4551US10790259B2Cu alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·8 claims
- 4651US2024290743A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 4751US2020312808A1Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2017·Application pending·0 cites
- 4850US10950571B2Bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2018·Granted Mar 16, 2021·0 cites·4 claims
- 4950US8097960B2Semiconductor mounting bonding wireTERASHIMA SHINICHI·Filed 2008·Granted Jan 17, 2012·0 cites·17 claims
- 5049US12463171B2Copper bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2020·Granted Nov 4, 2025·0 cites·5 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →