Inventor · disambiguated record
Drew W. Delaney
Also filed as: DELANEY DREW · DELANEY DREW W
14 granted patents·4 pending applications·122 citations·filing 2002–2015
91Inventor score
Top patents by PatentIndex Score
18 records- 0196US8618652B2Forming functionalized carrier structures with coreless packagesNALLA RAVI K·Filed 2010·Granted Dec 31, 2013·30 cites·15 claims
- 0296US8319318B2Forming metal filled die back-side film for electromagnetic interference shielding with coreless packagesNALLA RAVI K·Filed 2010·Granted Nov 27, 2012·42 cites·16 claims
- 0393US8848380B2Bumpless build-up layer package warpage reductionMALATKAR PRAMOD·Filed 2011·Granted Sep 30, 2014·17 cites·20 claims
- 0489US8786066B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Jul 22, 2014·11 cites·36 claims
- 0579US9627227B2Bumpless build-up layer package warpage reductionINTEL CORP·Filed 2014·Granted Apr 18, 2017·4 cites·15 claims
- 0675US10375832B2Method of forming an interference shield on a substrateINTEL CORP·Filed 2015·Granted Aug 6, 2019·2 cites·12 claims
- 0770US9232686B2Thin film based electromagnetic interference shielding with BBUL/coreless packagesINTEL CORP·Filed 2014·Granted Jan 5, 2016·2 cites·12 claims
- 0869US8507324B2Forming metal filled die back-side film for electromagnetic interference shielding with coreless packagesNALLA RAVI K·Filed 2012·Granted Aug 13, 2013·2 cites·13 claims
- 0961US8987065B2Forming functionalized carrier structures with coreless packagesINTEL CORP·Filed 2013·Granted Mar 24, 2015·1 cites·5 claims
- 1061US7141452B2Methods of reducing bleed-out of underfill and adhesive materialsINTEL CORP·Filed 2003·Granted Nov 28, 2006·11 cites·14 claims
- 1153US9406618B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameINTEL CORP·Filed 2014·Granted Aug 2, 2016·0 cites·32 claims
- 1253US8896116B2Microelectronic package and method of manufacturing sameNALLA RAVI K·Filed 2013·Granted Nov 25, 2014·0 cites·13 claims
- 1352US9257380B2Forming functionalized carrier structures with coreless packagesINTEL CORP·Filed 2015·Granted Feb 9, 2016·0 cites·18 claims
- 1450US2014327149A1Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2014·Application pending·0 cites
- 1548US9159649B2Microelectronic package and stacked microelectronic assembly and computing system containing sameMALATKAR PRAMOD·Filed 2011·Granted Oct 13, 2015·0 cites·15 claims
- 1645US2011316140A1Microelectronic package and method of manufacturing sameNALLA RAVI K·Filed 2010·Application pending·0 cites
- 1745US2015340312A1Microelectronic package and stacked microelectronic assembly and computing system containing sameINTEL Coreporation·Filed 2015·Application pending·0 cites
- 1837US2003183416A1Method of electrically coupling an electronic component to a substrateFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →