Inventor · disambiguated record
Hans Artmann
Also filed as: ARTMANN HANS
41 granted patents·7 pending applications·410 citations·filing 1999–2021
97Inventor score
Top patents by PatentIndex Score
48 records- 0190US6555443B1Method for production of a thin film and a thin-film solar cell, in particular, on a carrier substrateBOSCH GMBH ROBERT·Filed 1999·Granted Apr 29, 2003·120 cites·26 claims
- 0286US7479232B2Method for producing a semiconductor component and a semiconductor component produced according to the methodBOSCH GMBH ROBERT·Filed 2005·Granted Jan 20, 2009·8 cites·29 claims
- 0385US6803637B2Micromechanical component with different doping types so that one type is anodized into porous siliconBOSCH GMBH ROBERT·Filed 2001·Granted Oct 12, 2004·37 cites·17 claims
- 0485US6726815B1Electrochemical etching cellBOSCH GMBH ROBERT·Filed 2000·Granted Apr 27, 2004·21 cites·28 claims
- 0584US6936902B2Sensor with at least one micromechanical structure and method for production thereofBOSCH GMBH ROBERT·Filed 2000·Granted Aug 30, 2005·34 cites·9 claims
- 0681US8123963B2Method for producing a semiconductor component and a semiconductor component produced according to the methodBENZEL HUBERT·Filed 2008·Granted Feb 28, 2012·5 cites·23 claims
- 0781US7037438B2Method for production of a semiconductor component and a semiconductor component produced by said methodBOSCH GMBH ROBERT·Filed 2001·Granted May 2, 2006·18 cites·24 claims
- 0879US11933689B2MEMS capacitive sensor including improved contact separationBOSCH GMBH ROBERT·Filed 2020·Granted Mar 19, 2024·1 cites·15 claims
- 0978US7273764B2Sensor with at least one micromechanical structure, and method for producing itBOSCH GMBH ROBERT·Filed 2005·Granted Sep 25, 2007·6 cites·30 claims
- 1077US8076739B2Micromechanical component and method for producing a micromechanical componentSCHMOLLNGRUBER PETER·Filed 2008·Granted Dec 13, 2011·11 cites·7 claims
- 1176US10020169B2Etching device and etching methodBOSCH GMBH ROBERT·Filed 2017·Granted Jul 10, 2018·1 cites·11 claims
- 1275US8299549B2Layer structure for electrical contacting of semiconductor componentsREINMUTH JOCHEN·Filed 2010·Granted Oct 30, 2012·4 cites·5 claims
- 1375US8196474B2Pressure sensorREINMUTH JOCHEN·Filed 2010·Granted Jun 12, 2012·4 cites·5 claims
- 1475US7495302B2Micromechanical component having a diaphragmBOSCH GMBH ROBERT·Filed 2005·Granted Feb 24, 2009·8 cites·8 claims
- 1574US11912563B2Micromechanical component and method for manufacturing a micromechanical componentBOSCH GMBH ROBERT·Filed 2019·Granted Feb 27, 2024·1 cites·10 claims
- 1672US7045382B2Method for producing micromechanic sensors and sensors produced by said methodBOSCH GMBH ROBERT·Filed 2002·Granted May 16, 2006·17 cites·9 claims
- 1771US6906392B2Micromechanical componentPARAGON AG·Filed 2002·Granted Jun 14, 2005·17 cites·16 claims
- 1870US7992443B2Sensor element for capacitive differential-pressure sensingBOSCH GMBH ROBERT·Filed 2009·Granted Aug 9, 2011·6 cites·10 claims
- 1969US11976996B2Micromechanical component for a capacitive pressure sensor deviceBOSCH GMBH ROBERT·Filed 2019·Granted May 7, 2024·1 cites·5 claims
- 2068US6677249B2Method for manufacturing breakaway layers for detaching deposited layer systemsBOSCH GMBH ROBERT·Filed 1999·Granted Jan 13, 2004·34 cites·12 claims
- 2160US6759265B2Method for producing diaphragm sensor unit and diaphragm sensor unitBOSCH GMBH ROBERT·Filed 2002·Granted Jul 6, 2004·7 cites·6 claims
- 2258USRE44995EMethod for producing a semiconductor component and a semiconductor component produced according to the methodBOSCH GMBH ROBERT·Filed 2013·Granted Jul 8, 2014·0 cites·23 claims
- 2358US7709933B2Structural element having a porous region at least regionally provided with a cover layer and its use as well as method for setting the thermal conductivity of a porous regionBOSCH GMBH ROBERT·Filed 2003·Granted May 4, 2010·4 cites·6 claims
- 2456US7057248B2Semiconductor component, particularly a micromechanical pressure sensorBOSCH GMBH ROBERT·Filed 2002·Granted Jun 6, 2006·8 cites·32 claims
- 2555US7833405B2Micromechanical component and corresponding production methodBOSCH GMBH ROBERT·Filed 2001·Granted Nov 16, 2010·7 cites·10 claims
- 2653US7306966B2Method for producing a semiconductor component and a semiconductor component, especially a membrane sensorBOSCH GMBH ROBERT·Filed 2002·Granted Dec 11, 2007·6 cites·7 claims
- 2753US6521313B1Method for producing a diaphragm sensor unit and diaphragm sensor unitBOSCH GMBH ROBERT·Filed 2001·Granted Feb 18, 2003·7 cites·6 claims
- 2851US6506621B1Method for producing a diaphragm sensor array and diaphragm sensor arrayBOSCH GMBH ROBERT·Filed 2001·Granted Jan 14, 2003·6 cites·12 claims
- 2950US7679154B2Method for manufacturing a semiconductor component and a semiconductor component, in particular a diaphragm sensorBOSCH GMBH ROBERT·Filed 2007·Granted Mar 16, 2010·0 cites·6 claims
- 3050US7276277B2Micromechanical component, in particular a sensor element, having a stabilized membrane and a method of producing such a componentBOSCH GMBH ROBERT·Filed 2001·Granted Oct 2, 2007·4 cites·14 claims
- 3149US11851324B2Method for sealing entries in a MEMS elementBOSCH GMBH ROBERT·Filed 2019·Granted Dec 26, 2023·0 cites·17 claims
- 3249US10914937B2Pivot apparatus for a micromirror, and illumination apparatus having a pivot apparatus for a micromirrorBOSCH GMBH ROBERT·Filed 2016·Granted Feb 9, 2021·0 cites·13 claims
- 3349US2021403315A1Sensor device and method for producing a sensor deviceBOSCH GMBH ROBERT·Filed 2019·Application pending·0 cites
- 3448US11940345B2Micromechanical component for a capacitive pressure sensor deviceBOSCH GMBH ROBERT·Filed 2019·Granted Mar 26, 2024·0 cites·25 claims
- 3548US9372341B2Comb drive including a pivotable mirror elementBOSCH GMBH ROBERT·Filed 2014·Granted Jun 21, 2016·0 cites·9 claims
- 3647US9309111B2Micromechanical component and method for producing a micromechanical componentBOSCH GMBH ROBERT·Filed 2014·Granted Apr 12, 2016·0 cites·12 claims
- 3747US7040160B2Flow sensorBOSCH GMBH ROBERT·Filed 2001·Granted May 9, 2006·4 cites·19 claims
- 3846US2023065179A1Method for producing a microelectronic deviceBOSCH GMBH ROBERT·Filed 2021·Application pending·0 cites
- 3945US10427937B2Method for producing a multilayer MEMS component, and corresponding multilayer MEMS componentBOSCH GMBH ROBERT·Filed 2016·Granted Oct 1, 2019·0 cites·14 claims
- 4045US6972447B2Semiconductor component having a first earlier structure differing from a second earlier structureBOSCH GMBH ROBERT·Filed 2003·Granted Dec 6, 2005·3 cites·6 claims
- 4141US2003127699A1Method for producing a diaphragm sensor unit and diaphragm sensor unitFiled 2002·Application pending·0 cites
- 4237US7419581B2Method for producing optically transparent regions in a silicon substrateBOSCH GMBH ROBERT·Filed 2002·Granted Sep 2, 2008·0 cites·15 claims
- 4336US2010025786A1Method for Manufacturing a Diaphragm on a Semiconductor Substrate and Micromechanical Component Having Such a DiaphragmSCHMOLLNGRUBER PETER·Filed 2006·Application pending·0 cites
- 4435US8481427B2Method for manufacturing a micromechanical component, and micromechanical componentARTMANN HANS·Filed 2006·Granted Jul 9, 2013·0 cites·7 claims
- 4535US2003183109A1Integrated detonating or firing element, and use thereofFiled 2002·Application pending·0 cites
- 4634US9932223B2Method for manufacturing microelectromechanical structures in a layer sequence and a corresponding electronic component having a microelectromechanical structureBOSCH GMBH ROBERT·Filed 2016·Granted Apr 3, 2018·0 cites·13 claims
- 4734US2004084398A1Module, especially a wafer moduleFiled 2001·Application pending·0 cites
- 4833US2014151885A1Semiconductor device and method for manufacturing a semiconductor deviceBENZEL TIMO·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →