Inventor · disambiguated record
Hosadurga Shobha
Also filed as: SHOBHA HOSADURGA · SHOBHA HOSADURGA K
110 granted patents·36 pending applications·614 citations·filing 1999–2024
99Inventor score
Top patents by PatentIndex Score
146 records- 0198US10020254B1Integration of super via structure in BEOLIBM·Filed 2017·Granted Jul 10, 2018·39 cites·8 claims
- 0298US10020255B1Integration of super via structure in BEOLIBM·Filed 2017·Granted Jul 10, 2018·36 cites·12 claims
- 0398US9947579B2Copper interconnect structure with manganese oxide barrier layerIBM·Filed 2017·Granted Apr 17, 2018·15 cites·8 claims
- 0498US9685406B1Selective and non-selective barrier layer wet removalIBM·Filed 2016·Granted Jun 20, 2017·34 cites·14 claims
- 0598US9601371B2Interconnect structure with barrier layerIBM·Filed 2015·Granted Mar 21, 2017·16 cites·15 claims
- 0697US12218003B2Selective ILD deposition for fully aligned via with airgapADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Granted Feb 4, 2025·2 cites·20 claims
- 0797US11756887B2Backside floating metal for increased capacitanceIBM·Filed 2021·Granted Sep 12, 2023·5 cites·22 claims
- 0897US11152257B2Barrier-less prefilled via formationIBM·Filed 2020·Granted Oct 19, 2021·5 cites·18 claims
- 0997US10529622B1Void-free metallic interconnect structures with self-formed diffusion barrier layersIBM·Filed 2018·Granted Jan 7, 2020·16 cites·20 claims
- 1097US10224241B2Copper interconnect structure with manganese oxide barrier layerIBM·Filed 2017·Granted Mar 5, 2019·9 cites·20 claims
- 1197US9966337B1Fully aligned via with integrated air gapsIBM·Filed 2017·Granted May 8, 2018·22 cites·12 claims
- 1297US9947581B2Method of forming a copper based interconnect structureIBM·Filed 2016·Granted Apr 17, 2018·10 cites·17 claims
- 1397US9455182B2Interconnect structure with capping layer and barrier layerIBM·Filed 2014·Granted Sep 27, 2016·18 cites·20 claims
- 1496US10325806B2Copper interconnect structure with manganese oxide barrier layerIBM·Filed 2017·Granted Jun 18, 2019·9 cites·11 claims
- 1595US8927442B1SiCOH hardmask with graded transition layersIBM·Filed 2013·Granted Jan 6, 2015·33 cites·10 claims
- 1694US10157789B2Via formation using sidewall image transfer process to define lateral dimensionIBM·Filed 2016·Granted Dec 18, 2018·12 cites·11 claims
- 1794US6288210B1High refractive index thermoplastic polyphosphonatesVIRGINIA TECH INTELL PROP·Filed 1999·Granted Sep 11, 2001·58 cites·12 claims
- 1893US10593591B2Interconnect structureTESSERA INC·Filed 2018·Granted Mar 17, 2020·4 cites·16 claims
- 1993US10002831B2Selective and non-selective barrier layer wet removalIBM·Filed 2017·Granted Jun 19, 2018·7 cites·15 claims
- 2093US9806023B1Selective and non-selective barrier layer wet removalIBM·Filed 2017·Granted Oct 31, 2017·8 cites·20 claims
- 2193US9490168B1Via formation using sidewall image transfer process to define lateral dimensionIBM·Filed 2015·Granted Nov 8, 2016·10 cites·9 claims
- 2292US8981466B2Multilayer dielectric structures for semiconductor nano-devicesIBM·Filed 2013·Granted Mar 17, 2015·13 cites·15 claims
- 2392US7737052B2Advanced multilayer dielectric cap with improved mechanical and electrical propertiesIBM·Filed 2008·Granted Jun 15, 2010·21 cites·10 claims
- 2491US10964588B2Selective ILD deposition for fully aligned via with airgapTESSERA INC·Filed 2020·Granted Mar 30, 2021·2 cites·17 claims
- 2591US9899317B1Nitridization for semiconductor structuresIBM·Filed 2016·Granted Feb 20, 2018·8 cites·18 claims
- 2691US7067083B2High refractive index thermoplastic polyphosphonatesVIRGINIA TECH INTELL PROP·Filed 2005·Granted Jun 27, 2006·8 cites·1 claims
- 2790US8120179B2Air gap interconnect structures and methods for forming the sameCHANDA KAUSHIK·Filed 2009·Granted Feb 21, 2012·19 cites·18 claims
- 2889US12424549B2Skip-level TSV with hybrid dielectric scheme for backside power deliveryIBM·Filed 2022·Granted Sep 23, 2025·1 cites·15 claims
- 2989US11056426B2Metallization interconnect structure formationIBM·Filed 2019·Granted Jul 6, 2021·6 cites·20 claims
- 3089US8299365B2Self-aligned composite M-MOx/dielectric cap for Cu interconnect structuresNGUYEN SON VAN·Filed 2010·Granted Oct 30, 2012·10 cites·19 claims
- 3189US7375178B2High refractive index thermoplastic polyphosphonatesESSILOR INT·Filed 2006·Granted May 20, 2008·6 cites·5 claims
- 3289US2025140606A1Selective ild deposition for fully aligned via with airgapADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2024·Application pending·0 cites
- 3388US9312224B1Interconnect structure containing a porous low k interconnect dielectric/dielectric capIBM·Filed 2014·Granted Apr 12, 2016·9 cites·21 claims
- 3488US8980715B2Multilayer dielectric structures for semiconductor nano-devicesIBM·Filed 2013·Granted Mar 17, 2015·8 cites·19 claims
- 3588US8383507B2Method for fabricating air gap interconnect structuresIBM·Filed 2012·Granted Feb 26, 2013·8 cites·19 claims
- 3687US10763160B1Semiconductor device with selective insulator for improved capacitanceIBM·Filed 2019·Granted Sep 1, 2020·5 cites·17 claims
- 3787US10529662B2Method and structure to construct cylindrical interconnects to reduce resistanceIBM·Filed 2018·Granted Jan 7, 2020·3 cites·10 claims
- 3887US9558934B2Hydrogen-free silicon-based deposited dielectric films for nano device fabricationIBM·Filed 2015·Granted Jan 31, 2017·3 cites·7 claims
- 3987US8492289B2Barrier layer formation for metal interconnects through enhanced impurity diffusionEDELSTEIN DANIEL C·Filed 2010·Granted Jul 23, 2013·9 cites·4 claims
- 4087US7750479B2Treatment of plasma damaged layer for critical dimension retention, pore sealing and repairIBM·Filed 2007·Granted Jul 6, 2010·11 cites·19 claims
- 4186US9209017B2Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursorsIBM·Filed 2014·Granted Dec 8, 2015·5 cites·20 claims
- 4286US8822137B2Self-aligned fine pitch permanent on-chip interconnect structures and method of fabricationLIN QINGHUANG·Filed 2011·Granted Sep 2, 2014·7 cites·17 claims
- 4386US2024006237A1Method of forming copper interconnect structure with manganese barrier layerADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Application pending·0 cites
- 4485US7781332B2Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacerIBM·Filed 2007·Granted Aug 24, 2010·11 cites·14 claims
- 4583US10643890B2Ultrathin multilayer metal alloy liner for nano Cu interconnectsIBM·Filed 2016·Granted May 5, 2020·3 cites·9 claims
- 4682US9735005B1Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devicesIBM·Filed 2016·Granted Aug 15, 2017·2 cites·9 claims
- 4782US9502288B2Method of forming an interconnect structureNGUYEN SON VAN·Filed 2012·Granted Nov 22, 2016·5 cites·10 claims
- 4881US9040411B2Advanced low k cap film formation process for nano electronic devicesIBM·Filed 2014·Granted May 26, 2015·4 cites·19 claims
- 4981US8129843B2Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacerARNOLD JOHN C·Filed 2010·Granted Mar 6, 2012·5 cites·5 claims
- 5080US11804405B2Method of forming copper interconnect structure with manganese barrier layerTESSERA LLC·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
Showing the top 50 of 146 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hosadurga Shobha files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →