Inventor · disambiguated record
Ismail Emesh
Also filed as: EMESH ISMAIL · EMESH ISMAIL T
39 granted patents·19 pending applications·1,983 citations·filing 1992–2020
98Inventor score
Files withAPPLIED MATERIALS INC26NORTHERN TELECOM LTD8SPEEDFAM IPEC CORP7EMESH ISMAIL5NOVELLUS SYSTEMS INC4
Top patents by PatentIndex Score
58 records- 0197US6736952B2Method and apparatus for electrochemical planarization of a workpieceSPEEDFAM IPEC CORP·Filed 2001·Granted May 18, 2004·155 cites·74 claims
- 0297US5789303AMethod of adding on chip capacitors to an integrated circuitNORTHERN TELECOM LTD·Filed 1996·Granted Aug 4, 1998·265 cites·19 claims
- 0395US7449098B1Method for planar electroplatingNOVELLUS SYSTEMS INC·Filed 2003·Granted Nov 11, 2008·110 cites·39 claims
- 0495US5452178AStructure and method of making a capacitor for an intergrated circuitNORTHERN TELECOM LTD·Filed 1994·Granted Sep 19, 1995·177 cites·10 claims
- 0595US5354712AMethod for forming interconnect structures for integrated circuitsNORTHERN TELECOM LTD·Filed 1992·Granted Oct 11, 1994·463 cites·21 claims
- 0694US5563762ACapacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuitNORTHERN TELECOM LTD·Filed 1994·Granted Oct 8, 1996·160 cites·23 claims
- 0791US6337032B1Sol-gel precursor and method for formation of ferroelectric materials for integrated circuitsNORTEL NETWORKS LTD·Filed 2000·Granted Jan 8, 2002·55 cites·16 claims
- 0891US5330931AMethod of making a capacitor for an integrated circuitNORTHERN TELECOM LTD·Filed 1993·Granted Jul 19, 1994·95 cites·14 claims
- 0989US9425092B2Methods for producing interconnects in semiconductor devicesAPPLIED MATERIALS INC·Filed 2014·Granted Aug 23, 2016·8 cites·18 claims
- 1089US6802955B2Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surfaceSPEEDFAM IPEC CORP·Filed 2002·Granted Oct 12, 2004·43 cites·31 claims
- 1189US6066581ASol-gel precursor and method for formation of ferroelectric materials for integrated circuitsNORTEL NETWORKS CORP·Filed 1996·Granted May 23, 2000·91 cites·22 claims
- 1288US5407698ADeposition of tungstenNORTHERN TELECOM LTD·Filed 1992·Granted Apr 18, 1995·100 cites·8 claims
- 1387US6572755B2Method and apparatus for electrochemically depositing a material onto a workpiece surfaceSPEEDFAM IPEC CORP·Filed 2001·Granted Jun 3, 2003·33 cites·79 claims
- 1487US5358889AFormation of ruthenium oxide for integrated circuitsNORTHERN TELECOM LTD·Filed 1993·Granted Oct 25, 1994·68 cites·12 claims
- 1585US9805976B2Co or Ni and Cu integration for small and large features in integrated circuitsAPPLIED MATERIALS INC·Filed 2016·Granted Oct 31, 2017·3 cites·21 claims
- 1685US9768060B2Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECDAPPLIED MATERIALS INC·Filed 2014·Granted Sep 19, 2017·6 cites·18 claims
- 1782US7033464B2Apparatus for electrochemically depositing a material onto a workpiece surfaceSPEEDFAM IPEC CORP·Filed 2002·Granted Apr 25, 2006·23 cites·18 claims
- 1882US5728603AMethod of forming a crystalline ferroelectric dielectric material for an integrated circuitNORTHERN TELECOM LTD·Filed 1996·Granted Mar 17, 1998·81 cites·12 claims
- 1977US10062607B2Methods for producing interconnects in semiconductor devicesAPPLIED MATERIALS INC·Filed 2016·Granted Aug 28, 2018·2 cites·14 claims
- 2077US8357599B2Seed layer passivationAPPLIED MATERIALS INC·Filed 2011·Granted Jan 22, 2013·5 cites·21 claims
- 2175US9496145B2Electrochemical plating methodsAPPLIED MATERIALS INC·Filed 2014·Granted Nov 15, 2016·3 cites·12 claims
- 2272US9245798B2Semiconductor reflow processing for high aspect ratio fillAPPLIED MATERIALS INC·Filed 2013·Granted Jan 26, 2016·4 cites·16 claims
- 2369US7297239B2Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surfaceNOVELLUS SYSTEMS INC·Filed 2004·Granted Nov 20, 2007·11 cites·25 claims
- 2466US10487410B2Enhanced plating bath and additive chemistries for cobalt platingAPPLIED MATERIALS INC·Filed 2017·Granted Nov 26, 2019·1 cites·19 claims
- 2565US6974525B2Method and apparatus for electrochemical planarization of a workpieceSPEEDFAM IPEC CORP·Filed 2004·Granted Dec 13, 2005·7 cites·10 claims
- 2663US7625814B2Filling deep features with conductors in semiconductor manufacturingASM NUTOOL INC·Filed 2007·Granted Dec 1, 2009·1 cites·38 claims
- 2763US7201828B2Planar plating apparatusNOVELLUS SYSTEMS INC·Filed 2004·Granted Apr 10, 2007·8 cites·38 claims
- 2858US8268135B2Method and apparatus for electrochemical planarization of a workpieceEMESH ISMAIL·Filed 2005·Granted Sep 18, 2012·1 cites·10 claims
- 2958US2020219720A1Apparatus and methods for asymmetric deposition of metal on high aspect ratio nanostructuresAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3057US11118278B2Enhanced plating bath and additive chemistries for cobalt platingAPPLIED MATERIALS INC·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 3156US10622252B2Co or Ni and Cu integration for small and large features in integrated circuitsAPPLIED MATERIALS INC·Filed 2017·Granted Apr 14, 2020·0 cites·22 claims
- 3256US2009065365A1Method and apparatus for copper electroplatingASM NUTOOL INC·Filed 2007·Application pending·0 cites
- 3355US10636655B2Methods for asymmetric deposition of metal on high aspect ratio nanostructuresAPPLIED MATERIALS INC·Filed 2018·Granted Apr 28, 2020·0 cites·14 claims
- 3454US11024537B2Methods and apparatus for hybrid feature metallizationAPPLIED MATERIALS INC·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 3551US10665503B2Semiconductor reflow processing for feature fillAPPLIED MATERIALS INC·Filed 2013·Granted May 26, 2020·0 cites·18 claims
- 3650US9704717B2Electrochemical plating methodsAPPLIED MATERIALS INC·Filed 2015·Granted Jul 11, 2017·0 cites·20 claims
- 3749US2008237048A1Method and apparatus for selective electrofilling of through-wafer viasEMESH ISMAIL·Filed 2007·Application pending·0 cites
- 3848US6818604B2System and method for cleaning workpiecesSPEEDFAM IPEC CORP·Filed 2001·Granted Nov 16, 2004·3 cites·31 claims
- 3947US6849547B2Apparatus and process for polishing a workpieceSPEEDFAM IPEC CORP·Filed 2001·Granted Feb 1, 2005·1 cites·56 claims
- 4046US2020251340A1Methods and apparatus for filling a feature disposed in a substrateAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4146US2016126134A1Systems and methods for removing contamination from seed layer surfaceAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 4245US2015325477A1Super conformal metal plating from complexed electrolytesAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 4345US2015348836A1Methods for depositing metal on a reactive metal filmAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 4444US10950500B2Methods and apparatus for filling a feature disposed in a substrateAPPLIED MATERIALS INC·Filed 2018·Granted Mar 16, 2021·0 cites·15 claims
- 4543US2014103534A1Electrochemical deposition on a workpiece having high sheet resistanceAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 4643US2006003566A1Methods and apparatuses for semiconductor fabrication utilizing through-wafer interconnectsEMESH ISMAIL·Filed 2004·Application pending·0 cites
- 4742US2006255016A1Method for polishing copper on a workpiece surfaceNOVELLUS SYSTEMS INC·Filed 2006·Application pending·0 cites
- 4841US2015348826A1Method for electrochemically depositing metal on a reactive metal filmAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 4940US2013127057A1Seed layer passivationSCHIEFFER CALLIE A·Filed 2013·Application pending·0 cites
- 5039US2019198392A1Methods of etching a tungsten layerAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →