Inventor · disambiguated record
Jae-Dong Lee
Also filed as: LEE JAE D · LEE JAE-DONG
39 granted patents·17 pending applications·394 citations·filing 1995–2025
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD25HYUNDAI ELECTRONICS IND4DRTECH CORP2HANWHA SOLUTIONS CORP2INHA IND PARTNERSHIP INST2
Top patents by PatentIndex Score
56 records- 0191US8043970B2Slurry compositions for selectively polishing silicon nitride relative to silicon oxide, methods of polishing a silicon nitride layer and methods of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 25, 2011·15 cites·9 claims
- 0287US5565084AElectropolishing methods for etching substrate in self alignmentQNIX COMPUTER CO LTD·Filed 1995·Granted Oct 15, 1996·70 cites·26 claims
- 0386US6517412B2Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 11, 2003·40 cites·25 claims
- 0483US6540935B2Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 1, 2003·30 cites·25 claims
- 0582US7338352B2Slurry delivery system, chemical mechanical polishing apparatus and method for using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 4, 2008·9 cites·6 claims
- 0682US6887137B2Chemical mechanical polishing slurry and chemical mechanical polishing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 3, 2005·28 cites·53 claims
- 0782US6863592B2Chemical/mechanical polishing slurry and chemical mechanical polishing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 8, 2005·26 cites·39 claims
- 0881US7442646B2Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurrySAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 28, 2008·6 cites·19 claims
- 0980US6914001B2Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 5, 2005·20 cites·17 claims
- 1079US6762401B2CMOS image sensor capable of increasing fill factor and driving method thereofHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Jul 13, 2004·18 cites·11 claims
- 1177US6380568B1CMOS image sensor and method for fabricating the sameHYUNDAI ELECTRONICS IND·Filed 2000·Granted Apr 30, 2002·19 cites·6 claims
- 1273US6410901B1Image sensor having blooming effect preventing circuitryHYUNDAI ELECTRONICS IND·Filed 2000·Granted Jun 25, 2002·11 cites·14 claims
- 1371US8110499B2Method of forming a contact structureKANG DAE-HYUK·Filed 2009·Granted Feb 7, 2012·5 cites·15 claims
- 1469US6855267B2Chemical mechanical polishing slurrySAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 15, 2005·10 cites·6 claims
- 1568US8241988B2Photo key and method of fabricating semiconductor device using the photo keyKWON BYOUNG-HO·Filed 2011·Granted Aug 14, 2012·2 cites·20 claims
- 1666US7634487B2System and method for index reorganization using partial index transfer in spatial data warehouseINHA IND PARTNERSHIP INST·Filed 2006·Granted Dec 15, 2009·6 cites·8 claims
- 1765US7440977B2Recovery method using extendible hashing-based cluster logs in shared-nothing spatial database clusterINHA IND PARTNERSHIP INST·Filed 2005·Granted Oct 21, 2008·10 cites·13 claims
- 1864US2025337454A1Method and apparatus for controlling communication signal of photovoltaic power generation systemHANWHA SOLUTIONS CORP·Filed 2025·Application pending·0 cites
- 1963US6514862B2Wafer polishing slurry and chemical mechanical polishing (CMP) method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 4, 2003·8 cites·21 claims
- 2062US8084344B2Methods of fabricating a semiconductor deviceLEE JONG-WON·Filed 2008·Granted Dec 27, 2011·2 cites·20 claims
- 2161US6215142B1Analog semiconductor device and method of fabricating the sameHYUNDAI ELECTRONICS IND·Filed 1998·Granted Apr 10, 2001·21 cites·10 claims
- 2260US8018078B2Photo key and method of fabricating semiconductor device using the photo keySAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 13, 2011·1 cites·9 claims
- 2359US2025264549A1Method and apparatus for fault detecting of inverterHANWHA SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 2458US11132389B2Method and apparatus with latent keyword generationRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2016·Granted Sep 28, 2021·1 cites·24 claims
- 2558US9833487B2Composition for preventing and treating arthritic diseasesPARK DONG-SUK·Filed 2009·Granted Dec 5, 2017·1 cites·3 claims
- 2658US6858452B2Method for isolating self-aligned contact padsSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 22, 2005·6 cites·16 claims
- 2758US6518115B2CMOS image sensor and method for fabricating the sameHYUNDAI ELECTRONICS IND·Filed 2001·Granted Feb 11, 2003·6 cites·7 claims
- 2855USD873648SMonitor bracketDOOSAN INFRACORE CO LTD·Filed 2017·Granted Jan 28, 2020·6 cites·1 claims
- 2955US7718535B2Slurry compositions and CMP methods using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 18, 2010·1 cites·20 claims
- 3055US7244649B2Method of manufacturing a capacitor having improved capacitance and method of manufacturing a semiconductor device including the capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 17, 2007·5 cites·22 claims
- 3153US6875997B2Test patterns and methods of controlling CMP process using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 5, 2005·3 cites·5 claims
- 3253US2009068839A1Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurryKIM SUNG-JUN·Filed 2008·Application pending·0 cites
- 3352US12097789B2Construction machineHD HYUNDAI INFRACORE CO LTD·Filed 2022·Granted Sep 24, 2024·0 cites·11 claims
- 3451US7144815B2Chemical mechanical polishing slurrySAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 5, 2006·2 cites·5 claims
- 3551US2008277767A1Semiconductor device including a planarized surface and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3650US8048808B2Slurry compositions for polishing metal, methods of polishing a metal object and methods of forming a metal wiring using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 1, 2011·0 cites·11 claims
- 3750US2008233216A1Composition Comprising the Extract of Siegesbeckiae Herba For Preventing and Treating Arthritis and the Use ThereofIND ACADEMIC COOP·Filed 2006·Application pending·0 cites
- 3849US7294516B2Test patterns and methods of controlling CMP process using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 13, 2007·0 cites·11 claims
- 3949US7247256B2CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP methodSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 24, 2007·2 cites·8 claims
- 4049US7144301B2Method and system for planarizing integrated circuit materialSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 5, 2006·2 cites·8 claims
- 4148US2010127398A1Wiring structure of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 4247US2012007018A1Slurry compositions for selectively polishing silicon nitride relative to silicon oxide, methods of polishing a silicon nitride layer and methods of manufacturing a semiconductor device using the sameLEE JONG-WON·Filed 2011·Application pending·0 cites
- 4346US8929955B2Touch information communication terminal, touch screen information providing apparatus and touch information communication method thereofJUNG SOON-CHUL·Filed 2009·Granted Jan 6, 2015·1 cites·22 claims
- 4442US2006143993A1Slurry compositions for use in chemical mechanical polishing and method of manufacturing semiconductor device using the sameKIM SUNG-JUN·Filed 2006·Application pending·0 cites
- 4541US7498263B2Method of planarizing an inter-metal insulation filmSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 3, 2009·0 cites·18 claims
- 4641US2006175297A1Metallization method for a semiconductor device and post-CMP cleaning solution for the sameYUN SE-RAH·Filed 2006·Application pending·0 cites
- 4740US7413959B2Semiconductor device including a planarized surface and method thereofSAMSUNG ELECTRONICS CO L T D·Filed 2003·Granted Aug 19, 2008·1 cites·13 claims
- 4839US2005014330A1Method of planarizing an interlayer dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 4939US2007145012A1Slurry and method for chemical-mechanical polishingPARK JOON-SANG·Filed 2006·Application pending·0 cites
- 5039US2021106291A1Radiography apparatus and radiography method using sameDRTECH CORP·Filed 2018·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →