Inventor · disambiguated record
Jeffrey Farber
Also filed as: FARBER JEFFREY · FARBER JEFFREY J
15 granted patents·7 pending applications·143 citations·filing 1999–2014
92Inventor score
Top patents by PatentIndex Score
22 records- 0192US7811424B1Reducing mechanical resonance and improved distribution of fluids in small volume processing of semiconductor materialsLAM RES CORP·Filed 2005·Granted Oct 12, 2010·11 cites·20 claims
- 0283US6187684B1Methods for cleaning substrate surfaces after etch operationsLAM RES CORP·Filed 1999·Granted Feb 13, 2001·71 cites·22 claims
- 0382US7913703B1Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrateLAM RES CORP·Filed 2006·Granted Mar 29, 2011·6 cites·14 claims
- 0481US7735177B1Brush core assemblyLAM RES CORP·Filed 2006·Granted Jun 15, 2010·11 cites·18 claims
- 0579US8671959B2Method and apparatus for cleaning a substrate using non-newtonian fluidsDE LARIOS JOHN M·Filed 2011·Granted Mar 18, 2014·4 cites·7 claims
- 0678US8043441B2Method and apparatus for cleaning a substrate using non-Newtonian fluidsLAM RES CORP·Filed 2005·Granted Oct 25, 2011·4 cites·7 claims
- 0769US6645052B2Method and apparatus for controlling CMP pad surface finishLAM RES CORP·Filed 2001·Granted Nov 11, 2003·12 cites·26 claims
- 0861US2014332037A1Controls of Ambient Environment During Wafer Drying Using Proximity HeadLAM RES CORP·Filed 2014·Application pending·0 cites
- 0958US2009320884A1Controls of ambient environment during wafer drying using proximity headKOROLIK MIKHAIL·Filed 2009·Application pending·0 cites
- 1057US8726919B2Method and system for uniformly applying a multi-phase cleaning solution to a substrateLAM RES CORP·Filed 2013·Granted May 20, 2014·0 cites·17 claims
- 1157US2014202503A1Method and system for uniformly applying a multi-phase cleaning solution to a substrateLAM RES CORP·Filed 2014·Application pending·0 cites
- 1255US8535451B2Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquidsDE LARIOS JOHN M·Filed 2008·Granted Sep 17, 2013·0 cites·20 claims
- 1355US2014158167A1Method and apparatus for cleaning a substrate using non-newtonian fluidsLAM RES CORP·Filed 2014·Application pending·0 cites
- 1454US6939207B2Method and apparatus for controlling CMP pad surface finishLAM RES CORP·Filed 2003·Granted Sep 6, 2005·5 cites·17 claims
- 1551US6405399B1Method and system of cleaning a wafer after chemical mechanical polishing or plasma processingLAM RES CORP·Filed 1999·Granted Jun 18, 2002·17 cites·17 claims
- 1649US7614411B2Controls of ambient environment during wafer drying using proximity headLAM RES CORP·Filed 2004·Granted Nov 10, 2009·2 cites·15 claims
- 1749US7452408B2System and method for producing bubble free liquids for nanometer scale semiconductor processingLAM RES CORP·Filed 2005·Granted Nov 18, 2008·0 cites·23 claims
- 1846US8567421B2Method and system for uniformly applying a multi-phase cleaning solution to a substrateFARBER JEFFREY J·Filed 2011·Granted Oct 29, 2013·0 cites·14 claims
- 1946US2010294742A1Modifications to Surface Topography of Proximity HeadMAGNI ENRICO·Filed 2009·Application pending·0 cites
- 2045US7568490B2Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquidsLAM RES CORP·Filed 2003·Granted Aug 4, 2009·0 cites·21 claims
- 2141US2012129344A1Process and apparatus for removal of contaminating material from substratesTREICHEL HELMUTH·Filed 2010·Application pending·0 cites
- 2229US2002031914A1Post-plasma processing wafer cleaning method and systemFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →