Inventor · disambiguated record
Ji Hwang Kim
Also filed as: KIM JI HWANG
44 granted patents·11 pending applications·332 citations·filing 2012–2024
97Inventor score
Top patents by PatentIndex Score
55 records- 0197US9997446B2Semiconductor package including a rewiring layer with an embedded chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 12, 2018·24 cites·19 claims
- 0297US9425111B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 23, 2016·28 cites·20 claims
- 0397US8802495B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 12, 2014·87 cites·21 claims
- 0496US10026724B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 17, 2018·23 cites·20 claims
- 0594US11018173B2Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 25, 2021·5 cites·4 claims
- 0694US10224272B2Semiconductor package including a rewiring layer with an embedded chipSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 5, 2019·10 cites·20 claims
- 0794US10199319B2Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 5, 2019·11 cites·12 claims
- 0894US9449930B2Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the sameKIM TAE-HYEONG·Filed 2015·Granted Sep 20, 2016·47 cites·17 claims
- 0993US12062605B2Semiconductor package including an interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·1 cites·20 claims
- 1093US12057366B2Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 6, 2024·1 cites·20 claims
- 1193US11637140B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·2 cites·20 claims
- 1293US11600545B2Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·19 claims
- 1392US10361170B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 23, 2019·11 cites·18 claims
- 1491US10141286B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 27, 2018·8 cites·19 claims
- 1591US9515057B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 6, 2016·13 cites·18 claims
- 1691US8963336B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameJUNG DEOK-YOUNG·Filed 2014·Granted Feb 24, 2015·12 cites·20 claims
- 1787US10971535B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 6, 2021·4 cites·19 claims
- 1886US11069592B2Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 20, 2021·3 cites·20 claims
- 1986US9064941B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameJUNG DEOK-YOUNG·Filed 2015·Granted Jun 23, 2015·5 cites·11 claims
- 2086US8912048B2Method of fabricating semiconductor device including a substrate attached to a carrierSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 16, 2014·8 cites·15 claims
- 2185US10685921B2Semiconductor chip module including a channel for controlling warpage and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 16, 2020·4 cites·20 claims
- 2282US11367679B2Semiconductor package including an in interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·1 cites·20 claims
- 2381US2024363472A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2479US11152416B2Semiconductor package including a redistribution lineSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·18 claims
- 2579US9099541B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 4, 2015·4 cites·8 claims
- 2678US10750112B2Substrate structures for image sensor modules and image sensor modules including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·2 cites·18 claims
- 2777US12113087B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 2876US10192855B2Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting lineSEO SUNKYOUNG·Filed 2015·Granted Jan 29, 2019·4 cites·20 claims
- 2975US11658107B2Semiconductor package including an interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·0 cites·15 claims
- 3071US10651224B2Semiconductor package including a redistribution lineSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·1 cites·19 claims
- 3171US9893018B2Alignment mark for semiconductor deviceKO YEONG KWON·Filed 2015·Granted Feb 13, 2018·3 cites·18 claims
- 3269US10978431B2Semiconductor package with connection substrate and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 13, 2021·1 cites·18 claims
- 3368US11569201B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 3468US9159651B2Semiconductor packages having TSV and adhesive layerSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 13, 2015·2 cites·16 claims
- 3565US12300665B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 13, 2025·0 cites·21 claims
- 3664US9728424B2Method of fabricating a packaged integrated circuit with through-silicon via an inner substrateSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 8, 2017·1 cites·20 claims
- 3761US9202767B2Semiconductor device and method of manufacturing the sameKIM JI HWANG·Filed 2012·Granted Dec 1, 2015·2 cites·15 claims
- 3859US11876083B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 3957US2024178114A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4057US2024243053A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4157US2024332270A1Semiconductor package with decoupling capacitor and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4256US2025046691A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4355US11227855B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·14 claims
- 4454US11908806B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 4554US11158603B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·18 claims
- 4654US2023076184A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4752US11728230B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 4851US10923428B2Semiconductor package having second pad electrically connected through the interposer chip to the first padSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
- 4951US2019259733A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 5046US2015228591A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →