Inventor · disambiguated record
Jianxin Lei
Also filed as: LEI JIANXIN
29 granted patents·18 pending applications·34 citations·filing 2005–2024
93Inventor score
Top patents by PatentIndex Score
47 records- 0194US9583349B2Lowering tungsten resistivity by replacing titanium nitride with titanium silicon nitrideAPPLIED MATERIALS INC·Filed 2014·Granted Feb 28, 2017·17 cites·11 claims
- 0289US11898236B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2021·Granted Feb 13, 2024·1 cites·17 claims
- 0387US10043670B2Systems and methods for low resistivity physical vapor deposition of a tungsten filmAPPLIED MATERIALS INC·Filed 2015·Granted Aug 7, 2018·4 cites·11 claims
- 0484US11114320B2Processing system and method of forming a contactAPPLIED MATERIALS INC·Filed 2019·Granted Sep 7, 2021·3 cites·19 claims
- 0580US10903112B2Methods and apparatus for smoothing dynamic random access memory bit line metalAPPLIED MATERIALS INC·Filed 2019·Granted Jan 26, 2021·2 cites·20 claims
- 0678US2022310363A1Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0777US10388532B2Methods and devices using PVD rutheniumAPPLIED MATERIALS INC·Filed 2017·Granted Aug 20, 2019·2 cites·20 claims
- 0876US11661651B2Methods and apparatus for passivating a targetAPPLIED MATERIALS INC·Filed 2022·Granted May 30, 2023·0 cites·10 claims
- 0976US10163696B2Selective cobalt removal for bottom up gapfillAPPLIED MATERIALS INC·Filed 2016·Granted Dec 25, 2018·2 cites·18 claims
- 1074US11626410B2Silicon-containing layer for bit line resistance reductionAPPLIED MATERIALS INC·Filed 2022·Granted Apr 11, 2023·0 cites·16 claims
- 1174US10734235B2Systems and methods for low resistivity physical vapor deposition of a tungsten filmAPPLIED MATERIALS INC·Filed 2018·Granted Aug 4, 2020·1 cites·7 claims
- 1274US2022310364A1Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1372US11655534B2Apparatus for reducing tungsten resistivityAPPLIED MATERIALS INC·Filed 2022·Granted May 23, 2023·0 cites·10 claims
- 1472US11447857B2Methods and apparatus for reducing tungsten resistivityAPPLIED MATERIALS INC·Filed 2020·Granted Sep 20, 2022·0 cites·14 claims
- 1571US12467127B2Molybdenum monolithic physical vapor deposition targetAPPLIED MATERIALS INC·Filed 2024·Granted Nov 11, 2025·0 cites·17 claims
- 1670US11637107B2Silicon-containing layer for bit line resistance reductionAPPLIED MATERIALS INC·Filed 2021·Granted Apr 25, 2023·0 cites·12 claims
- 1770US2021319989A1Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 1870US2024038859A1Metal cap for contact resistance reductionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1968US12338527B2Shutter disk for physical vapor deposition (PVD) chamberAPPLIED MATERIALS INC·Filed 2022·Granted Jun 24, 2025·0 cites·18 claims
- 2068US11512387B2Methods and apparatus for passivating a targetAPPLIED MATERIALS INC·Filed 2020·Granted Nov 29, 2022·0 cites·19 claims
- 2167US11489110B2Methods for treating magnesium oxide filmAPPLIED MATERIALS INC·Filed 2020·Granted Nov 1, 2022·0 cites·19 claims
- 2266US11227751B1Plasma chamber target for reducing defects in workpiece during dielectric sputteringAPPLIED MATERIALS INC·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 2365US11908696B2Methods and devices for subtractive self-alignmentAPPLIED MATERIALS INC·Filed 2022·Granted Feb 20, 2024·0 cites·10 claims
- 2463US8580094B2Magnetron design for RF/DC physical vapor depositionWANG RONGJUN·Filed 2011·Granted Nov 12, 2013·1 cites·15 claims
- 2562US11257677B2Methods and devices for subtractive self-alignmentAPPLIED MATERIALS INC·Filed 2020·Granted Feb 22, 2022·0 cites·11 claims
- 2661US7485556B2Forming metal silicide on silicon-containing features of a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Feb 3, 2009·1 cites·28 claims
- 2759US2022231137A1Metal cap for contact resistance reductionAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2858US12387978B2Ru liner above a barrier layerAPPLIED MATERIALS INC·Filed 2022·Granted Aug 12, 2025·0 cites·14 claims
- 2958US2020235104A1Cap Layer For Bit Line Resistance ReductionAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3058US2024352574A1Processing kit shieldAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3157US10770346B2Selective cobalt removal for bottom up gapfillAPPLIED MATERIALS INC·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 3256US2024093355A1Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) ChamberAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3356US2025140562A1Low resistivity metal stacks and methods of depositing the sameAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3456US2025105013A1Low resistivity metal stacks and methods of depositing the sameAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3556US2020048760A1High power impulse magnetron sputtering physical vapor deposition of tungsten films having improved bottom coverageAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3656US2024249920A1Removable mask layer to reduce overhang during re-sputter process in pvd chambersAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3755US10700072B2Cap layer for bit line resistance reductionAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·0 cites·20 claims
- 3853US2022081758A1Methods and apparatus for in-situ deposition monitoringAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3953US2024282709A1Layered Substrate with Ruthenium Layer and Method for ProducingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4051US2014001576A1Lowering tungsten resistivity by replacing titanium nitride with titanium silicon nitrideAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 4148US10304732B2Methods and apparatus for filling substrate features with cobaltAPPLIED MATERIALS INC·Filed 2017·Granted May 28, 2019·0 cites·17 claims
- 4247US9461137B1Tungsten silicide nitride films and methods of formationAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·0 cites·20 claims
- 4346US2017145553A1Pre-coated shield using in vhf-rf pvd chambersAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
- 4444US10950500B2Methods and apparatus for filling a feature disposed in a substrateAPPLIED MATERIALS INC·Filed 2018·Granted Mar 16, 2021·0 cites·15 claims
- 4541US2016168687A1Particle reduction in a deposition chamber using thermal expansion coefficient compatible coatingAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 4641US2015118833A1Method of making source/drain contacts by sputtering a doped targetAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 4731US8580630B2Methods for forming a metal gate structure on a substrateLEI JIANXIN·Filed 2011·Granted Nov 12, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →