Inventor · disambiguated record
John Robinson
Also filed as: ROBINSON JOHN · ROBINSON JOHN C · ROBINSON JOHN CHARLES
22 granted patents·2 pending applications·345 citations·filing 2003–2022
95Inventor score
Top patents by PatentIndex Score
24 records- 0196US9116442B2Feedforward/feedback litho process control of stress and overlayADEL MICHAEL·Filed 2011·Granted Aug 25, 2015·18 cites·38 claims
- 0296US6928628B2Use of overlay diagnostics for enhanced automatic process controlKLA TENCOR TECH CORP·Filed 2003·Granted Aug 9, 2005·141 cites·21 claims
- 0394US8175831B2Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafersIZIKSON PAVEL·Filed 2008·Granted May 8, 2012·42 cites·30 claims
- 0494US8111376B2Feedforward/feedback litho process control of stress and overlayADEL MICHAEL·Filed 2008·Granted Feb 7, 2012·20 cites·33 claims
- 0594US7310789B2Use of overlay diagnostics for enhanced automatic process controlKLA TENCOR TECH CORP·Filed 2006·Granted Dec 18, 2007·20 cites·33 claims
- 0693US11614480B2System and method for Z-PAT defect-guided statistical outlier detection of semiconductor reliability failuresKLA CORP·Filed 2021·Granted Mar 28, 2023·3 cites·29 claims
- 0792US7804994B2Overlay metrology and control methodKLA TENCOR TECH CORP·Filed 2003·Granted Sep 28, 2010·54 cites·16 claims
- 0890US11293970B2Advanced in-line part average testingKLA CORP·Filed 2020·Granted Apr 5, 2022·4 cites·31 claims
- 0989US9903711B2Feed forward of metrology data in a metrology systemKLA TENCOR CORP·Filed 2016·Granted Feb 27, 2018·5 cites·33 claims
- 1085US10409171B2Overlay control with non-zero offset predictionKLA TENCOR CORP·Filed 2018·Granted Sep 10, 2019·3 cites·39 claims
- 1182US8948495B2Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a waferKLA TENCOR CORP·Filed 2013·Granted Feb 3, 2015·8 cites·37 claims
- 1280US10649447B2Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafersKLA TENCOR CORP·Filed 2017·Granted May 12, 2020·2 cites·19 claims
- 1379US9620426B2Method and system for providing process tool correctables using an optimized sampling scheme with smart interpolationIZIKSON PAVEL·Filed 2011·Granted Apr 11, 2017·5 cites·21 claims
- 1478US10466596B2System and method for field-by-field overlay process control using measured and estimated field parametersKLA TENCOR CORP·Filed 2014·Granted Nov 5, 2019·4 cites·21 claims
- 1575US8804137B2Unique mark and method to determine critical dimension uniformity and registration of reticles combined with wafer overlay capabilityCHOI DONGSUB·Filed 2010·Granted Aug 12, 2014·4 cites·21 claims
- 1670US7111256B2Use of overlay diagnostics for enhanced automatic process controlKLA TENCOR TECH CORP·Filed 2003·Granted Sep 19, 2006·9 cites·52 claims
- 1766US7679069B2Method and system for optimizing alignment performance in a fleet of exposure toolsKLA TENCOR TECH CORP·Filed 2007·Granted Mar 16, 2010·2 cites·35 claims
- 1865US9651943B2Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafersIZIKSON PAVEL·Filed 2012·Granted May 16, 2017·1 cites·16 claims
- 1953US12422376B2Imaging reflectometry for inline screeningKLA CORP·Filed 2021·Granted Sep 23, 2025·0 cites·44 claims
- 2053US12332182B2System for automatic diagnostics and monitoring of semiconductor defect die screening performance through overlay of defect and electrical test dataKLA CORP·Filed 2022·Granted Jun 17, 2025·0 cites·42 claims
- 2151US11798827B2Systems and methods for semiconductor adaptive testing using inline defect part average testingKLA CORP·Filed 2021·Granted Oct 24, 2023·0 cites·25 claims
- 2251US11624775B2Systems and methods for semiconductor defect-guided burn-in and system level testsKLA CORP·Filed 2021·Granted Apr 11, 2023·0 cites·25 claims
- 2343US2014303912A1System and method for the automatic determination of critical parametric electrical test parameters for inline yield monitoringKLA TENCOR CORP·Filed 2014·Application pending·0 cites
- 2442US2022196723A1System and method for automatically identifying defect-based test coverage gaps in semiconductor devicesKLA CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →