Inventor · disambiguated record
Jongbo Shim
Also filed as: SHIM JONGBO
34 granted patents·23 pending applications·54 citations·filing 2012–2025
95Inventor score
Top patents by PatentIndex Score
57 records- 0197US9425111B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 23, 2016·28 cites·20 claims
- 0294US12388029B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·3 cites·18 claims
- 0393US12062605B2Semiconductor package including an interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·1 cites·20 claims
- 0493US12033924B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 9, 2024·2 cites·20 claims
- 0592US10361170B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 23, 2019·11 cites·18 claims
- 0689US11367688B2Semiconductor package with interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·2 cites·20 claims
- 0786US10748953B2Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 18, 2020·2 cites·20 claims
- 0882US11367679B2Semiconductor package including an in interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·1 cites·20 claims
- 0979US11152416B2Semiconductor package including a redistribution lineSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·18 claims
- 1078US12261157B2Semiconductor device having package on package structure and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 1177US2025349746A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1275US11658107B2Semiconductor package including an interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·0 cites·15 claims
- 1374US2025201784A1Semiconductor device having package on package structure and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1473US2024321701A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1571US12021036B2Semiconductor package including interposer and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 1671US10651224B2Semiconductor package including a redistribution lineSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·1 cites·19 claims
- 1769US11804477B2Semiconductor device having package on package structure and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 1869US11798889B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1969US10978431B2Semiconductor package with connection substrate and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 13, 2021·1 cites·18 claims
- 2065US12261093B2Semiconductor packages having a dam structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·19 claims
- 2164US11521934B2Semiconductor package including interposer and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 6, 2022·0 cites·19 claims
- 2262US2025246585A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2362US2025062172A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2460US2025006720A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2559US12148729B2Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·19 claims
- 2659US11876083B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 2759US11437293B2Semiconductor packages having a dam structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·19 claims
- 2859US2025253254A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2958US2024128174A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3057US2023402357A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3156US12512398B2Semiconductor package having semiconductor chip positioned in cavity of cover wiring structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·19 claims
- 3256US11948873B2Semiconductor package including a support solder ballSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 3356US10615213B2Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 7, 2020·0 cites·23 claims
- 3456US2024079250A1Semiconductor package and method of manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3556US2024429110A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3655US2023361051A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3755US2024063181A1Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3853US2024096840A1Semiconductor chip, semiconductor device, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3953US2023352411A1Semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4052US11854989B2Semiconductor package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 4152US11728230B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 4251US11710673B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 4351US10923428B2Semiconductor package having second pad electrically connected through the interposer chip to the first padSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
- 4451US2023114274A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4551US2019259733A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 4651US2023021867A1Semiconductor package including a lower substrate and an upper substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4751US2024079285A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4846US11676949B2Semiconductor packages having supporting membersSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 4946US11404382B2Semiconductor package including an embedded semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 5046US10636760B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·19 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →