Inventor · disambiguated record
M. Ziaul Karim
Also filed as: KARIM M Z · KARIM M ZIAUL
16 granted patents·8 pending applications·892 citations·filing 1999–2024
95Inventor score
Top patents by PatentIndex Score
24 records- 0196US6903031B2In-situ-etch-assisted HDP deposition using SiF4 and hydrogenAPPLIED MATERIALS INC·Filed 2003·Granted Jun 7, 2005·111 cites·26 claims
- 0296US6808748B2Hydrogen assisted HDP-CVD deposition process for aggressive gap-fill technologyAPPLIED MATERIALS INC·Filed 2003·Granted Oct 26, 2004·269 cites·21 claims
- 0393US7205240B2HDP-CVD multistep gapfill processAPPLIED MATERIALS INC·Filed 2003·Granted Apr 17, 2007·114 cites·36 claims
- 0493US6958112B2Methods and systems for high-aspect-ratio gapfill using atomic-oxygen generationAPPLIED MATERIALS INC·Filed 2003·Granted Oct 25, 2005·77 cites·11 claims
- 0593US6417092B1Low dielectric constant etch stop filmsNOVELLUS SYSTEMS INC·Filed 2000·Granted Jul 9, 2002·97 cites·11 claims
- 0692US7981472B2Methods of providing uniform gas delivery to a reactorAIXTRON INC·Filed 2009·Granted Jul 19, 2011·13 cites·15 claims
- 0791US6303518B1Methods to improve chemical vapor deposited fluorosilicate glass (FSG) film adhesion to metal barrier or etch stop/diffusion barrier layersNOVELLUS SYSTEMS INC·Filed 1999·Granted Oct 16, 2001·123 cites·31 claims
- 0886US7033945B2Gap filling with a composite layerAPPLIED MATERIALS INC·Filed 2004·Granted Apr 25, 2006·43 cites·17 claims
- 0982US11401607B2TiSiN coating methodEUGENUS INC·Filed 2017·Granted Aug 2, 2022·2 cites·20 claims
- 1082US7049211B2In-situ-etch-assisted HDP deposition using SiF4APPLIED MATERIALS INC·Filed 2005·Granted May 23, 2006·6 cites·12 claims
- 1179US7294588B2In-situ-etch-assisted HDP depositionAPPLIED MATERIALS INC·Filed 2006·Granted Nov 13, 2007·5 cites·13 claims
- 1277US11942365B2Multi-region diffusion barrier containing titanium, silicon and nitrogenEUGENUS INC·Filed 2018·Granted Mar 26, 2024·2 cites·30 claims
- 1376US6844612B1Low dielectric constant fluorine-doped silica glass film for use in integrated circuit chips and method of forming the sameNOVELLUS SYSTEMS INC·Filed 2003·Granted Jan 18, 2005·24 cites·8 claims
- 1470US2025087534A1Multi-region diffusion barrier containing titanium, silicon and nitrogenEUGENUS INC·Filed 2024·Application pending·0 cites
- 1569US2023151488A1Tisin coating methodEUGENUS INC·Filed 2022·Application pending·0 cites
- 1664US12374569B2Batch processing oven for magnetic annealYIELD ENG SYSTEMS INC·Filed 2021·Granted Jul 29, 2025·0 cites·20 claims
- 1761US2011253046A1Apparatus for providing uniform gas delivery to a reactorDALTON JEREMIE J·Filed 2011·Application pending·0 cites
- 1860US2007234956A1Method and apparatus for providing uniform gas delivery to a reactorDALTON JEREMIE J·Filed 2006·Application pending·0 cites
- 1958US7052988B1Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processingNOVELLUS SYSTEMS INC·Filed 2004·Granted May 30, 2006·5 cites·21 claims
- 2050US2007042119A1Vaporizer for atomic layer deposition systemMATTHYSSE LARRY·Filed 2006·Application pending·0 cites
- 2147US7595088B2Hydrogen assisted HDP-CVD deposition process for aggressive gap-fill technologyAPPLIED MATERIALS INC·Filed 2004·Granted Sep 29, 2009·1 cites·24 claims
- 2247US2008072821A1Small volume symmetric flow single wafer ald apparatusDALTON JEREMIC J·Filed 2007·Application pending·0 cites
- 2336US2003036280A1Low dielectric constant etch stop filmsNOVELLUS SYSTEM INC·Filed 2002·Application pending·0 cites
- 2436US2005136684A1Gap-fill techniquesAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →