Inventor · disambiguated record
Masako Kodera
Also filed as: KODERA MASAKO
37 granted patents·13 pending applications·912 citations·filing 1990–2019
98Inventor score
Top patents by PatentIndex Score
50 records- 0191US5398459AMethod and apparatus for polishing a workpieceTOSHIBA KK·Filed 1993·Granted Mar 21, 1995·74 cites·15 claims
- 0289US5445996AMethod for planarizing a semiconductor device having a amorphous layerTOSHIBA KK·Filed 1993·Granted Aug 29, 1995·87 cites·1 claims
- 0388US10328465B2Substrate processing apparatus and substrate processing methodEBARA CORP·Filed 2013·Granted Jun 25, 2019·6 cites·27 claims
- 0488US8740667B2Polishing method and polishing apparatusKODERA MASAKO·Filed 2012·Granted Jun 3, 2014·8 cites·20 claims
- 0588US5616063APolishing apparatusTOKYO SHIBAURA ELECTRIC CO·Filed 1994·Granted Apr 1, 1997·123 cites·16 claims
- 0687US5597341ASemiconductor planarizing apparatusTOSHIBA KK·Filed 1995·Granted Jan 28, 1997·60 cites·14 claims
- 0782US5860181AMethod of and apparatus for cleaning workpieceEBARA CORP·Filed 1996·Granted Jan 19, 1999·64 cites·9 claims
- 0881US5914275APolishing apparatus and method for planarizing layer on a semiconductor waferTOSHIBA KK·Filed 1997·Granted Jun 22, 1999·43 cites·24 claims
- 0981US5860847APolishing apparatusEBARA CORP·Filed 1996·Granted Jan 19, 1999·63 cites·15 claims
- 1081US5653623APolishing apparatus with improved exhaustEBARA CORP·Filed 1994·Granted Aug 5, 1997·38 cites·9 claims
- 1179US5948205APolishing apparatus and method for planarizing layer on a semiconductor waferTOSHIBA KK·Filed 1997·Granted Sep 7, 1999·41 cites·17 claims
- 1279US5695601AMethod for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the methodTOSHIBA KK·Filed 1995·Granted Dec 9, 1997·60 cites·10 claims
- 1375US6224464B1Polishing method and polisher used in the methodTOSHIBA KK·Filed 1996·Granted May 1, 2001·39 cites·19 claims
- 1475US5830041AMethod and apparatus for determining endpoint during a polishing processEBARA CORP·Filed 1996·Granted Nov 3, 1998·49 cites·10 claims
- 1574US6667238B1Polishing method and apparatusEBARA CORP·Filed 2000·Granted Dec 23, 2003·15 cites·13 claims
- 1674US6419557B2Polishing method and polisher used in the methodTOSHIBA KK·Filed 2001·Granted Jul 16, 2002·14 cites·3 claims
- 1770US10586694B2Method for fabricating semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Mar 10, 2020·1 cites·11 claims
- 1870US5846335AMethod for cleaning workpieceEBARA CORP·Filed 1997·Granted Dec 8, 1998·40 cites·39 claims
- 1969US8703004B2Method for chemical planarization and chemical planarization apparatusMATSUI YUKITERU·Filed 2012·Granted Apr 22, 2014·2 cites·20 claims
- 2069US6903015B2Method of manufacturing a semiconductor device using a wet processTOSHIBA KK·Filed 2003·Granted Jun 7, 2005·10 cites·10 claims
- 2167US10256314B2Semiconductor deviceTOSHIBA KK·Filed 2016·Granted Apr 9, 2019·1 cites·15 claims
- 2267US7727891B2Method of manufacturing a semiconductor device using a wet processTOSHIBA KK·Filed 2005·Granted Jun 1, 2010·2 cites·20 claims
- 2364US10799917B2Substrate processing apparatus and substrate processing methodEBARA CORP·Filed 2019·Granted Oct 13, 2020·0 cites·20 claims
- 2464US6992009B2Method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2002·Granted Jan 31, 2006·9 cites·14 claims
- 2562US7101259B2Polishing method and apparatusTOSHIBA KK·Filed 2003·Granted Sep 5, 2006·7 cites·15 claims
- 2654US8754433B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2012·Granted Jun 17, 2014·0 cites·8 claims
- 2753US2014187042A1Method for chemical planarization and chemical planarization apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2852US5578531AMethod for manufacturing semiconductor deviceTOSHIBA KK·Filed 1995·Granted Nov 26, 1996·18 cites·9 claims
- 2948US10692206B2Crystal analysis apparatus and crystal analysis methodTOSHIBA KK·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 3048US9196501B2Method for chemical planarization and chemical planarization apparatusKODERA MASAKO·Filed 2012·Granted Nov 24, 2015·0 cites·12 claims
- 3148US2008017220A1Apparatus for cleaning a substrate having metal interconnectsKODERA MASAKO·Filed 2007·Application pending·0 cites
- 3247US9937602B2Substrate processing methodTOSHIBA MEMORY CORP·Filed 2016·Granted Apr 10, 2018·0 cites·11 claims
- 3347US2013217228A1Method for fabricating semiconductor deviceKODERA MASAKO·Filed 2012·Application pending·0 cites
- 3447US2016035598A1Method for chemical planarization and chemical planarization apparatusTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3546US6410439B1Semiconductor polishing apparatus and method for chemical/mechanical polishing of filmsTOSHIBA KK·Filed 2000·Granted Jun 25, 2002·1 cites·3 claims
- 3645US6783658B2Electropolishing methodTOSHIBA KK·Filed 2002·Granted Aug 31, 2004·2 cites·18 claims
- 3745US2007173056A1Semiconductor device fabrication method and polishing apparatusTOSHIBA KK·Filed 2007·Application pending·0 cites
- 3844US2011294291A1Semiconductor device and method of manufacturing the sameMATSUI YUKITERU·Filed 2011·Application pending·0 cites
- 3943US5131546ASemiconductor wafer support carrierTOSHIBA KK·Filed 1990·Granted Jul 21, 1992·13 cites·4 claims
- 4043US2015290765A1Substrate processing methodTOSHIBA KK·Filed 2015·Application pending·0 cites
- 4142US2007205112A1Polishing apparatus and polishing methodKODERA MASAKO·Filed 2007·Application pending·0 cites
- 4240US5395645AMethod for forming a silicon oxide film on a silicon wafferTOSHIBA KK·Filed 1992·Granted Mar 7, 1995·9 cites·12 claims
- 4340US2004177655A1Apparatus for cleaning a substrate having metal interconnectsFiled 2004·Application pending·0 cites
- 4439US5278104ASemiconductor wafer carrier having a dust coverTOSHIBA KK·Filed 1992·Granted Jan 11, 1994·10 cites·6 claims
- 4539US2007254558A1Polishing Apparatus and Polishing MethodKODERA MASAKO·Filed 2005·Application pending·0 cites
- 4638US2013084400A1Substrate processing methodKODERA MASAKO·Filed 2012·Application pending·0 cites
- 4735US2018097096A1Semiconductor deviceTOSHIBA KK·Filed 2017·Application pending·0 cites
- 4835US2012160267A1Cleaning method and cleaning apparatusKODERA MASAKO·Filed 2011·Application pending·0 cites
- 4933US8614510B2Semiconductor device including a metal wiring with a metal capTOMIZAWA HIDEYUKI·Filed 2010·Granted Dec 24, 2013·0 cites·8 claims
- 5031US5489336AApparatus for forming a silicon oxide film on a silicon waferTOSHIBA KK·Filed 1994·Granted Feb 6, 1996·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →