Inventor · disambiguated record
Manish Ranjan
Also filed as: RANJAN MANISH
20 granted patents·4 pending applications·66 citations·filing 2007–2024
93Inventor score
Files withLAM RES CORP11ASML NETHERLANDS BV5NIENHUYS HAN-KWANG2NOVELLUS SYSTEMS INC2ASML HOLDING NV1
Top patents by PatentIndex Score
24 records- 0191US9735035B1Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensingLAM RES CORP·Filed 2016·Granted Aug 15, 2017·7 cites·15 claims
- 0291US8730448B2Lithographic apparatus and device manufacturing methodNIENHUYS HAN-KWANG·Filed 2012·Granted May 20, 2014·9 cites·19 claims
- 0390US12158706B2Lithographic apparatus and method with improved contaminant particle captureASML NETHERLANDS BV·Filed 2020·Granted Dec 3, 2024·2 cites·20 claims
- 0490US9587322B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathNOVELLUS SYSTEMS INC·Filed 2015·Granted Mar 7, 2017·6 cites·16 claims
- 0589US9028666B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathRANJAN MANISH·Filed 2012·Granted May 12, 2015·14 cites·28 claims
- 0681US10443146B2Monitoring surface oxide on seed layers during electroplatingLAM RES CORP·Filed 2017·Granted Oct 15, 2019·1 cites·14 claims
- 0779US10593586B2Systems and methods for controlling substrate approach toward a target horizontal planeLAM RES CORP·Filed 2017·Granted Mar 17, 2020·2 cites·20 claims
- 0878US2025122639A1Electrochemical deposition system including optical probesLAM RES CORP·Filed 2024·Application pending·0 cites
- 0976US8299446B2Sub-field enhanced global alignmentHAWRYLUK ANDREW M·Filed 2010·Granted Oct 30, 2012·6 cites·20 claims
- 1076US2024103386A1Apparatus and method for determining a condition associated with a pellicleASML NETHERLANDS BV·Filed 2023·Application pending·0 cites
- 1175US8301396B1Miniature ultrafine particle sensorDHANIJALA SURESH·Filed 2007·Granted Oct 30, 2012·14 cites·32 claims
- 1274US9625835B2Lithographic apparatus and device manufacturing methodASML NETHERLANDS BV·Filed 2012·Granted Apr 18, 2017·2 cites·14 claims
- 1372US10968531B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathNOVELLUS SYSTEMS INC·Filed 2017·Granted Apr 6, 2021·1 cites·17 claims
- 1472US2023245917A1Systems and Methods for Controlling Substrate Approach Toward a Target Horizontal PlaneLAM RES CORP·Filed 2023·Application pending·0 cites
- 1572US2025003908A1Systems and methods for in-situ measurement of sheet resistance on substratesLAM RES CORP·Filed 2024·Application pending·0 cites
- 1671US11208732B2Monitoring surface oxide on seed layers during electroplatingLAM RES CORP·Filed 2019·Granted Dec 28, 2021·0 cites·8 claims
- 1771US10497592B2Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensingLAM RES CORP·Filed 2017·Granted Dec 3, 2019·1 cites·18 claims
- 1867US8797504B2Lithographic apparatus and device manufacturing methodNIENHUYS HAN-KWANG·Filed 2012·Granted Aug 5, 2014·1 cites·19 claims
- 1966US11621187B2Systems and methods for controlling substrate approach toward a target horizontal planeLAM RES CORP·Filed 2020·Granted Apr 4, 2023·0 cites·20 claims
- 2061US12180607B2Electrochemical deposition system including optical probesLAM RES CORP·Filed 2020·Granted Dec 31, 2024·0 cites·19 claims
- 2161US12105039B2Systems and methods for in-situ measurement of sheet resistance on substratesLAM RES CORP·Filed 2020·Granted Oct 1, 2024·0 cites·19 claims
- 2260US11906907B2Apparatus and method for determining a condition associated with a pellicleASML NETHERLANDS BV·Filed 2018·Granted Feb 20, 2024·0 cites·20 claims
- 2354US9823590B2Lithographic apparatus and device manufacturing methodASML NETHERLANDS BV·Filed 2017·Granted Nov 21, 2017·0 cites·20 claims
- 2445US12332570B2Lithographic system provided with a deflection apparatus for changing a trajectory of particulate debrisASML HOLDING NV·Filed 2020·Granted Jun 17, 2025·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →