Inventor · disambiguated record
Michal Danek
Also filed as: DANEK MICHAL
93 granted patents·26 pending applications·5,768 citations·filing 1996–2025
99Inventor score
Files withLAM RES CORP62NOVELLUS SYSTEMS INC33APPLIED MATERIALS INC9CHANDRASHEKAR ANAND5DANEK MICHAL3
Top patents by PatentIndex Score
119 records- 0199US7186648B1Barrier first method for single damascene trench applicationsNOVELLUS SYSTEMS INC·Filed 2004·Granted Mar 6, 2007·553 cites·23 claims
- 0299US6129044AApparatus for substrate processing with improved throughput and yieldAPPLIED MATERIALS INC·Filed 1999·Granted Oct 10, 2000·578 cites·21 claims
- 0399US5846332AThermally floating pedestal collar in a chemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1996·Granted Dec 8, 1998·863 cites·22 claims
- 0498US12074029B2Molybdenum depositionLAM RES CORP·Filed 2022·Granted Aug 27, 2024·8 cites·11 claims
- 0598US11069535B2Atomic layer etch of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2020·Granted Jul 20, 2021·7 cites·19 claims
- 0698US10916434B2Feature fill with multi-stage nucleation inhibitionLAM RES CORP·Filed 2020·Granted Feb 9, 2021·9 cites·19 claims
- 0798US10103058B2Tungsten feature fillNOVELLUS SYSTEMS INC·Filed 2017·Granted Oct 16, 2018·23 cites·13 claims
- 0898US9653353B2Tungsten feature fillNOVELLUS SYSTEMS INC·Filed 2013·Granted May 16, 2017·50 cites·16 claims
- 0998US9502238B2Deposition of conformal films by atomic layer deposition and atomic layer etchLAM RES CORP·Filed 2015·Granted Nov 22, 2016·55 cites·17 claims
- 1098US9240347B2Tungsten feature fillNOVELLUS SYSTEMS INC·Filed 2014·Granted Jan 19, 2016·72 cites·20 claims
- 1198US8435894B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2012·Granted May 7, 2013·314 cites·13 claims
- 1298US8153520B1Thinning tungsten layer after through silicon via fillingCHANDRASHEKAR ANAND·Filed 2009·Granted Apr 10, 2012·218 cites·22 claims
- 1398US6764940B1Method for depositing a diffusion barrier for copper interconnect applicationsNOVELLUS SYSTEMS INC·Filed 2003·Granted Jul 20, 2004·139 cites·44 claims
- 1497US11901227B2Feature fill with nucleation inhibitionLAM RES CORP·Filed 2021·Granted Feb 13, 2024·3 cites·18 claims
- 1597US10573522B2Method for preventing line bending during metal fill processLAM RES CORP·Filed 2017·Granted Feb 25, 2020·38 cites·20 claims
- 1697US10170320B2Feature fill with multi-stage nucleation inhibitionLAM RES CORP·Filed 2016·Granted Jan 1, 2019·20 cites·19 claims
- 1797US9997405B2Feature fill with nucleation inhibitionLAM RES CORP·Filed 2015·Granted Jun 12, 2018·22 cites·19 claims
- 1897US9972504B2Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2015·Granted May 15, 2018·21 cites·19 claims
- 1997US9748137B2Method for void-free cobalt gap fillLAM RES CORP·Filed 2015·Granted Aug 29, 2017·26 cites·18 claims
- 2097US9613818B2Deposition of low fluorine tungsten by sequential CVD processLAM RES CORP·Filed 2015·Granted Apr 4, 2017·33 cites·12 claims
- 2197US9595470B2Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursorLAM RES CORP·Filed 2015·Granted Mar 14, 2017·27 cites·14 claims
- 2297US9362163B2Methods and apparatuses for atomic layer cleaning of contacts and viasLAM RES CORP·Filed 2014·Granted Jun 7, 2016·109 cites·17 claims
- 2397US9355886B2Conformal film deposition for gapfillNOVELLUS SYSTEMS INC·Filed 2013·Granted May 31, 2016·53 cites·14 claims
- 2497US9236297B2Low tempature tungsten film deposition for small critical dimension contacts and interconnectsNOVELLUS SYSTEMS INC·Filed 2013·Granted Jan 12, 2016·38 cites·17 claims
- 2597US8975184B2Methods of improving tungsten contact resistance in small critical dimension featuresCHEN FENG·Filed 2012·Granted Mar 10, 2015·38 cites·19 claims
- 2697US8835317B2Depositing tungsten into high aspect ratio featuresNOVELLUS SYSTEMS INC·Filed 2013·Granted Sep 16, 2014·33 cites·23 claims
- 2797US8623733B2Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnectsCHEN FENG·Filed 2010·Granted Jan 7, 2014·36 cites·19 claims
- 2897US8124531B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2011·Granted Feb 28, 2012·64 cites·20 claims
- 2997US6607977B1Method of depositing a diffusion barrier for copper interconnect applicationsNOVELLUS SYSTEMS INC·Filed 2001·Granted Aug 19, 2003·159 cites·73 claims
- 3096US11355345B2Method for preventing line bending during metal fill processLAM RES CORP·Filed 2019·Granted Jun 7, 2022·21 cites·14 claims
- 3196US11075115B2Tungsten feature fillNOVELLUS SYSTEMS INC·Filed 2018·Granted Jul 27, 2021·11 cites·22 claims
- 3296US10777453B2Low resistivity films containing molybdenumLAM RES CORP·Filed 2019·Granted Sep 15, 2020·18 cites·20 claims
- 3396US10580695B2Feature fill with nucleation inhibitionLAM RES CORP·Filed 2018·Granted Mar 3, 2020·13 cites·13 claims
- 3496US10580654B2Feature fill with multi-stage nucleation inhibitionLAM RES CORP·Filed 2018·Granted Mar 3, 2020·12 cites·14 claims
- 3596US10510590B2Low resistivity films containing molybdenumLAM RES CORP·Filed 2018·Granted Dec 17, 2019·26 cites·20 claims
- 3696US10256142B2Tungsten feature fill with nucleation inhibitionNOVELLUS SYSTEMS INC·Filed 2013·Granted Apr 9, 2019·25 cites·23 claims
- 3796US9978605B2Method of forming low resistivity fluorine free tungsten film without nucleationLAM RES CORP·Filed 2017·Granted May 22, 2018·23 cites·23 claims
- 3896US9953984B2Tungsten for wordline applicationsLAM RES CORP·Filed 2016·Granted Apr 24, 2018·12 cites·20 claims
- 3996US9673146B2Low temperature tungsten film deposition for small critical dimension contacts and interconnectsNOVELLUS SYSTEMS INC·Filed 2016·Granted Jun 6, 2017·12 cites·15 claims
- 4096US9034768B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2010·Granted May 19, 2015·32 cites·21 claims
- 4196US8685867B1Premetal dielectric integration processDANEK MICHAL·Filed 2011·Granted Apr 1, 2014·55 cites·26 claims
- 4296US8679972B1Method of depositing a diffusion barrier for copper interconnect applicationsNOVELLUS SYSTEMS INC·Filed 2013·Granted Mar 25, 2014·19 cites·12 claims
- 4396US8409987B2Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristicsCHANDRASHEKAR ANAND·Filed 2011·Granted Apr 2, 2013·34 cites·19 claims
- 4496US7732314B1Method for depositing a diffusion barrier for copper interconnect applicationsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jun 8, 2010·34 cites·20 claims
- 4596US6642146B1Method of depositing copper seed on semiconductor substratesNOVELLUS SYSTEMS INC·Filed 2002·Granted Nov 4, 2003·121 cites·40 claims
- 4696US5964947ARemovable pumping channel liners within a chemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1997·Granted Oct 12, 1999·96 cites·20 claims
- 4795US12362188B2Method for preventing line bending during metal fill processLAM RES CORP·Filed 2022·Granted Jul 15, 2025·2 cites·14 claims
- 4895US10731250B2Depositing ruthenium layers in interconnect metallizationLAM RES CORP·Filed 2018·Granted Aug 4, 2020·12 cites·25 claims
- 4995US9349637B2Method for void-free cobalt gap fillLAM RES CORP·Filed 2014·Granted May 24, 2016·37 cites·18 claims
- 5095US8709948B2Tungsten barrier and seed for copper filled TSVDANEK MICHAL·Filed 2010·Granted Apr 29, 2014·36 cites·25 claims
Showing the top 50 of 119 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →