Inventor · disambiguated record
Namju Cho
Also filed as: CHO NAMJU
69 granted patents·12 pending applications·1,052 citations·filing 2008–2024
99Inventor score
Files withCHI HEEJO21SAMSUNG ELECTRONICS CO LTD19STATS CHIPPAC LTD19CHO NAMJU11STATS CHIPPAC PTE LTD7
Top patents by PatentIndex Score
81 records- 0199US7928552B1Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2010·Granted Apr 19, 2011·110 cites·10 claims
- 0298US9735113B2Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSPCHI HEEJO·Filed 2010·Granted Aug 15, 2017·60 cites·6 claims
- 0398US9362161B2Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor packageSTATS CHIPPAC LTD·Filed 2014·Granted Jun 7, 2016·47 cites·23 claims
- 0498US8288209B1Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor dieCHI HEEJO·Filed 2011·Granted Oct 16, 2012·52 cites·20 claims
- 0598US8264091B2Integrated circuit packaging system with encapsulated via and method of manufacture thereofCHO NAMJU·Filed 2009·Granted Sep 11, 2012·95 cites·20 claims
- 0698US8143097B2Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMPCHI HEEJO·Filed 2009·Granted Mar 27, 2012·80 cites·20 claims
- 0798US8138014B2Method of forming thin profile WLCSP with vertical interconnect over package footprintCHI HEEJO·Filed 2010·Granted Mar 20, 2012·42 cites·20 claims
- 0897US9496152B2Carrier system with multi-tier conductive posts and method of manufacture thereofCHO NAMJU·Filed 2010·Granted Nov 15, 2016·42 cites·20 claims
- 0997US9048306B2Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMPCHI HEEJO·Filed 2012·Granted Jun 2, 2015·27 cites·8 claims
- 1097US8318539B2Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnectsCHO NAMJU·Filed 2011·Granted Nov 27, 2012·37 cites·10 claims
- 1196US9397050B2Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulantSHIN HANGIL·Filed 2009·Granted Jul 19, 2016·53 cites·17 claims
- 1296US8390108B2Integrated circuit packaging system with stacking interconnect and method of manufacture thereofCHO NAMJU·Filed 2009·Granted Mar 5, 2013·47 cites·19 claims
- 1395US10510703B2Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted Dec 17, 2019·8 cites·25 claims
- 1495US8471394B2Integrated circuit packaging system with package-on-package and method of manufacture thereofJANG KI YOUN·Filed 2011·Granted Jun 25, 2013·22 cites·9 claims
- 1595US8384227B2Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor dieSTATS CHIPPAC LTD·Filed 2010·Granted Feb 26, 2013·17 cites·25 claims
- 1695US8349658B2Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframeSTATS CHIPPAC LTD·Filed 2010·Granted Jan 8, 2013·19 cites·25 claims
- 1795US8202797B2Integrated circuit system with recessed through silicon via pads and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Jun 19, 2012·20 cites·20 claims
- 1895US7863735B1Integrated circuit packaging system with a tiered substrate package and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jan 4, 2011·38 cites·20 claims
- 1994US8716065B2Integrated circuit packaging system with encapsulation and method of manufacture thereofCHI HEEJO·Filed 2011·Granted May 6, 2014·17 cites·20 claims
- 2093US11735530B2Semiconductor device and method of integrating RF antenna interposer with semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Aug 22, 2023·2 cites·21 claims
- 2192US11297666B2Electronic device and method for forming Wi-Fi direct group thereofSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·3 cites·18 claims
- 2292US9269595B2Semiconductor device with thin profile WLCSP with vertical interconnect over package footprintCHI HEEJO·Filed 2012·Granted Feb 23, 2016·11 cites·24 claims
- 2392US8035235B2Integrated circuit packaging system with package-on-package and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Oct 11, 2011·21 cites·17 claims
- 2491US9691707B2Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor packageSTATS CHIPPAC LTD·Filed 2016·Granted Jun 27, 2017·5 cites·24 claims
- 2591US8421203B2Integrated circuit packaging system with foldable substrate and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Apr 16, 2013·13 cites·11 claims
- 2689US9748157B1Integrated circuit packaging system with joint assembly and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2013·Granted Aug 29, 2017·10 cites·20 claims
- 2789US9064859B2Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframeSTATS CHIPPAC LTD·Filed 2012·Granted Jun 23, 2015·8 cites·26 claims
- 2889US8455300B2Integrated circuit package system with embedded die superstructure and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Jun 4, 2013·12 cites·14 claims
- 2988US8018034B2Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structureSTATS CHIPPAC LTD·Filed 2009·Granted Sep 13, 2011·13 cites·21 claims
- 3087US9263332B2Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMPSTATS CHIPPAC LTD·Filed 2013·Granted Feb 16, 2016·6 cites·28 claims
- 3187US8318541B2Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor dieSHIN HANGIL·Filed 2010·Granted Nov 27, 2012·8 cites·19 claims
- 3286US9966335B2Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor dieSTATS CHIPPAC LTD·Filed 2015·Granted May 8, 2018·4 cites·9 claims
- 3386US8476111B2Integrated circuit packaging system with intra substrate die and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Jul 2, 2013·8 cites·10 claims
- 3485US10674555B2Electronic device and method for forming Wi-Fi direct group thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 2, 2020·4 cites·18 claims
- 3584US9558965B2Semiconductor device with thin profile WLCSP with vertical interconnect over package footprintCHI HEEJO·Filed 2012·Granted Jan 31, 2017·5 cites·19 claims
- 3683US9299650B1Integrated circuit packaging system with single metal layer interposer and method of manufacture thereofCHI HEEJO·Filed 2013·Granted Mar 29, 2016·6 cites·20 claims
- 3782US11765245B2Electronic device and method for performing service discovery in electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 19, 2023·1 cites·20 claims
- 3881US8749040B2Integrated circuit packaging system with package-on-package and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Jun 10, 2014·9 cites·9 claims
- 3981US8541872B2Integrated circuit package system with package stacking and method of manufacture thereofCHO NAMJU·Filed 2010·Granted Sep 24, 2013·6 cites·20 claims
- 4080US9842808B2Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor dieSTATS CHIPPAC LTD·Filed 2012·Granted Dec 12, 2017·4 cites·25 claims
- 4180US9055391B2Method and apparatus for discovering device in wireless communication networkSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 9, 2015·5 cites·19 claims
- 4280US8564125B2Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Oct 22, 2013·5 cites·18 claims
- 4380US8492888B2Integrated circuit packaging system with stiffener and method of manufacture thereofCHI HEEJO·Filed 2011·Granted Jul 23, 2013·5 cites·20 claims
- 4479US8587129B2Integrated circuit packaging system with through silicon via base and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Nov 19, 2013·8 cites·20 claims
- 4579US8350368B2Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structureSTATS CHIPPAC LTD·Filed 2011·Granted Jan 8, 2013·4 cites·27 claims
- 4679US8314486B2Integrated circuit packaging system with shield and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Nov 20, 2012·5 cites·20 claims
- 4778US8932907B2Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor dieSTATS CHIPPAC LTD·Filed 2012·Granted Jan 13, 2015·3 cites·21 claims
- 4877US8389329B2Integrated circuit packaging system with package stacking and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Mar 5, 2013·4 cites·20 claims
- 4976US8624370B2Integrated circuit packaging system with an interposer and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Jan 7, 2014·6 cites·20 claims
- 5075US12100663B2Semiconductor device and method of integrating RF antenna interposer with semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2023·Granted Sep 24, 2024·0 cites·25 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →