Inventor · disambiguated record
Ping Huang
Also filed as: HUANG PING · HUANG PING-WEI
31 granted patents·3 pending applications·415 citations·filing 2004–2023
96Inventor score
Files withALPHA & OMEGA SEMICONDUCTOR10UNITED MICROELECTRONICS CORP7XUE YAN XUN6HO YUEH-SE3GONG YUPING2
Top patents by PatentIndex Score
34 records- 0197US9847247B2Method for filling gaps of semiconductor device and semiconductor device formed by the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 19, 2017·284 cites·13 claims
- 0295US9793174B1FinFET device on silicon-on-insulator and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·22 cites·17 claims
- 0394US8642385B2Wafer level package structure and the fabrication method thereofXUE YAN XUN·Filed 2011·Granted Feb 4, 2014·22 cites·29 claims
- 0492US8778735B1Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2013·Granted Jul 15, 2014·14 cites·10 claims
- 0590US8564110B2Power device with bottom source electrodeXUE YAN XUN·Filed 2012·Granted Oct 22, 2013·12 cites·16 claims
- 0688US9685319B2Method for filling gaps of semiconductor device and semiconductor device formed by the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 20, 2017·5 cites·7 claims
- 0786US8642397B1Semiconductor wafer level package (WLP) and method of manufacture thereofGONG YUPING·Filed 2012·Granted Feb 4, 2014·9 cites·20 claims
- 0885US10038106B2Termination structure for gallium nitride Schottky diodeALPHA & OMEGA SEMICONDUCTOR·Filed 2017·Granted Jul 31, 2018·2 cites·10 claims
- 0985US8563361B2Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2012·Granted Oct 22, 2013·8 cites·8 claims
- 1083US8486803B2Wafer level packaging method of encapsulating the bottom and side of a semiconductor chipHUANG PING·Filed 2011·Granted Jul 16, 2013·8 cites·7 claims
- 1182US9406661B2Protection circuit including vertical gallium nitride schottky diode and PN junction diodeALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Aug 2, 2016·2 cites·6 claims
- 1281US8987878B2Substrateless power device packagesFENG TAO·Filed 2010·Granted Mar 24, 2015·5 cites·7 claims
- 1376US8772144B2Vertical gallium nitride Schottky diodeZHU TINGGANG·Filed 2011·Granted Jul 8, 2014·2 cites·9 claims
- 1474US9196534B2Method for preparing semiconductor devices applied in flip chip technologyALPHA & OMEGA SEMICONDUCTOR·Filed 2013·Granted Nov 24, 2015·4 cites·16 claims
- 1570US8785296B2Packaging method with backside wafer dicingXUE YAN XUN·Filed 2012·Granted Jul 22, 2014·2 cites·20 claims
- 1669US11862727B2Method for fabricating fin structure for fin field effect transistorUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·8 claims
- 1767US10573762B2Vertical gallium nitride Schottky diodeALPHA & OMEGA SEMICONDUCTOR·Filed 2019·Granted Feb 25, 2020·0 cites·24 claims
- 1867US9391005B2Method for packaging a power device with bottom source electrodeXUE YAN XUN·Filed 2013·Granted Jul 12, 2016·2 cites·5 claims
- 1965US9136154B2Substrateless power device packagesALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Sep 15, 2015·1 cites·7 claims
- 2065US8865523B2Semiconductor package and fabrication method thereofHO YUEH-SE·Filed 2013·Granted Oct 21, 2014·1 cites·8 claims
- 2164US10333006B2Termination structure for gallium nitride Schottky diode including junction barriar diodesALPHA & OMEGA SEMICONDUCTOR·Filed 2018·Granted Jun 25, 2019·0 cites·19 claims
- 2264US8569169B2Bottom source power MOSFET with substrateless and manufacturing method thereofHO YUEH-SE·Filed 2011·Granted Oct 29, 2013·2 cites·8 claims
- 2363US12475295B2Machine-learning-based power/ground (P/G) via removalSYNOPSYS INC·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 2460US9728655B2Termination structure for gallium nitride schottky diodeALPHA & OMEGA SEMICONDUCTOR·Filed 2016·Granted Aug 8, 2017·0 cites·8 claims
- 2560US8994140B2Vertical gallium nitride Schottky diodeALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Mar 31, 2015·0 cites·7 claims
- 2658US11581438B2Fin structure for fin field effect transistor and method for fabrication the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 14, 2023·0 cites·5 claims
- 2756US2025098238A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2854US9281265B2Packaging structure of a semiconductor deviceALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Mar 8, 2016·0 cites·9 claims
- 2953US6946335B1Method of manufacturing improved double-diffused metal-oxide-semiconductor device with self-aligned channelBCD SEMICONDUCTOR MFG LTD·Filed 2004·Granted Sep 20, 2005·8 cites·5 claims
- 3051US9006901B2Thin power device and preparation method thereofGONG YUPING·Filed 2013·Granted Apr 14, 2015·0 cites·6 claims
- 3147US9854686B2Preparation method of a thin power deviceALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2015·Granted Dec 26, 2017·0 cites·6 claims
- 3247US2015340301A1Substrateless power device packagesALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Application pending·0 cites
- 3342US9136379B2Bottom source substrateless power MOSFETHO YUEH-SE·Filed 2013·Granted Sep 15, 2015·0 cites·9 claims
- 3440US2019371916A1Semiconductor structure having metal gate and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →