Inventor · disambiguated record
Pramod Malatkar
Also filed as: MALATKAR PRAMOD
31 granted patents·24 pending applications·154 citations·filing 2005–2024
96Inventor score
Top patents by PatentIndex Score
55 records- 0197US9224674B2Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packagesMALATKAR PRAMOD·Filed 2011·Granted Dec 29, 2015·38 cites·28 claims
- 0297US8304913B2Methods of forming fully embedded bumpless build-up layer packages and structures formed therebyNALLA RAVI K·Filed 2010·Granted Nov 6, 2012·46 cites·11 claims
- 0393US8848380B2Bumpless build-up layer package warpage reductionMALATKAR PRAMOD·Filed 2011·Granted Sep 30, 2014·17 cites·20 claims
- 0490US10070520B2Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrierINTEL CORP·Filed 2015·Granted Sep 4, 2018·6 cites·18 claims
- 0590US9661745B1Vacuum lamination of depth-sensing camera module PCB to stiffener using built-in vacuum channelsINTEL CORP·Filed 2015·Granted May 23, 2017·8 cites·25 claims
- 0688US8580616B2Methods of forming fully embedded bumpless build-up layer packages and structures formed therebyNALLA RAVI K·Filed 2012·Granted Nov 12, 2013·8 cites·13 claims
- 0780US8754516B2Bumpless build-up layer package with pre-stacked microelectronic devicesMALATKAR PRAMOD·Filed 2010·Granted Jun 17, 2014·4 cites·16 claims
- 0879US9831213B2Bumpless build-up layer package with pre-stacked microelectronic devicesINTEL CORP·Filed 2016·Granted Nov 28, 2017·2 cites·10 claims
- 0979US9627227B2Bumpless build-up layer package warpage reductionINTEL CORP·Filed 2014·Granted Apr 18, 2017·4 cites·15 claims
- 1079US2023420400A1Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (bbul) packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1178US9414484B2Thermal expansion compensators for controlling microelectronic package warpageMALATKAR PRAMOD·Filed 2011·Granted Aug 9, 2016·4 cites·20 claims
- 1275US7179093B2Retractable ledge socketINTEL CORP·Filed 2005·Granted Feb 20, 2007·6 cites·11 claims
- 1374US10475750B2Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integrationINTEL CORP·Filed 2016·Granted Nov 12, 2019·2 cites·28 claims
- 1473US11327050B2Mechanical failure monitoring, detection, and classification in electronic assembliesINTEL CORP·Filed 2018·Granted May 10, 2022·1 cites·25 claims
- 1572US2022068861A1Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (bbul) packagesINTEL CORP·Filed 2021·Application pending·0 cites
- 1670US10957656B2Integrated circuit packages with patterned protective materialINTEL CORP·Filed 2017·Granted Mar 23, 2021·2 cites·13 claims
- 1770US10634594B2Membrane test for mechanical testing of stretchable electronicsINTEL CORP·Filed 2016·Granted Apr 28, 2020·1 cites·23 claims
- 1869US10231338B2Methods of forming trenches in packages structures and structures formed therebyINTEL CORP·Filed 2015·Granted Mar 12, 2019·2 cites·23 claims
- 1968US10290569B2Constrained cure component attach process for improved IC package warpage controlINTEL CORP·Filed 2017·Granted May 14, 2019·2 cites·15 claims
- 2068US2024162134A1Varied ball ball-grid-array (bga) packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 2163US9818719B2Bumpless build-up layer package design with an interposerINTEL CORP·Filed 2013·Granted Nov 14, 2017·1 cites·17 claims
- 2258US2018376591A1Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrierINTEL CORP·Filed 2018·Application pending·0 cites
- 2357US9362253B2Bumpless build-up layer package with pre-stacked microelectronic devicesINTEL CORP·Filed 2014·Granted Jun 7, 2016·0 cites·14 claims
- 2456US2018047702A1Bumpless build-up layer package with a pre-stacked microelectronic devicesINTEL CORP·Filed 2017·Application pending·0 cites
- 2555US11916003B2Varied ball ball-grid-array (BGA) packagesINTEL CORP·Filed 2019·Granted Feb 27, 2024·0 cites·22 claims
- 2655US11201128B2Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packagesINTEL CORP·Filed 2015·Granted Dec 14, 2021·0 cites·3 claims
- 2755US2025105119A1Self-healing liner for through glass via reliabilityINTEL CORP·Filed 2023·Application pending·0 cites
- 2855US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2955US2025192070A1Microelectronic assemblies with post-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3054US2019304931A1Non-rectangular electronic device componentsINTEL CORP·Filed 2018·Application pending·0 cites
- 3153US10090259B2Non-rectangular electronic device componentsINTEL CORP·Filed 2015·Granted Oct 2, 2018·0 cites·10 claims
- 3253US2025062168A1Method and Stiffeners for Package Level Warpage ModulationINTEL CORP·Filed 2023·Application pending·0 cites
- 3351US11923268B2Printed heat spreader structures and methods of providing sameINTEL CORP·Filed 2020·Granted Mar 5, 2024·0 cites·19 claims
- 3451US10499461B2Thermal head with a thermal barrier for integrated circuit die processingINTEL CORP·Filed 2015·Granted Dec 3, 2019·0 cites·13 claims
- 3550US9793225B2Thermal expansion compensators for controlling microelectronic package warpageINTEL CORP·Filed 2016·Granted Oct 17, 2017·0 cites·10 claims
- 3648US9159649B2Microelectronic package and stacked microelectronic assembly and computing system containing sameMALATKAR PRAMOD·Filed 2011·Granted Oct 13, 2015·0 cites·15 claims
- 3747US11322456B2Die back side structures for warpage controlINTEL CORP·Filed 2017·Granted May 3, 2022·0 cites·20 claims
- 3845US9548284B2Reduced expansion thermal compression bonding process bond headINTEL CORP·Filed 2013·Granted Jan 17, 2017·0 cites·8 claims
- 3945US2015340312A1Microelectronic package and stacked microelectronic assembly and computing system containing sameINTEL Coreporation·Filed 2015·Application pending·0 cites
- 4045US2012001339A1Bumpless build-up layer package design with an interposerMALATKAR PRAMOD·Filed 2010·Application pending·0 cites
- 4141US2014001623A1Microelectronic structure having a microelectronic device disposed between an interposer and a substrateMALATKAR PRAMOD·Filed 2012·Application pending·0 cites
- 4240US10607909B2Systems, methods, and apparatuses for implementing a thermal solution for 3D packagingINTEL CORP·Filed 2016·Granted Mar 31, 2020·0 cites·25 claims
- 4339US2017269017A1Inflatable Bladder Based Mechanical Testing for Stretchable ElectronicsINTEL CORP·Filed 2016·Application pending·0 cites
- 4438US2007023879A1Single unit heat sink, voltage regulator, and package solution for an integrated circuitPANDEY VINAYAK·Filed 2005·Application pending·0 cites
- 4538US2018089984A1Device, system and method for detecting degradation of a flexible circuitINTEL CORP·Filed 2016·Application pending·0 cites
- 4638US2017268972A1Lateral Expansion Apparatus for Mechanical Testing of Stretchable ElectronicsINTEL CORP·Filed 2016·Application pending·0 cites
- 4737US10985080B2Electronic package that includes lamination layerINTEL CORP·Filed 2015·Granted Apr 20, 2021·0 cites·18 claims
- 4837US10278318B2Method of assembling an electronic component using a probe having a fluid thereonINTEL CORP·Filed 2015·Granted Apr 30, 2019·0 cites·16 claims
- 4937US2007004242A1Socket features for aligning and orienting componentsPANDEY VINAYAK·Filed 2005·Application pending·0 cites
- 5036US2019043776A1Dual-sided package assembly processingINTEL CORP·Filed 2016·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Pramod Malatkar files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →