Inventor · disambiguated record
Shauh-Teh Juang
Also filed as: JUANG SHAUH-TEH
17 granted patents·6 pending applications·425 citations·filing 1998–2025
94Inventor score
Top patents by PatentIndex Score
23 records- 0198US8057967B2Process window signature patterns for lithography process controlYE JUN·Filed 2010·Granted Nov 15, 2011·39 cites·11 claims
- 0297US7853920B2Method for detecting, sampling, analyzing, and correcting marginal patterns in integrated circuit manufacturingASML NETHERLANDS BV·Filed 2006·Granted Dec 14, 2010·67 cites·28 claims
- 0397US7695876B2Method for identifying and using process window signature patterns for lithography process controlBRION TECH INC·Filed 2006·Granted Apr 13, 2010·61 cites·26 claims
- 0496US8318391B2Process window signature patterns for lithography process controlYE JUN·Filed 2011·Granted Nov 27, 2012·12 cites·21 claims
- 0595US6529621B1Mechanisms for making and inspecting reticlesKLA TENCOR·Filed 1998·Granted Mar 4, 2003·135 cites·38 claims
- 0693US6748103B2Mechanisms for making and inspecting reticlesKLA TENCOR·Filed 2003·Granted Jun 8, 2004·45 cites·26 claims
- 0788US10365617B2Auto defect screening using adaptive machine learning in semiconductor device manufacturing flowDMO SYSTEMS LTD·Filed 2016·Granted Jul 30, 2019·4 cites·24 claims
- 0888US9547745B1System and method for discovering unknown problematic patterns in chip design layout for semiconductor manufacturingDMO SYSTEMS LTD·Filed 2015·Granted Jan 17, 2017·7 cites·28 claims
- 0981US8938695B1Signature analytics for improving lithographic process of manufacturing semiconductor devicesDMO SYSTEMS LTD·Filed 2014·Granted Jan 20, 2015·6 cites·14 claims
- 1074US11120182B2Methodology of incorporating wafer physical measurement with digital simulation for improving semiconductor device fabricationAPPLIED MATERIALS INC·Filed 2019·Granted Sep 14, 2021·1 cites·20 claims
- 1174US6654489B2Apparatus and methods for collecting global data during a reticle inspectionKLA TENCOR TECH CORP·Filed 2002·Granted Nov 25, 2003·17 cites·31 claims
- 1269US12259719B2Methods and mechanisms for preventing fluctuation in machine-learning model performanceAPPLIED MATERIALS INC·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 1366US12236077B2Methods and mechanisms for generating virtual knobs for model performance tuningAPPLIED MATERIALS INC·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 1464US2025189957A1Methods and mechanisms for preventing fluctuation in machine-learning model performanceAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1563US6516085B1Apparatus and methods for collecting global data during a reticle inspectionKLA TENCOR·Filed 1999·Granted Feb 4, 2003·30 cites·29 claims
- 1660US2025156058A1Methods and mechanisms for generating virtual knobs for model performance tuningAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1759US10754309B2Auto defect screening using adaptive machine learning in semiconductor device manufacturing flowAPPLIED MATERIALS INC·Filed 2019·Granted Aug 25, 2020·0 cites·12 claims
- 1858US9142014B2System and method for identifying systematic defects in wafer inspection using hierarchical grouping and filteringDMO SYSTEMS LTD·Filed 2013·Granted Sep 22, 2015·1 cites·18 claims
- 1948US2023306300A1Methods and mechanisms for measuring patterned substrate properties during substrate manufacturingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2047US2016217240A1Methodology Of Incorporating Wafer Physical Measurement With Digital Simulation For Improving Semiconductor Device FabricationDMO SYSTEMS LTD·Filed 2015·Application pending·0 cites
- 2144US2013150698A1Event-based bio-signal capturing systemOP GLOBAL HOLDINGS LTD·Filed 2012·Application pending·0 cites
- 2243US8539388B2Method and apparatus for low power semiconductor chip layout and low power semiconductor chipJOU CHEWN-PU·Filed 2010·Granted Sep 17, 2013·0 cites·20 claims
- 2340US2014214192A1Apparatus For Design-Based Manufacturing Optimization In Semiconductor FabDMO SYSTEMS LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →