Inventor · disambiguated record
Sharon Mccauley
Also filed as: MCCAULEY SHARON · MCCAULEY SHARON MARIE
8 granted patents·3 pending applications·99 citations·filing 2002–2019
87Inventor score
Files withKLA TENCOR TECH CORP6KLA TENCOR TECH CORPORATION2DISHNER MARK1MARELLA PAUL F1VOLK WILLIAM1
Top patents by PatentIndex Score
11 records- 0193US7570800B2Methods and systems for binning defects detected on a specimenKLA TENCOR TECH CORP·Filed 2005·Granted Aug 4, 2009·29 cites·45 claims
- 0282US7072786B2Inspection system setup techniquesKLA TENCOR TECH CORP·Filed 2005·Granted Jul 4, 2006·9 cites·18 claims
- 0381US7142992B1Flexible hybrid defect classification for semiconductor manufacturingKLA TENCOR TECH CORP·Filed 2004·Granted Nov 28, 2006·28 cites·19 claims
- 0479US9002497B2Methods and systems for inspection of wafers and reticles using designer intent dataVOLK WILLIAM·Filed 2004·Granted Apr 7, 2015·14 cites·39 claims
- 0575US10713771B2Methods and systems for inspection of wafers and reticles using designer intent dataKLA TENCOR TECH CORPORATION·Filed 2018·Granted Jul 14, 2020·1 cites·29 claims
- 0672US6959251B2Inspection system setup techniquesKLA TENCOR TECH CORP·Filed 2002·Granted Oct 25, 2005·16 cites·18 claims
- 0765US11348222B2Methods and systems for inspection of wafers and reticles using designer intent dataKLA TENCOR TECH CORPORATION·Filed 2019·Granted May 31, 2022·0 cites·30 claims
- 0857US2008081385A1Methods and systems for inspection of wafers and reticles using designer intent dataMARELLA PAUL F·Filed 2007·Application pending·0 cites
- 0956US2015178914A1Methods and Systems for Inspection of Wafers and Reticles Using Designer Intent DataKLA TENCOR TECH CORP·Filed 2015·Application pending·0 cites
- 1050US2009290784A1Methods and systems for binning defects detected on a specimenKLA TENCOR TECH CORP·Filed 2009·Application pending·0 cites
- 1148US9037280B2Computer-implemented methods for performing one or more defect-related functionsDISHNER MARK·Filed 2005·Granted May 19, 2015·2 cites·46 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →