Inventor · disambiguated record
Shuhei Saido
Also filed as: SAIDO SHUHEI
45 granted patents·17 pending applications·704 citations·filing 2009–2025
98Inventor score
Top patents by PatentIndex Score
62 records- 0198US8882923B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2012·Granted Nov 11, 2014·466 cites·13 claims
- 0295US11261528B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Mar 1, 2022·5 cites·5 claims
- 0394US10593572B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 17, 2020·9 cites·7 claims
- 0493US10731254B2Protective plate, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 4, 2020·3 cites·10 claims
- 0592US10453735B2Substrate processing apparatus, reaction tube, semiconductor device manufacturing method, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 22, 2019·8 cites·5 claims
- 0689US12344935B2Substrate processing apparatus, heat insulator assembly and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jul 1, 2025·2 cites·16 claims
- 0789US9028614B2Substrate processing apparatusHARA DAISUKE·Filed 2012·Granted May 12, 2015·19 cites·1 claims
- 0888USD813181SCover of seal cap for reaction chamber of semiconductorHITACHI INT ELECTRIC INC·Filed 2017·Granted Mar 20, 2018·41 cites·1 claims
- 0986US11685992B2Substrate processing apparatus, quartz reaction tube and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 27, 2023·2 cites·10 claims
- 1085USD826185SCeiling heater for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted Aug 21, 2018·24 cites·1 claims
- 1185US8851886B2Substrate processing apparatus and method of manufacturing semiconductor deviceMORITA SHINYA·Filed 2009·Granted Oct 7, 2014·11 cites·19 claims
- 1284US11219096B2Substrate processing apparatus and furnace opening assembly thereofKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jan 4, 2022·3 cites·11 claims
- 1383US11495477B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2018·Granted Nov 8, 2022·2 cites·16 claims
- 1482US9082694B2Substrate processing apparatus, method for manufacturing substrate, and method for manufacturing semiconductor deviceSAIDO SHUHEI·Filed 2012·Granted Jul 14, 2015·7 cites·16 claims
- 1580US9502237B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 22, 2016·5 cites·13 claims
- 1679US10961625B2Substrate processing apparatus, reaction tube and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 30, 2021·2 cites·20 claims
- 1779US10714362B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jul 14, 2020·2 cites·8 claims
- 1878US11384434B2Substrate processing apparatus and heater deviceKOKUSAI ELECTRIC CORP·Filed 2017·Granted Jul 12, 2022·2 cites·9 claims
- 1977USD939459SBoat for wafer processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 28, 2021·15 cites·1 claims
- 2075US11222796B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 11, 2022·1 cites·18 claims
- 2171US10615061B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2016·Granted Apr 7, 2020·1 cites·14 claims
- 2269US9062376B1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jun 23, 2015·2 cites·16 claims
- 2368USD937385SReturn nozzleKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 30, 2021·10 cites·1 claims
- 2468US2025179642A1Substrate processing apparatus and ceiling heaterKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2566US9365928B2Substrate processing apparatus, method for manufacturing semiconductor device and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jun 14, 2016·1 cites·18 claims
- 2665USD916037SCover of seal cap for reaction chamber for semiconductorKOKUSAI ELECTRIC CORP·Filed 2018·Granted Apr 13, 2021·9 cites·1 claims
- 2764USD872037SCover of seal cap for reaction chamber for semiconductor manufacturingHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 7, 2020·9 cites·1 claims
- 2864USD842823SReaction tubeHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 12, 2019·9 cites·1 claims
- 2963US11967501B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 23, 2024·0 cites·20 claims
- 3063US9222732B2Substrate processing apparatus and method of manufacturing semiconductor deviceSHIRAKO KENJI·Filed 2011·Granted Dec 29, 2015·2 cites·15 claims
- 3163US2024379483A1Heater structure, multilayer structure, processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3262USD843958SReaction tubeHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 26, 2019·8 cites·1 claims
- 3361USD855027SCover of seal cap for reaction chamber of semiconductorHITACHI INT ELECTRIC INC·Filed 2018·Granted Jul 30, 2019·8 cites·1 claims
- 3460US12241159B2Substrate processing apparatus and ceiling heaterKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 4, 2025·0 cites·17 claims
- 3560US11359285B2Substrate processing apparatus, heater and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 14, 2022·0 cites·15 claims
- 3660US2015184301A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 3759USD847301SReturn nozzleHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 30, 2019·7 cites·1 claims
- 3859US2024102165A1Gas supplier processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3957US2015187610A1Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 4055US2023307267A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 4154USD825501SAir flow controller for heater of substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted Aug 14, 2018·6 cites·1 claims
- 4253US12053805B2Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 6, 2024·0 cites·21 claims
- 4353US10597780B2Substrate processing apparatus, heater and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Mar 24, 2020·0 cites·14 claims
- 4451US2021407865A1Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 4549US2022093435A1Substrate processing apparatus, substrate retainer and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 4647US10923366B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 16, 2021·0 cites·12 claims
- 4746US2021043485A1Substrate processing apparatus and substrate holderKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 4844US2020173025A1Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 4944US2016177446A1Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording MediumHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 5043US2016201193A1Substrate Processing Apparatus, Gas Dispersion Unit, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording MediumHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →