Inventor · disambiguated record
Takafumi Kikuchi
Also filed as: KIKUCHI TAKAFUMI
35 granted patents·15 pending applications·536 citations·filing 1994–2024
97Inventor score
Files withTOSHIBA KK11RENESAS ELECTRONICS CORP9HITACHI LTD8RENESAS TECH CORP7MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6
Top patents by PatentIndex Score
50 records- 0194US7531441B2Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted May 12, 2009·21 cites·7 claims
- 0292US5690893AAnalyzer having sensor with memory deviceHITACHI LTD·Filed 1995·Granted Nov 25, 1997·141 cites·48 claims
- 0391US10373635B2Magnetic head suspension assembly having flexible wiring member with connection terminal including center hole and cover layer and disk device provided with the sameTOSHIBA KK·Filed 2017·Granted Aug 6, 2019·7 cites·20 claims
- 0489US9530441B2Suspension assembly, head suspension assembly and disk device with the sameTOSHIBA KK·Filed 2015·Granted Dec 27, 2016·7 cites·20 claims
- 0587US8278147B2Semiconductor device and manufacturing method thereofKADO YOSHIYUKI·Filed 2009·Granted Oct 2, 2012·10 cites·14 claims
- 0687US7042073B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted May 9, 2006·29 cites·8 claims
- 0787US6772955B2Memory cardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 10, 2004·67 cites·15 claims
- 0885US9064510B1Suspension assembly, head suspension assembly and disk device with the sameTOSHIBA KK·Filed 2014·Granted Jun 23, 2015·8 cites·20 claims
- 0983US9613922B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Apr 4, 2017·3 cites·8 claims
- 1083US7859095B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Dec 28, 2010·6 cites·8 claims
- 1182US6815746B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Nov 9, 2004·37 cites·1 claims
- 1279US8524534B2Semiconductor device and manufacturing method thereofKADO YOSHIYUKI·Filed 2012·Granted Sep 3, 2013·3 cites·18 claims
- 1379US6834799B2IC card with capability of having plurality of card managers installedMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 28, 2004·17 cites·6 claims
- 1476US5719646AMethod of and apparatus for decoding coded moving picture and outputting same with suppressed errorHITACHI LTD·Filed 1995·Granted Feb 17, 1998·55 cites·10 claims
- 1575US7559090B2Memory, information apparatus for access to the memory, and method for the information apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 7, 2009·8 cites·10 claims
- 1674US7176487B2Semiconductor integrated circuitRENESAS TECH CORP·Filed 2005·Granted Feb 13, 2007·6 cites·6 claims
- 1771US7897509B2Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Mar 1, 2011·3 cites·6 claims
- 1871US5623533AMobile communication end device with low power operation modeHITACHI LTD·Filed 1996·Granted Apr 22, 1997·66 cites·20 claims
- 1970US11581013B2Suspension assembly, head suspension assembly and disk device with the sameTOSHIBA KK·Filed 2022·Granted Feb 14, 2023·0 cites·3 claims
- 2070US8873202B2Head gimbal assembly in which flexure swing is suppressed and disk device including the sameTOSHIBA KK·Filed 2013·Granted Oct 28, 2014·2 cites·21 claims
- 2169US9129828B2Semiconductor device with chip having a different number of front surface electrodes and back surface electrodesRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 8, 2015·2 cites·15 claims
- 2268US8254064B2Head gimbal assembly and disk drive with the sameKIKUCHI TAKAFUMI·Filed 2011·Granted Aug 28, 2012·2 cites·10 claims
- 2367US7355272B2Semiconductor device with stacked semiconductor chips of the same typeRENESAS TECH CORP·Filed 2005·Granted Apr 8, 2008·4 cites·12 claims
- 2466US11289121B2Suspension assembly, head suspension assembly and disk device with the sameTOSHIBA KK·Filed 2021·Granted Mar 29, 2022·0 cites·8 claims
- 2565US10916264B2Suspension assembly, head suspension assembly and disk device with the sameTOSHIBA KK·Filed 2020·Granted Feb 9, 2021·0 cites·16 claims
- 2663US8059369B2Head gimbal assembly and disk drive provided with the sameKIKUCHI TAKAFUMI·Filed 2010·Granted Nov 15, 2011·1 cites·14 claims
- 2762US8605390B2Head gimbal assembly having plurality of terminals and disk drive with the sameKIKUCHI TAKAFUMI·Filed 2011·Granted Dec 10, 2013·1 cites·14 claims
- 2861US2006117017A1Information processing apparatus, devices thereof, and communication deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 2961US2006126422A1Memory device and electronic device using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 3060US8952527B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Feb 10, 2015·0 cites·19 claims
- 3159US8653655B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Feb 18, 2014·0 cites·6 claims
- 3255US10573339B2Suspension assembly, head suspension assembly and disk device with the sameTOSHIBA KK·Filed 2017·Granted Feb 25, 2020·0 cites·10 claims
- 3354US12417050B2Computer system and storage control methodHITACHI LTD·Filed 2023·Granted Sep 16, 2025·0 cites·10 claims
- 3454US9761255B2Suspension assembly, head suspension assembly and disk device with the sameTOSHIBA KK·Filed 2016·Granted Sep 12, 2017·0 cites·20 claims
- 3554US2025175381A1Redundancy control device, redundancy control method, and redundancy control programHITACHI LTD·Filed 2024·Application pending·0 cites
- 3652US2011171780A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 3751US5739860AMethod of and apparatus for decoding moving picture and outputting decoded moving picture in normal or frame-skipped reproducing operation modeHITACHI LTD·Filed 1995·Granted Apr 14, 1998·17 cites·11 claims
- 3849US7797553B2Memory devicePANASONIC CORP·Filed 2004·Granted Sep 14, 2010·1 cites·13 claims
- 3947US2006268451A1Disk deviceTOSHIBA KK·Filed 2006·Application pending·0 cites
- 4047US2008079152A1Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 4146US2006047505A1Electronic deviceTOSHIBA KK·Filed 2005·Application pending·0 cites
- 4245US2004152489A1Data processing apparatus and data processing methodFiled 2003·Application pending·0 cites
- 4345US2015340342A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 4444US2004153559A1Data processing apparatusFiled 2003·Application pending·0 cites
- 4544US2011133336A1Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor DeviceRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 4642US5966407ABus driving system and integrated circuit device using the sameHITACHI LTD·Filed 1994·Granted Oct 12, 1999·12 cites·45 claims
- 4742US2005169033A1Semiconductor moduleHITACHI LTD·Filed 2005·Application pending·0 cites
- 4842US2006206343A1Information storage device and information processing deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 4941US2007120237A1Semiconductor integrated circuitSAKAMOTO NORIAKI·Filed 2007·Application pending·0 cites
- 5038US2004130036A1Mult-chip moduleRENESAS TECH CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →