Inventor · disambiguated record
Tomohiro Hashii
Also filed as: HASHII TOMOHIRO
20 granted patents·21 pending applications·67 citations·filing 1999–2023
92Inventor score
Top patents by PatentIndex Score
41 records- 0181US7488400B2Apparatus for etching wafer by single-wafer processSUMCO CORP·Filed 2006·Granted Feb 10, 2009·7 cites·7 claims
- 0277US7601644B2Method for manufacturing silicon wafersSUMCO CORP·Filed 2005·Granted Oct 13, 2009·6 cites·4 claims
- 0376US7906438B2Single wafer etching methodSUMCO CORP·Filed 2007·Granted Mar 15, 2011·5 cites·5 claims
- 0474US7288207B2Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the sameSUMCO CORP·Filed 2006·Granted Oct 30, 2007·4 cites·8 claims
- 0567US8466071B2Method for etching single waferKOYATA SAKAE·Filed 2007·Granted Jun 18, 2013·3 cites·2 claims
- 0665US12406863B2Wafer separation apparatus and method, and method for manufacturing silicon waferSUMCO CORP·Filed 2023·Granted Sep 2, 2025·0 cites·6 claims
- 0765US8092277B2Method of grinding semiconductor wafers, grinding surface plate, and grinding deviceHASHII TOMOHIRO·Filed 2009·Granted Jan 10, 2012·4 cites·8 claims
- 0863US8759229B2Method for manufacturing epitaxial waferKOYATA SAKAE·Filed 2007·Granted Jun 24, 2014·2 cites·7 claims
- 0961US7648890B2Process for producing silicon waferSUMCO CORP·Filed 2006·Granted Jan 19, 2010·1 cites·7 claims
- 1060US6753256B2Method of manufacturing semiconductor waferSUMITOMO METAL IND·Filed 2001·Granted Jun 22, 2004·7 cites·1 claims
- 1160US6465328B1Semiconductor wafer manufacturing methodSUMITOMO METAL IND·Filed 1999·Granted Oct 15, 2002·26 cites·5 claims
- 1253US2009117749A1Etching Method of Single WaferSUMCO CORP·Filed 2008·Application pending·0 cites
- 1352US2009311460A1Semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1451US8066896B2Apparatus for etching wafer by single-wafer process and single wafer type method for etching waferKOYATA SAKAE·Filed 2007·Granted Nov 29, 2011·0 cites·4 claims
- 1548US2009311948A1Method for producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1648US2009290158A1Semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1748US2010009155A1Semiconductor wafer and production method thereofSUMCO CORP·Filed 2009·Application pending·0 cites
- 1848US2009297755A1Semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1948US2010021688A1Wafer manufacturing method and wafer obtained through the methodSUMCO CORP·Filed 2009·Application pending·0 cites
- 2048US2010006982A1Method of producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 2147US2007161247A1Etching method of single waferKOYATA SAKAE·Filed 2006·Application pending·0 cites
- 2247US2007184658A1Etching Liquid for Controlling Silicon Wafer Surface ShapeKOYATA SAKAE·Filed 2007·Application pending·0 cites
- 2346US9324558B2Machining process for semiconductor waferSUMCO CORP·Filed 2014·Granted Apr 26, 2016·0 cites·4 claims
- 2446US6969302B1Semiconductor wafer grinding methodSUMITOMO METAL IND·Filed 2000·Granted Nov 29, 2005·2 cites·2 claims
- 2546US2009289378A1Semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 2646US2009289377A1Semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 2745US9881783B2Method for processing semiconductor waferSUMCO CORP·Filed 2014·Granted Jan 30, 2018·0 cites·5 claims
- 2845US7955982B2Method for smoothing wafer surface and apparatus used thereforSUMCO CORP·Filed 2007·Granted Jun 7, 2011·0 cites·7 claims
- 2945US2009311808A1Method for producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 3045US2009311949A1Method for producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 3145US2009311863A1Method for producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 3244US7717768B2Wafer polishing apparatus and method for polishing wafersSUMCO CORP·Filed 2006·Granted May 18, 2010·0 cites·3 claims
- 3343US2009042390A1Etchant for silicon wafer surface shape control and method for manufacturing silicon wafers using the sameKOYATA SAKAE·Filed 2007·Application pending·0 cites
- 3442US11456168B2Method of lapping semiconductor wafer and semiconductor waferSUMCO CORP·Filed 2017·Granted Sep 27, 2022·0 cites·5 claims
- 3542US2006264158A1Apparatus for polishing wafer and process for polishing waferSUMCO CORP·Filed 2006·Application pending·0 cites
- 3641US9017145B2Polishing solution distribution apparatus and polishing apparatus having the sameKUROSAWA YOSHIAKI·Filed 2011·Granted Apr 28, 2015·0 cites·18 claims
- 3741US2009181546A1Single-Wafer Etching Method for Wafer and Etching Apparatus ThereofKATOH TAKEO·Filed 2008·Application pending·0 cites
- 3840US2008214094A1Method for manufacturing silicon waferKATOH TAKEO·Filed 2008·Application pending·0 cites
- 3937US2011021025A1Method for producing laser-marked semiconductor waferSUMCO CORP·Filed 2010·Application pending·0 cites
- 4032US2012315739A1Manufacturing method for semiconductor waferHASHII TOMOHIRO·Filed 2011·Application pending·0 cites
- 4131US9550264B2Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor waferHASHII TOMOHIRO·Filed 2010·Granted Jan 24, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →