Inventor · disambiguated record
William E. Wilson
Also filed as: WILSON WILLIAM · WILSON WILLIAM E · WILSON WILLIAM EARL
35 granted patents·3 pending applications·1,059 citations·filing 1993–2011
98Inventor score
Files withIBM27ENDICOTT INTERCONNECT TECH INC4MARKOVICH VOYA3ANTESBERGER TIMOTHY2MARCONI FRANCESCO F1
Top patents by PatentIndex Score
38 records- 0196US6664485B2Full additive process with filled plated through holesIBM·Filed 2001·Granted Dec 16, 2003·66 cites·19 claims
- 0296US6451509B2Composite laminate circuit structure and method of forming the sameIBM·Filed 2001·Granted Sep 17, 2002·117 cites·10 claims
- 0396US6204453B1Two signal one power plane circuit boardIBM·Filed 1998·Granted Mar 20, 2001·173 cites·6 claims
- 0496US6175087B1Composite laminate circuit structure and method of forming the sameIBM·Filed 1998·Granted Jan 16, 2001·170 cites·8 claims
- 0592US6479093B2Composite laminate circuit structure and methods of interconnecting the sameIBM·Filed 2002·Granted Nov 12, 2002·50 cites·17 claims
- 0689US7293355B2Apparatus and method for making circuitized substrates in a continuous mannerENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Nov 13, 2007·18 cites·12 claims
- 0789US6388204B1Composite laminate circuit structure and methods of interconnecting the sameIBM·Filed 2000·Granted May 14, 2002·75 cites·12 claims
- 0884US7353590B2Method of forming printed circuit cardIBM·Filed 2005·Granted Apr 8, 2008·10 cites·15 claims
- 0983US6418616B2Full additive process with filled plated through holesIBM·Filed 2001·Granted Jul 16, 2002·24 cites·5 claims
- 1081US6204456B1Filling open through holes in a multilayer boardIBM·Filed 1998·Granted Mar 20, 2001·48 cites·32 claims
- 1180US6195883B1Full additive process with filled plated through holesIBM·Filed 1998·Granted Mar 6, 2001·37 cites·3 claims
- 1277US6521844B1Through hole in a photoimageable dielectric structure with wired and uncured dielectricIBM·Filed 1999·Granted Feb 18, 2003·33 cites·11 claims
- 1376US7328502B2Apparatus for making circuitized substrates in a continuous mannerENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Feb 12, 2008·6 cites·10 claims
- 1476US6750405B1Two signal one power plane circuit boardIBM·Filed 2000·Granted Jun 15, 2004·19 cites·2 claims
- 1574US8541687B2Coreless layer buildup structureMARKOVICH VOYA·Filed 2010·Granted Sep 24, 2013·3 cites·18 claims
- 1672US8405229B2Electronic package including high density interposer and circuitized substrate assembly utilizing sameANTESBERGER TIMOTHY·Filed 2009·Granted Mar 26, 2013·6 cites·15 claims
- 1771US6852152B2Colloidal seed formulation for printed circuit board metallizationIBM·Filed 2002·Granted Feb 8, 2005·12 cites·14 claims
- 1871US5981880AElectronic device packages having glass free non conductive layersIBM·Filed 1996·Granted Nov 9, 1999·33 cites·3 claims
- 1968US8536459B2Coreless layer buildup structure with LGAMARKOVICH VOYA·Filed 2010·Granted Sep 17, 2013·2 cites·18 claims
- 2067US8245392B2Method of making high density interposer and electronic package utilizing sameANTESBERGER TIMOTHY·Filed 2009·Granted Aug 21, 2012·4 cites·20 claims
- 2166US6739048B2Process of fabricating a circuitized structureIBM·Filed 2000·Granted May 25, 2004·12 cites·5 claims
- 2265US5427895ASemi-subtractive circuitizationIBM·Filed 1993·Granted Jun 27, 1995·27 cites·20 claims
- 2363US7381587B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Jun 3, 2008·2 cites·12 claims
- 2461US6265075B1Circuitized semiconductor structure and method for producing suchIBM·Filed 1999·Granted Jul 24, 2001·24 cites·29 claims
- 2558US6986198B2Method of forming printed circuit cardIBM·Filed 2003·Granted Jan 17, 2006·6 cites·6 claims
- 2658US6264851B1Selective seed and plate using permanent resistIBM·Filed 1998·Granted Jul 24, 2001·20 cites·8 claims
- 2754US6781064B1Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming sameIBM·Filed 1999·Granted Aug 24, 2004·16 cites·25 claims
- 2851US6830875B2Forming a through hole in a photoimageable dielectric structureIBM·Filed 2002·Granted Dec 14, 2004·3 cites·17 claims
- 2951US6131279AIntegrated manufacturing packaging processIBM·Filed 1998·Granted Oct 17, 2000·14 cites·22 claims
- 3050US2005042383A1Colloidal seed formation for printed circuit board metallizationIBM·Filed 2004·Application pending·0 cites
- 3144US5922517AMethod of preparing a substrate surface for conformal platingIBM·Filed 1996·Granted Jul 13, 1999·9 cites·9 claims
- 3243US9351408B2Coreless layer buildup structure with LGA and joining layerMARKOVICH VOYA·Filed 2010·Granted May 24, 2016·0 cites·27 claims
- 3343US6027858AProcess for tenting PTH's with PID dry filmIBM·Filed 1997·Granted Feb 22, 2000·11 cites·23 claims
- 3441US8240031B2Method of joining a semiconductor device/chip to a printed wiring boardMARKOVICH VOYA R·Filed 2010·Granted Aug 14, 2012·0 cites·16 claims
- 3539US2013025839A1Thermal substrateENDICOTT INTERCONNECT TECH INC·Filed 2011·Application pending·0 cites
- 3636US6547974B1Method of producing fine-line circuit boards using chemical polishingIBM·Filed 1995·Granted Apr 15, 2003·6 cites·9 claims
- 3736US5905018AMethod of preparing a substrate surface for conformal platingIBM·Filed 1997·Granted May 18, 1999·3 cites·11 claims
- 3834US2012243147A1Land grid array (lga) contact connector modificationMARCONI FRANCESCO F·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →