Inventor · disambiguated record
Won Sun Shin
Also filed as: SHIN WON S · SHIN WON SUN
19 granted patents·1,493 citations·filing 1995–2005
96Inventor score
Files withAMKOR TECHNOLOGY INC8ANAM SEMICONDUCTOR INC3ST ASSEMBLY TEST SERVICES LTD3ANAM IND CO LTD2AMKOR ELECTRONICS INC1
Top patents by PatentIndex Score
19 records- 0196US6798049B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 28, 2004·125 cites·30 claims
- 0296US5866939ALead end grid array semiconductor packageANAM SEMICONDUCTOR INC·Filed 1996·Granted Feb 2, 1999·358 cites·56 claims
- 0396US5723899ASemiconductor lead frame having connection bar and guide ringsAMKOR ELECTRONICS INC·Filed 1995·Granted Mar 3, 1998·245 cites·16 claims
- 0495US6940169B2Torch bumpSTATS CHIPPAC LTD·Filed 2004·Granted Sep 6, 2005·162 cites·16 claims
- 0593US7211900B2Thin semiconductor package including stacked diesAMKOR TECHNOLOGY INC·Filed 2005·Granted May 1, 2007·26 cites·20 claims
- 0693US6515356B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 4, 2003·79 cites·12 claims
- 0790US6740577B2Method of forming a small pitch torch bump for mounting high-performance flip-flop devicesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted May 25, 2004·75 cites·35 claims
- 0889US6982488B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2003·Granted Jan 3, 2006·45 cites·20 claims
- 0989US6150709AGrid array type lead frame having lead ends in different planesANAM SEMICONDUCTOR INC·Filed 1998·Granted Nov 21, 2000·100 cites·34 claims
- 1083US5854511ASemiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leadsANAM SEMICONDUCTOR INC·Filed 1996·Granted Dec 29, 1998·93 cites·15 claims
- 1182US6717248B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Apr 6, 2004·27 cites·38 claims
- 1281US5807768AMethod for fabricating a heat sink-integrated semiconductor packageANAM IND CO LTD·Filed 1996·Granted Sep 15, 1998·65 cites·9 claims
- 1379US6469258B1Circuit board for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 22, 2002·35 cites·44 claims
- 1470US7190071B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 13, 2007·13 cites·9 claims
- 1569US5629561ASemiconductor package with integral heat dissipatorANAM IND CO LTD·Filed 1995·Granted May 13, 1997·38 cites·7 claims
- 1665US7443039B2System for different bond pads in an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Oct 28, 2008·3 cites·10 claims
- 1744USRE40112ESemiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Feb 26, 2008·1 cites·35 claims
- 1844US7005370B2Method of manufacturing different bond pads on the same substrate of an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·2 cites·10 claims
- 1939US7306133B2System for fabricating an integrated circuit package on a printed circuit boardST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 11, 2007·1 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →