Inventor · disambiguated record
Yi-Chuan Teng
Also filed as: TENG YI-CHUAN
46 granted patents·8 pending applications·318 citations·filing 1999–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD39TAIWAN SEMICONDUCTOR MFG7ARTILUX INC4HU CHUNG-MING1HUANG HSIN-TING1
Top patents by PatentIndex Score
54 records- 0198US9656852B2CMOS-MEMS device structure, bonding mesa structure and associated methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·216 cites·17 claims
- 0298US9567208B1Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·17 cites·19 claims
- 0395US9919914B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·9 cites·20 claims
- 0491US8941152B1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·11 cites·20 claims
- 0590US9114976B1Semiconductor arrangement with stress release configurationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 25, 2015·8 cites·20 claims
- 0690US8841201B2Systems and methods for post-bonding wafer edge sealTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 23, 2014·12 cites·20 claims
- 0789US10526196B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·3 cites·20 claims
- 0888US9352956B2MEMS devices and methods for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 31, 2016·5 cites·20 claims
- 0987US11516596B2MEMS device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 1087US10710871B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·2 cites·20 claims
- 1185US11772960B2Method of forming dielectric and metal sealing layers on capping structure of a MEMs deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·1 cites·20 claims
- 1285US10508023B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 1383US10155659B2Vacuum sealed MEMS and CMOS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·3 cites·20 claims
- 1481US12202724B2Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent holeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1581US9130531B1Semiconductor arrangement with thermal insulation configurationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 8, 2015·5 cites·20 claims
- 1680US2024373753A1Integrated heater (and related method) to recover degraded piezoelectric device performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1779US12043538B2Semiconductor device structure with movable membraneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 1879US9776856B2Vacuum sealed MEMS and CMOS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 3, 2017·4 cites·20 claims
- 1978US12082505B2Integrated heater (and related method) to recover degraded piezoelectric device performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 2078US2024286889A1Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2178US2024290541A1Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2277US11993512B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 2376US10961114B2Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
- 2475US9150404B2Semiconductor device with through molding viasTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·3 cites·20 claims
- 2574US12391545B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 2673US11984261B2Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 2773US11274037B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 2873US11117796B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 2972US12017908B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 3072US11807520B2Semiconductor structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 3172US2025383449A1Detection Apparatus and Methods of UseARTILUX INC·Filed 2025·Application pending·0 cites
- 3271US11292712B2Method of forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·0 cites·20 claims
- 3370US12074110B2Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 3468US9269679B2Wafer level packaging techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 23, 2016·2 cites·20 claims
- 3566US11730058B2Integrated heater (and related method) to recover degraded piezoelectric device performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·0 cites·20 claims
- 3665US9469524B2Semiconductor device with through molding vias and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 18, 2016·1 cites·20 claims
- 3762US11107630B2Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 3862US2024413189A1Optical Sensor IntegrationARTILUX INC·Filed 2024·Application pending·0 cites
- 3961US11851318B2MEMS device and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 4060US9673169B2Method and apparatus for a wafer seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 6, 2017·1 cites·20 claims
- 4159US12062585B2Wafer-level device measurement for optical sensorsARTILUX INC·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 4256US11276670B2Semiconductor device and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 4354US11434129B2Semiconductor structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 6, 2022·0 cites·20 claims
- 4454US9617143B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 11, 2017·0 cites·18 claims
- 4554US9238578B2Semiconductor arrangement with stress release and thermal insulationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 19, 2016·0 cites·20 claims
- 4654US2025281073A1Chemical Detection Using Single-Photon Avalanche DiodesARTILUX INC·Filed 2025·Application pending·0 cites
- 4753US11462478B2Layer for buffer semiconductor device including microelectromechnical system (MEMS) deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 4, 2022·0 cites·20 claims
- 4852US9545691B2Method of removing waste of substrate and waste removing device thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 17, 2017·0 cites·21 claims
- 4947US11289568B2Reduction of electric field enhanced moisture penetration by metal shieldingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·0 cites·20 claims
- 5044US10861929B2Electronic device including a capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·0 cites·19 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →