Inventor · disambiguated record

Yonggang Jin

Also filed as: JIN YONGGANG

42 granted patents·18 pending applications·262 citations·filing 2002–2024

97Inventor score

Technology areasH10W B23K G06V G01C G02B

Files withST MICROELECTRONICS PTE LTD21 GAN KAH WEE7 JIN YONGGANG7 Baidu online network technology beijing co ltd6 ST MICROELECTRONICS ASIA5

Top patents by PatentIndex Score

60 records

0197US8664044B2Method of fabricating land grid array semiconductor packageJIN YONGGANG·Filed 2011·Granted Mar 4, 2014·97 cites·13 claims
0294US9252030B1System-in-packages and methods for forming sameST MICROELECTRONICS PTE LTD·Filed 2014·Granted Feb 2, 2016·20 cites·18 claims
0394US8779601B2Embedded wafer level package for 3D and package-on-package applications, and method of manufactureGAN KAH WEE·Filed 2011·Granted Jul 15, 2014·34 cites·10 claims
0493US8916481B2Embedded wafer level package for 3D and package-on-package applications, and method of manufactureGAN KAH WEE·Filed 2011·Granted Dec 23, 2014·33 cites·25 claims
0586US11341678B2Device and method for calculating a vehicle trailer pose using a cameraCONTINENTAL AUTOMOTIVE GMBH·Filed 2020·Granted May 24, 2022·2 cites·13 claims
0686US8860207B2Method of fabricating land grid array semiconductor packageST MICROELECTRONICS PTE LTD·Filed 2014·Granted Oct 14, 2014·7 cites·20 claims
0782US9013037B2Semiconductor package with improved pillar bump process and structureJIN YONGGANG·Filed 2011·Granted Apr 21, 2015·7 cites·13 claims
0882US8617987B2Through hole via filling using electroless platingGAN KAH WEE·Filed 2010·Granted Dec 31, 2013·7 cites·9 claims
0982US8119454B2Manufacturing fan-out wafer level packagingJIN YONGGANG·Filed 2008·Granted Feb 21, 2012·10 cites·11 claims
1081US9448216B2Gas sensor device with frame passageways and related methodsST MICROELECTRONICS PTE LTD·Filed 2014·Granted Sep 20, 2016·3 cites·23 claims
1180US9013017B2Method for making image sensors using wafer-level processing and associated devicesST MICROELECTRONICS ASIA·Filed 2012·Granted Apr 21, 2015·4 cites·24 claims
1278US10846543B2Method and apparatus for detecting lane line, and mediumBaidu online network technology beijing co ltd·Filed 2018·Granted Nov 24, 2020·3 cites·18 claims
1377US9831357B2Semiconductor optical package and methodST MICROELECTRONICS PTE LTD·Filed 2013·Granted Nov 28, 2017·4 cites·17 claims
1476US8535980B2Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor packageCHUA PUAY GEK·Filed 2010·Granted Sep 17, 2013·8 cites·19 claims
1574US11105638B2Method, apparatus, and computer readable storage medium for updating electronic mapBaidu online network technology beijing co ltd·Filed 2018·Granted Aug 31, 2021·2 cites·21 claims
1670US8766422B2Through hole via filling using electroless platingGAN KAH WEE·Filed 2011·Granted Jul 1, 2014·3 cites·3 claims
1769US10878621B2Method and apparatus for creating map and positioning moving entityBaidu online network technology beijing co ltd·Filed 2018·Granted Dec 29, 2020·1 cites·16 claims
1868US9012269B2Reducing warpage for fan-out wafer level packagingJIN YONGGANG·Filed 2012·Granted Apr 21, 2015·3 cites·11 claims
1966US8937008B2Apparatus and method for placing solder ballsJIN YONGGANG·Filed 2011·Granted Jan 20, 2015·2 cites·15 claims
2065US10789771B2Method and apparatus for fusing point cloud dataBaidu online network technology beijing co ltd·Filed 2018·Granted Sep 29, 2020·1 cites·15 claims
2165US7443039B2System for different bond pads in an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Oct 28, 2008·3 cites·10 claims
2264US8796139B2Embedded wafer level ball grid array bar systems and methodsST MICROELECTRONICS PTE LTD·Filed 2012·Granted Aug 5, 2014·2 cites·18 claims
2363US2018229334A1Cored solder wire with rosin flux and thermoset materialST MICROELECTRONICS PTE LTD·Filed 2018·Application pending·0 cites
2462US9059058B2Image sensor device with IR filter and related methodsST MICROELECTRONICS ASIA·Filed 2012·Granted Jun 16, 2015·1 cites·25 claims
2561US9851328B2Compact microelectronic integrated gas sensorST MICROELECTRONICS PTE LTD·Filed 2014·Granted Dec 26, 2017·0 cites·19 claims
2661US8728831B2Reconstituted wafer warpage adjustmentGAN KAH WEE·Filed 2010·Granted May 20, 2014·1 cites·15 claims
2760US8860228B2Electronic device including electrically conductive vias having different cross-sectional areas and related methodsST MICROELECTRONICS PTE LTD·Filed 2012·Granted Oct 14, 2014·1 cites·24 claims
2858US2016184938A1Cored solder wire with rosin flux and thermoset materialST MICROELECTRONICS PTE LTD·Filed 2014·Application pending·0 cites
2958US2025291137A1Silicon photonic chip package module based on plastic encapsulationOIP TECH PTE LTD·Filed 2024·Application pending·0 cites
3057US11231386B2Compact microelectronic integrated gas sensorST MICROELECTRONICS PTE LTD·Filed 2017·Granted Jan 25, 2022·0 cites·15 claims
3155US10381504B2Wafer level packaging, optical detection sensor and method of forming sameST MICROELECTRONICS PTE LTD·Filed 2018·Granted Aug 13, 2019·0 cites·12 claims
3254US2024304573A1Interconnect structure for advanced packaging and method for the sameOIP TECH PTE LTD·Filed 2023·Application pending·0 cites
3354US2024304464A1Semiconductor package and method of fabricating the sameOIP TECH PTE LTD·Filed 2023·Application pending·0 cites
3452US12092874B2Silicon photonic package and method of fabricating the sameOIP TECH PTE LTD·Filed 2022·Granted Sep 17, 2024·0 cites·15 claims
3551US10115842B2Semiconductor optical package and methodST MICROELECTRONICS PTE LTD·Filed 2017·Granted Oct 30, 2018·0 cites·17 claims
3651US9991409B2Wafer level packaging, optical detection sensor and method of forming sameST MICROELECTRONICS PTE LTD·Filed 2015·Granted Jun 5, 2018·0 cites·14 claims
3749US2013119282A1Wafer level packaging, optical detection sensor and method of forming sameST MICROELECTRONICS PTE LTD·Filed 2012·Application pending·0 cites
3849US2010187651A1Integrated circuit package and method of forming the sameST MICROELECTRONICS ASIA·Filed 2009·Application pending·0 cites
3948US9780080B2Method for making an optical proximity sensor by attaching an optical element to a package top plate and forming a package body to define an optical transmit cavity and an optical receive cavityST MICROELECTRONICS PTE LTD·Filed 2014·Granted Oct 3, 2017·0 cites·25 claims
4048US2011156239A1Method for manufacturing a fan-out embedded panel level packageST MICROELECTRONICS ASIA·Filed 2009·Application pending·0 cites
4146US10885352B2Method, apparatus, and device for determining lane line on roadBaidu online network technology beijing co ltd·Filed 2018·Granted Jan 5, 2021·0 cites·17 claims
4246US9455241B2Integrated circuit package and method of forming the sameST MICROELECTRONICS PTE LTD·Filed 2015·Granted Sep 27, 2016·0 cites·16 claims
4346US9018645B2Optoelectronics assembly and method of making optoelectronics assemblyST MICROELECTRONICS PTE LTD·Filed 2013·Granted Apr 28, 2015·0 cites·18 claims
4446US2012038043A1Manufacturing fan-out wafer level packagingJIN YONGGANG·Filed 2011·Application pending·0 cites
4546US2010167471A1Reducing warpage for fan-out wafer level packagingST MICROELECTRONICS ASIA·Filed 2009·Application pending·0 cites
4644US10909724B2Method, apparatus, and computer readable medium for adjusting color annotation of an imageBaidu online network technology beijing co ltd·Filed 2018·Granted Feb 2, 2021·0 cites·15 claims
4744US7005370B2Method of manufacturing different bond pads on the same substrate of an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·2 cites·10 claims
4843US8836117B2Electronic device having a contact recess and related methodsST MICROELECTRONICS PTE LTD·Filed 2012·Granted Sep 16, 2014·0 cites·22 claims
4941US2015028187A1Image sensor device with infrared filter adhesively secured to image sensor integrated circuit and related methodsST MICROELECTRONICS PTE LTD·Filed 2013·Application pending·0 cites
5040US2005242446A1Integrated circuit package with different hardness bump pad and bump and manufacturing method thereforSTATS CHIPPAC LTD·Filed 2005·Application pending·0 cites

Showing the top 50 of 60 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →