Inventor · disambiguated record
Yutaka Hoshino
Also filed as: HOSHINO YUTAKA
49 granted patents·7 pending applications·408 citations·filing 1984–2019
98Inventor score
Files withRENESAS TECH CORP10HITACHI LTD9FURUKAWA ELECTRIC CO LTD8RENESAS ELECTRONICS CORP8HOSHINO YUTAKA4
Top patents by PatentIndex Score
56 records- 0199US7598558B2Method of manufacturing semiconductor integrated circuit device having capacitor elementRENESAS TECH CORP·Filed 2007·Granted Oct 6, 2009·105 cites·6 claims
- 0293US10101549B2Optical fiber cableFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Oct 16, 2018·14 cites·3 claims
- 0393US7741656B2Semiconductor device and manufacturing the sameRENESAS TECH CORP·Filed 2009·Granted Jun 22, 2010·14 cites·12 claims
- 0490US9989723B2Loose tube-type optical fiber unitFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Jun 5, 2018·9 cites·6 claims
- 0589US6528848B1Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2000·Granted Mar 4, 2003·35 cites·50 claims
- 0686US6605842B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2002·Granted Aug 12, 2003·26 cites·9 claims
- 0785US5780910ASRAM with stacked capacitor spaced from gate electrodesHITACHI LTD·Filed 1996·Granted Jul 14, 1998·44 cites·38 claims
- 0884US10882783B2Optical fiber ribbon and optical fiber cableFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Jan 5, 2021·4 cites·8 claims
- 0984US6737712B2Method of manufacturing semiconductor integrated circuit device having capacitor elementHITACHI LTD·Filed 2002·Granted May 18, 2004·21 cites·21 claims
- 1082US8134408B2Power amplification circuit having transformerKAWAKAMI TSUYOSHI·Filed 2009·Granted Mar 13, 2012·8 cites·6 claims
- 1181US11036024B2Method for manufacturing intermittent bonding type optical fiber ribbon and intermittent bonding type optical fiber ribbonFURUKAWA ELECTRIC CO LTD·Filed 2019·Granted Jun 15, 2021·3 cites·9 claims
- 1278US7176520B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Feb 13, 2007·20 cites·24 claims
- 1377US8962418B2Manufacturing method of semiconductor device having semiconductor layers with different thicknessesHOSHINO YUTAKA·Filed 2012·Granted Feb 24, 2015·4 cites·22 claims
- 1477US8330544B2Power amplification circuit having transformerKAWAKAMI TSUYOSHI·Filed 2012·Granted Dec 11, 2012·4 cites·7 claims
- 1577US7087977B2Semiconductor device including multiple wiring layers and circuits operating in different frequency bandsRENESAS E JP SEMICONDUCTOR INC·Filed 2003·Granted Aug 8, 2006·12 cites·4 claims
- 1675US8344454B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2011·Granted Jan 1, 2013·4 cites·15 claims
- 1775US7510941B2Semiconductor device and manufacturing method of the sameRENESAS TECH CORP·Filed 2005·Granted Mar 31, 2009·7 cites·5 claims
- 1874US8482058B2Semiconductor device including a power MISFETHOSHINO YUTAKA·Filed 2012·Granted Jul 9, 2013·2 cites·6 claims
- 1968US8232595B2Semiconductor device including a power MISFET and method of manufacturing the sameHOSHINO YUTAKA·Filed 2011·Granted Jul 31, 2012·1 cites·4 claims
- 2067US8779855B2Power amplification circuit having transformerRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 15, 2014·2 cites·4 claims
- 2167US8461927B2Power amplification circuit having transformerRENESAS ELECTRONICS CORP·Filed 2012·Granted Jun 11, 2013·2 cites·4 claims
- 2267US7217987B2Semiconductor device and manufacturing the sameRENESAS E JP SEMICONDUCTOR INC·Filed 2006·Granted May 15, 2007·1 cites·9 claims
- 2365US7994567B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Aug 9, 2011·1 cites·9 claims
- 2465US6797594B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Sep 28, 2004·7 cites·14 claims
- 2560US6476453B2Semiconductor integrated circuit device having capacitor elementHITACHI LTD·Filed 2001·Granted Nov 5, 2002·4 cites·15 claims
- 2659US7671381B2Semiconductor device and manufacturing the sameRENESAS E JP SEMICONDUCTOR INC·Filed 2008·Granted Mar 2, 2010·0 cites·26 claims
- 2759US4613628AResin composition for closed-cell foam and cured resin foam prepared by using said resin compositionFERRO ENAMELS JAPAN·Filed 1984·Granted Sep 23, 1986·15 cites·30 claims
- 2858US10823930B2Optical fiber cable and optical fiber cable manufacturing methodFURUKAWA ELECTRIC CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·5 claims
- 2958US7982263B2Semiconductor device having a plurality of misfets formed on a main surface of a semiconductor substrateRENESAS ELECTRONICS CORP·Filed 2009·Granted Jul 19, 2011·0 cites·3 claims
- 3058US7176523B2Power mosfet having conductor plug structured contactsRENESAS TECH CORP·Filed 2004·Granted Feb 13, 2007·4 cites·29 claims
- 3158US2010001329A1Method of manufacturing semiconductor integrated circuit device having capacitor elementHASHIMOTO NAOTAKA·Filed 2009·Application pending·0 cites
- 3256US8129784B2Semiconductor deviceHATORI MAKOTO·Filed 2009·Granted Mar 6, 2012·2 cites·17 claims
- 3355US8842955B2Optical fiber cableTSUKAMOTO MASAYOSHI·Filed 2009·Granted Sep 23, 2014·2 cites·4 claims
- 3454US10859780B2Optical fiber unit, optical fiber cable, and method for manufacturing optical fiber unitFURUKAWA ELECTRIC CO LTD·Filed 2019·Granted Dec 8, 2020·0 cites·9 claims
- 3554US9795549B21,2-alkane polyol-containing compositionOSAKA ORGANIC CHEMICAL IND LTD·Filed 2015·Granted Oct 24, 2017·0 cites·2 claims
- 3653US2011012181A1Method of manufacturing semiconductor integrated circuit devcie having capacitor elementHASHIMOTO NAOTAKA·Filed 2010·Application pending·0 cites
- 3752US7323735B2Method of manufacturing semiconductor integrated circuit device having capacitor elementRENESAS TECH CORP·Filed 2005·Granted Jan 29, 2008·0 cites·6 claims
- 3852US5780328AProcess for producing semiconductor integrated circuitHITACHI LTD·Filed 1997·Granted Jul 14, 1998·16 cites·20 claims
- 3952US2007114606A1Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 4051US7791131B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2006·Granted Sep 7, 2010·0 cites·17 claims
- 4150US8080831B2Semiconductor device and manufacturing the sameNAKAYAMA FUMITAKA·Filed 2010·Granted Dec 20, 2011·0 cites·14 claims
- 4249US9324734B2Semiconductor device having semiconductor layers with different thicknessesRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 26, 2016·0 cites·7 claims
- 4349US7479681B2Multilayered semiconductor structure containing a MISFET, a resistor, a capacitor, and an inductorRENESAS EASTERN TECHNOLOGY COR·Filed 2007·Granted Jan 20, 2009·0 cites·1 claims
- 4449US7030449B2Semiconductor integrated circuit device having capacitor elementRENESAS TECH CORP·Filed 2004·Granted Apr 18, 2006·1 cites·14 claims
- 4549US6030865AProcess for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1998·Granted Feb 29, 2000·7 cites·30 claims
- 4649US2011254087A1Semiconductor device and a method of manufacturing the sameMIYAKE TOMOYUKI·Filed 2011·Application pending·0 cites
- 4747US10061095B2Indoor cable used as optical fiber cableFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Aug 28, 2018·0 cites·5 claims
- 4847US6245611B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1999·Granted Jun 12, 2001·6 cites·8 claims
- 4945US8837886B2Optical fiber cable having a sheath and for setting in a conduitHOSHINO YUTAKA·Filed 2009·Granted Sep 16, 2014·0 cites·4 claims
- 5044US9159807B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 13, 2015·0 cites·5 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →