Inventor · disambiguated record
Yukinao Kaga
Also filed as: KAGA YUKINAO
24 granted patents·13 pending applications·50 citations·filing 2010–2025
93Inventor score
Files withHITACHI INT ELECTRIC INC15KOKUSAI ELECTRIC CORP14KAGA YUKINAO3SAITO TATSUYUKI2SAKAI MASANORI2
Top patents by PatentIndex Score
37 records- 0191US8808455B2Substrate processing apparatus and method of manufacturing semiconductor deviceSAITO TATSUYUKI·Filed 2011·Granted Aug 19, 2014·14 cites·8 claims
- 0287US9508555B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 29, 2016·8 cites·8 claims
- 0387US9340873B2Semiconductor device manufacturing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 17, 2016·4 cites·16 claims
- 0483US12503767B2Non-transitory computer-readable recording medium, substrate processing apparatus and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0583US10640869B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted May 5, 2020·3 cites·9 claims
- 0682US9472398B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 18, 2016·3 cites·6 claims
- 0779US9238257B2Method of manufacturing semiconductor device, cleaning method, and substrate processing apparatusSAKAI MASANORI·Filed 2010·Granted Jan 19, 2016·4 cites·17 claims
- 0878US8691708B2Method of manufacturing semiconductor device and substrate processing apparatusKAGA YUKINAO·Filed 2011·Granted Apr 8, 2014·4 cites·9 claims
- 0976US10388530B2Method of manufacturing semiconductor device and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 20, 2019·1 cites·14 claims
- 1075US9045825B2Method of forming metal-containing filmKAGA YUKINAO·Filed 2012·Granted Jun 2, 2015·3 cites·6 claims
- 1173US8410001B2Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatusTAKASAWA YUSHIN·Filed 2011·Granted Apr 2, 2013·3 cites·15 claims
- 1272US12000045B2Method of manufacturing semiconductor device, non-transitory computer-readable recording medium, substrate processing apparatus and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jun 4, 2024·0 cites·21 claims
- 1371US11031270B2Substrate processing apparatus, substrate holder and mounting toolKOKUSAI ELECTRIC CORP·Filed 2018·Granted Jun 8, 2021·1 cites·9 claims
- 1464US9466477B2Method of manufacturing semiconductor device, substrate processing apparatus, and semiconductor deviceSAITO TATSUYUKI·Filed 2010·Granted Oct 11, 2016·1 cites·8 claims
- 1564US9263269B2Reaction tube, substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Granted Feb 16, 2016·1 cites·13 claims
- 1660US2025101593A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1757US11854850B2Substrate processing apparatus, method of manufacturing semiconductor device, method of loading substrate and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 26, 2023·0 cites·13 claims
- 1857US2024229229A9Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1956US2018247819A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Application pending·0 cites
- 2056US2025223691A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2155US9416446B2Semiconductor device manufacturing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 16, 2016·0 cites·14 claims
- 2252US10559485B2Method of manufacturing semiconductor device, method of loading substrate and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Feb 11, 2020·0 cites·16 claims
- 2352US9972500B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted May 15, 2018·0 cites·6 claims
- 2452US2014162454A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 2552US2013095668A1Semiconductor device manufacturing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Application pending·0 cites
- 2651US9650715B2Method of forming metal-containing filmHITACHI INT ELECTRIC INC·Filed 2015·Granted May 16, 2017·0 cites·6 claims
- 2749US2015325447A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 2847US2011290182A1Method of manufacturing semiconductor device, cleaning method, and substrate processing apparatusSAKAI MASANORI·Filed 2011·Application pending·0 cites
- 2945US11876010B2Substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jan 16, 2024·0 cites·9 claims
- 3042US11004676B2Method for manufacturing semiconductor device, non-transitory computer-readable recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2018·Granted May 11, 2021·0 cites·5 claims
- 3142US2014080317A1Mehod of manufacturing a semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 3241US10622213B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 14, 2020·0 cites·8 claims
- 3339US10366894B2Method of manufacturing semiconductor device, substrate processing device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 30, 2019·0 cites·14 claims
- 3439US2020411330A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 3538US2019093224A1Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 3637US2010297846A1Method of manufacturing a semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 3736US2012108077A1Substrate processing apparatus and semiconductor device manufacturing methodKAGA YUKINAO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →