Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation

Abstract

Embodiments of the invention generally provide a cooling mechanism utilized in a plasma reactor that may provide efficient temperature control during a plasma process. In one embodiment, a cooling mechanism disposed in a plasma processing apparatus includes a coil antenna enclosure formed in a processing chamber, a coil antenna assembly disposed in the coil antenna enclosure, a plurality of air circulating elements disposed in the coil antenna enclosure adjacent to the coil antenna assembly, and a baffle plate disposed in the coil antenna enclosure below and adjacent to the coil antenna assembly.

What is claimed is: 
     
       1. A cooling mechanism for a processing chamber comprising:
 a processing chamber; 
 a coil antenna enclosure disposed above the processing chamber; 
 perforations formed through a bottom portion of the coil antenna enclosure; 
 a coil antenna assembly disposed in the coil antenna enclosure; 
 a plurality of air circulating elements disposed in the coil antenna enclosure adjacent to the coil antenna assembly; and 
 a baffle plate disposed in the coil antenna enclosure below and adjacent to the coil antenna assembly, the baffle plate disposed between the coil antenna assembly and the perforations, the baffle plate has a central opening that allows fluid communication from the perforations disposed below the baffle plate to the coil antenna assembly disposed above the baffle plate, wherein the baffle plate has a circular body defining a horizontal plane substantially parallel to a horizontal surface of a substrate support disposed in the processing chamber. 
 
     
     
       2. The cooling mechanism of  claim 1 , wherein the air circulating elements are disposed above the coil antenna assembly. 
     
     
       3. The cooling mechanism of  claim 1 , wherein the baffle plate is disposed substantially parallel to a lid of the processing chamber. 
     
     
       4. The cooling mechanism of  claim 1 , wherein the baffle plate is disposed at a position horizontally above the perforations. 
     
     
       5. The cooling mechanism of  claim 1 , wherein the central opening of the baffle plate is located inward of the coil antenna assembly. 
     
     
       6. The cooling mechanism of  claim 1 , wherein the air circulating element has a center axis perpendicular to a ceiling of the coil antenna enclosure. 
     
     
       7. The cooling mechanism of  claim 1 , wherein the air circulating element has a center axis having a tilted angle away from a vertical axis of a ceiling of the coil antenna enclosure. 
     
     
       8. The cooling mechanism of  claim 1 , further comprising:
 a plurality of perforations formed in a ceiling of the coil antenna enclosure. 
 
     
     
       9. The cooling mechanism of  claim 1 , wherein the coil antenna assembly includes an inner coil and an outer coil concentric with the inner coil. 
     
     
       10. The cooling mechanism of  claim 1 , wherein the perforation is formed about one third in length from a bottom of a sidewall of the coil antenna enclosure. 
     
     
       11. A processing chamber comprising:
 a chamber body; 
 a lid enclosing an interior volume of the chamber body; 
 a substrate support disposed in the interior volume; 
 a coil antenna enclosure disposed on the lid; 
 a coil antenna assembly disposed in the coil antenna enclosure; 
 perforations formed through a bottom portion of the coil antenna enclosure below the coil antenna assembly; 
 a cooling mechanism disposed in the coil antenna enclosure adjacent to the coil antenna assembly; and 
 a baffle plate disposed in the coil antenna enclosure below and adjacent to the coil antenna assembly, the baffle plate has a central opening that allows fluid communication from the perforations disposed below the baffle plate to the coil antenna assembly disposed above the baffle plate, wherein the baffle plate has a circular body defining a horizontal plane substantially parallel to a horizontal surface of the substrate support disposed in the processing chamber. 
 
     
     
       12. The processing chamber of  claim 11 , wherein the cooling mechanism further comprises:
 a plurality of air circulating elements disposed in the coil antenna enclosure adjacent to the coil antenna assembly. 
 
     
     
       13. The processing chamber of  claim 12 , wherein the plurality of air circulating elements are disposed above the coil antenna assembly. 
     
     
       14. The processing chamber of  claim 11 , wherein the central opening of the baffle plate faces a center region of the coil antenna assembly. 
     
     
       15. The processing chamber of  claim 11 , further comprising:
 at least one perforation formed on a sidewall of the coil antenna enclosure.