Plasma reactor apparatus with a toroidal plasma source and a VHF capacitively coupled plasma source with variable frequency

Abstract

A plasma reactor for processing a workpiece includes a reactor chamber and a workpiece support within the chamber, the chamber having a ceiling facing the workpiece support, a toroidal plasma source comprising a hollow reentrant conduit external of the chamber and having a pair of ends connected to the interior of the chamber and forming a closed toroidal path extending through the conduit and across the diameter of the workpiece support, and an RF power applicator adjacent a portion of the reentrant external conduit, and an RF source power generator coupled to the RF power applicator of the toroidal plasma source. The reactor further includes a capacitively coupled plasma source power applicator comprising a source power electrode at one of: (a) the ceiling (b) the workpiece support, and plural VHF power generators of different fixed frequencies coupled to the capacitively coupled source power applicator, and a controller for independently controlling the power output levels of the plural VHF generators so as to control an effective VHF frequency applied to the source power electrode.

1 . A plasma reactor for processing a workpiece, comprising: 
 a reactor chamber and a workpiece support within said chamber, said chamber having a ceiling facing said workpiece support;    a toroidal plasma source comprising a hollow reentrant conduit external of said chamber and having a pair of ends connected to the interior of said chamber and forming a closed toroidal path extending through said conduit and across the diameter of said workpiece support, and an RF power applicator adjacent a portion of said reentrant external conduit;    an RF source power generator coupled to the RF power applicator of said toroidal plasma source;    a capacitively coupled plasma source power applicator comprising a source power electrode at one of: (a) said ceiling (b) said workpiece support, and plural VHF power generators of different fixed frequencies coupled to said capacitively coupled source power applicator; and    a controller for independently controlling the power output levels of said plural VHF generators so as to control an effective VHF frequency applied to said source power electrode.    
   
   
       2 . The reactor of  claim 1  further comprising: 
 a plasma bias power applicator comprising a bias power electrode in said workpiece support and at least a first RF bias power generator coupled to said plasma bias power applicator.    
   
   
       3 . The reactor of  claim 2  wherein said source power electrode is at said ceiling and comprises: 
 process gas distribution apparatus comprising a gas distribution showerhead in said ceiling.    
   
   
       4 . The reactor of  claim 1  wherein said controller is capable of adjusting the relative amounts of power simultaneously coupled to plasma in said chamber by said inductively coupled plasma source power applicator and said capacitively coupled plasma source power applicator.  
   
   
       5 . The reactor of  claim 2  further comprising: 
 a second RF bias power generator coupled to said bias power electrode, said first and second RF bias power generators providing RF power at a low frequency and at a high frequency, respectively;    a second controller capable of adjusting the relative amounts of power simultaneously coupled to said bias power electrode by said first and second RF bias power generators.    
   
   
       6 . The reactor of  claim 5  wherein said source power electrode is at said workpiece support and wherein said source power electrode and said bias power electrode are the same electrode.  
   
   
       7 . The reactor of  claim 3  wherein said VHF source power generator is coupled to said electrode at said ceiling, said reactor further comprising a VHF bandpass filter connected between said bias power electrode and ground whereby said bias power electrode is a counterelectrode for said electrode at said ceiling.  
   
   
       8 . The reactor of  claim 7  further comprising an LF/HF bandpass filter connected between said ceiling electrode and ground, whereby said ceiling electrode is a counterelectrode for bias power applied to said bias power electrode.  
   
   
       9 . The reactor of  claim 4  wherein said VHF source power generator is coupled to said bias power electrode at said workpiece support, said electrode at said ceiling being connected to ground whereby said electrode at said ceiling is a counterelectrode for VHF power applied to said bias power electrode and for HF or LF bias power applied to said bias power electrode.  
   
   
       10 . The reactor of  claim 1  wherein said controller is capable of controlling the evacuation rate of said chamber.  
   
   
       11 . The reactor of  claim 4  wherein said controller controls said relative amounts of power by adjusting the respective output power levels of said RF source power generator and said plural VHF generators.  
   
   
       12 . The reactor of  claim 5  wherein said low frequency and said high frequency are greater and less than, respectively, a sheath ion transit frequency of plasma in said chamber.  
   
   
       13 . The reactor of  claim 3  wherein said ceiling and said gas distribution showerhead have a dome shape.  
   
   
       14 . The reactor of  claim 13  wherein said dome shape 
 is one of: (a) smooth, (b) stepped.    
   
   
       15 . The reactor of  claim 14  wherein said dome shape is center high relative a ceiling-to-workpiece distance.