Inventor · disambiguated record
Theodoros Panagopoulos
Also filed as: PANAGOPOULOS THEODOROS
23 granted patents·21 pending applications·508 citations·filing 2001–2023
96Inventor score
Files withAPPLIED MATERIALS INC26LAM RES CORP7MATYUSHKIN ALEXANDER3HOLLAND JOHN2PANAGOPOULOS THEODOROS2
Top patents by PatentIndex Score
44 records- 0197US11380556B2Thermal atomic layer etch with rapid temperature cyclingLAM RES CORP·Filed 2020·Granted Jul 5, 2022·3 cites·16 claims
- 0297US7264688B1Plasma reactor apparatus with independent capacitive and toroidal plasma sourcesAPPLIED MATERIALS INC·Filed 2006·Granted Sep 4, 2007·73 cites·16 claims
- 0396US8226769B2Substrate support with electrostatic chuck having dual temperature zonesMATYUSHKIN ALEXANDER·Filed 2007·Granted Jul 24, 2012·80 cites·34 claims
- 0496US8075729B2Method and apparatus for controlling temperature of a substrateHOLLAND JOHN·Filed 2005·Granted Dec 13, 2011·51 cites·22 claims
- 0596US7645357B2Plasma reactor apparatus with a VHF capacitively coupled plasma source of variable frequencyAPPLIED MATERIALS INC·Filed 2006·Granted Jan 12, 2010·40 cites·12 claims
- 0695US8663391B2Electrostatic chuck having a plurality of heater coilsMATYUSHKIN ALEXANDER·Filed 2012·Granted Mar 4, 2014·35 cites·20 claims
- 0793US10257887B2Substrate support assemblyAPPLIED MATERIALS INC·Filed 2017·Granted Apr 9, 2019·6 cites·20 claims
- 0893US7780864B2Process using combined capacitively and inductively coupled plasma sources for controlling plasma ion radial distributionAPPLIED MATERIALS INC·Filed 2006·Granted Aug 24, 2010·21 cites·17 claims
- 0993US7436645B2Method and apparatus for controlling temperature of a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Oct 14, 2008·37 cites·14 claims
- 1092US9883549B2Substrate support assembly having rapid temperature controlAPPLIED MATERIALS INC·Filed 2016·Granted Jan 30, 2018·6 cites·20 claims
- 1192US9275887B2Substrate processing with rapid temperature gradient controlMATYUSHKIN ALEXANDER·Filed 2007·Granted Mar 1, 2016·20 cites·19 claims
- 1292US7674394B2Plasma process for inductively coupling power through a gas distribution plate while adjusting plasma distributionAPPLIED MATERIALS INC·Filed 2007·Granted Mar 9, 2010·17 cites·21 claims
- 1392US7510665B2Plasma generation and control using dual frequency RF signalsAPPLIED MATERIALS INC·Filed 2006·Granted Mar 31, 2009·17 cites·19 claims
- 1483US11796085B2Non-elastomeric, non-polymeric, non-metallic membrane valves for semiconductor processing equipmentLAM RES CORP·Filed 2020·Granted Oct 24, 2023·1 cites·15 claims
- 1583US8236133B2Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension biasKATZ DAN·Filed 2008·Granted Aug 7, 2012·13 cites·9 claims
- 1683US7431857B2Plasma generation and control using a dual frequency RF sourceAPPLIED MATERIALS INC·Filed 2004·Granted Oct 7, 2008·26 cites·21 claims
- 1782US6905968B2Process for selectively etching dielectric layersAPPLIED MATERIALS INC·Filed 2001·Granted Jun 14, 2005·27 cites·24 claims
- 1880US10153282B1Ultra-high vacuum transport and storageLAM RES CORP·Filed 2017·Granted Dec 11, 2018·3 cites·17 claims
- 1979US7727413B2Dual plasma source process using a variable frequency capacitively coupled source to control plasma ion densityAPPLIED MATERIALS INC·Filed 2006·Granted Jun 1, 2010·5 cites·14 claims
- 2076US7648914B2Method for etching having a controlled distribution of process resultsAPPLIED MATERIALS INC·Filed 2006·Granted Jan 19, 2010·6 cites·20 claims
- 2175US12253190B2Non-elastomeric, non-polymeric, non-metallic membrane valves for semiconductor processing equipmentLAM RES CORP·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 2275US7544251B2Method and apparatus for controlling temperature of a substrateAPPLIED MATERIALS INC·Filed 2004·Granted Jun 9, 2009·13 cites·5 claims
- 2367US2022293431A1Thermal atomic layer etch with rapid temperature cyclingLAM RES CORP·Filed 2022·Application pending·0 cites
- 2466US7838430B2Plasma control using dual cathode frequency mixingAPPLIED MATERIALS INC·Filed 2004·Granted Nov 23, 2010·8 cites·27 claims
- 2558US2008193673A1Method of processing a workpiece using a mid-chamber gas distribution plate, tuned plasma flow control grid and electrodeAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2658US2008178805A1Mid-chamber gas distribution plate, tuned plasma flow control grid and electrodeAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2752US2007102118A1Method and apparatus for controlling temperature of a substrateHOLLAND JOHN·Filed 2006·Application pending·0 cites
- 2851US2009139963A1Multiple frequency pulsing of multiple coil source to control plasma ion density radial distributionPANAGOPOULOS THEODOROS·Filed 2007·Application pending·0 cites
- 2951US2009236447A1Method and apparatus for controlling gas injection in process chamberAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 3050US2007000611A1Plasma control using dual cathode frequency mixingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3150US2023260768A1Plasma discharge uniformity control using magnetic fieldsLAM RES CORP·Filed 2021·Application pending·0 cites
- 3249US2008230008A1Plasma species and uniformity control through pulsed vhf operationPATERSON ALEXANDER·Filed 2007·Application pending·0 cites
- 3349US2008236490A1Plasma reactor with an overhead inductive antenna and an overhead gas distribution showerheadPATERSON ALEXANDER·Filed 2007·Application pending·0 cites
- 3448US2007006971A1Plasma generation and control using a dual frequency rf sourceAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3547US2007246161A1Plasma reactor apparatus with a toroidal plasma source and a VHF capacitively coupled plasma source with variable frequencyAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3647US2007245960A1Process using combined capacitively and inductively coupled plasma sources for controlling plasma ion densityAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3747US2007246163A1Plasma reactor apparatus with independent capacitive and inductive plasma sourcesAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3847US2007246162A1Plasma reactor apparatus with an inductive plasma source and a VHF capacitively coupled plasma source with variable frequencyAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3947US2007245958A1Dual plasma source process using a variable frequency capacitively coupled source for controlling ion radial distributionAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4047US2007245961A1Dual plasma source process using a variable frequency capacitively coupled source for controlling plasma ion dissociationAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4146US2022165546A1Plasma etch tool for high aspect ratio etchingLAM RES CORP·Filed 2020·Application pending·0 cites
- 4243US2007246443A1Process using combined capacitively and inductively coupled plasma process for controlling plasma ion dissociationAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4342US2008149592A1Plasma etch process for controlling line edge roughnessBELEN RODOLFO P·Filed 2007·Application pending·0 cites
- 4442US2013256271A1Methods and apparatuses for controlling plasma in a plasma processing chamberPANAGOPOULOS THEODOROS·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →