Microlithographic Projection Exposure Apparatus

Abstract

A projection exposure apparatus has a projection lens ( 10 ) with an object plane ( 34 ), an image plane, an optical axis ( 28 ) and a non-telecentric entrance pupil ( 32 ). The apparatus further comprises an illumination system ( 12 ) having an intermediate field plane ( 80 ) and a field stop ( 36; 36 ). The field stop is positioned in or in close proximity to the intermediate field plane ( 80 ) and defines an illuminated field ( 14 ) in the object plane ( 34 ) that does not contain the optical axis ( 28 ) of the projection lens ( 24 ). The illumination system ( 12 ) is configured such that, in the object plane ( 34 ), a mean of the angles formed between all principal rays ( 42 ) emanating from the intermediate field plane ( 80 ) on the one hand and the optical axis ( 28 ) of the projection lens ( 24 ) on the other hand differs from 0°.

1 . A system, comprising:
 a) a projection lens having
 an object plane, 
 an image plane, 
 an optical axis and 
 a non-telecentric entrance pupil, 
   b) an illumination system having
 an intermediate field plane, 
 a field stop that
 is positioned in or in close proximity to the intermediate field plane and 
 defines, in the object plane of the projection lens, an illuminated field that does not contain the optical axis of the projection lens, 
 
 wherein the illumination system is configured such that, in the object plane, a mean of the angles formed between all principal rays emanating from the intermediate field plane and the optical axis of the projection lens differs from 0°, and the system is a projection exposure apparatus. 
   
     
     
         2 . The system of  claim 1 , wherein the mean of the angles formed between all principal rays emanating from the intermediate field plane and the optical axis of the projection lens is between 1° and 20°. 
     
     
         3 . The system of  claim 2 , wherein the mean of the angles formed between all principal rays emanating from the intermediate field plane and the optical axis of the projection lens is between 3° and 8°. 
     
     
         4 . The system of  claim 1 , wherein the illumination system has, at least in a section immediately adjacent to the object plane of the projection lens, an optical axis that is tilted with respect to the optical axis of the projection lens. 
     
     
         5 . The system of  claim 1 , wherein the illumination system comprises an optical element that has an axis of symmetry that is not coaxial with an optical axis of the illumination system. 
     
     
         6 . The system of  claim 5 , wherein the axis of symmetry is tilted with respect to the optical axis of the illumination system by a tilt angle. 
     
     
         7 . The system of  claim 6 , wherein the tilt angle is between 1° and 20°. 
     
     
         8 . The system of  claim 7 , wherein the tilt angle is between 3° and 8°. 
     
     
         9 . The system of  claim 5 , wherein the axis of symmetry is aligned parallel to the optical of the illumination system. 
     
     
         10 . The system of  claim 9 , wherein the axis of symmetry is spaced apart from the optical axis of the illumination system by at least 5 mm. 
     
     
         11 . The system of  claim 1 , wherein the illumination system comprises a field stop lens that images the field stop onto the object plane of the projection lens. 
     
     
         12 . The system of  claim 11 , wherein a plane defined by the position of the field stop, a principal plane of the field stop lens and the object plane of the projection lens at least approximately intersect along a straight line. 
     
     
         13 . The system of  claim 11 , wherein the field stop lens has an intermediate image plane. 
     
     
         14 . The system of  claim 13 , wherein a correction element is positioned in or in close proximity to the intermediate image plane. 
     
     
         15 . A system comprising:
 a field stop and   a field stop lens that
 images the field stop onto an image plane and 
 has an intermediate image plane, wherein the system is a microlithographic exposure apparatus illumination system. 
   
     
     
         16 . The system of  claim 15 , wherein a correction element is positioned in or in close proximity to the intermediate image plane. 
     
     
         17 . The system of  claim 16 , wherein the correction element is positioned within 100 mm off the intermediate image plane. 
     
     
         18 . The system of  claim 17 , wherein the correction element is positioned within 30 mm off the intermediate image plane. 
     
     
         19 . The system of  claim 16 , wherein the correction element is a grey filter. 
     
     
         20 . The system of  claim 16  wherein the correction element is a refractive or a diffractive optical element. 
     
     
         21 . The system of  claim 16 , wherein the correction element is a stop. 
     
     
         22 . The system of  claim 16 , wherein the correction element comprises static or individually movable semi-transparent or opaque fingers for intensity distribution control. 
     
     
         23 . The system of  claim 16 , wherein the correction element is a lens group. 
     
     
         24 . The system of  claim 24 , wherein the lens group includes at least one aspherical lens element. 
     
     
         25 . The system of  claim 16 , wherein the correction element is a polarization manipulating optical element. 
     
     
         26 . The system of  claim 25 , wherein the polarization manipulating optical element is a polarizer. 
     
     
         27 . The system of  claim 26 , wherein the polarization manipulating optical element is a rotator that rotates the polarization direction of incident linearly polarized light. 
     
     
         28 . The system of  claim 16 , wherein the correction element comprises a layered structure having a transmission that is dependent on the angle of incidence of an impinging light ray. 
     
     
         29 . The system of  claim 16 , wherein the correction element is received in a holder that allows to adjust the position of the correction element. 
     
     
         30 . The system of  claim 29 , wherein the holder allows to displace the correction element along an optical axis of the illumination system. 
     
     
         31 . The system of  claim 29 , wherein the holder allows to displace the correction element along a direction that is inclined to an optical axis of the illumination system. 
     
     
         32 . The system of  claim 29 , wherein the holder allows to tilt the correction element. 
     
     
         33 . The system of  claim 29 , wherein the holder allows to deform the correction element. 
     
     
         34 . The system of  claim 29 , wherein the holder is an exchange holder that allows to receive different correction elements. 
     
     
         35 . A system comprising:
 the microlithographic exposure apparatus illumination system according to  claim 15  wherein the system is a microlithographic exposure apparatus.   
     
     
         36 . A method, comprising:
 a) providing a substrate supporting a light sensitive layer;   b) providing a mask containing structures to be imaged onto the light sensitive layer;   c) providing a system according to  claim 1 ;   d) projecting at least a part of the mask onto the light sensitive layer.   
     
     
         37 . A method according to  claim 36 , wherein the method makes a microstructured device.