Imprint device and microstructure transfer method
Abstract
There is provided an imprint device for transferring a fine pattern to a material to form a patterned material. The device comprises a stamper having the fine pattern thereon, and a pressure distribution mechanism. The stamper is pressed against the material, and the pressure distribution mechanism provides a nonuniform pressure distribution in a patterned region of the patterned material, while the stamper is in contact with the material. There are provided an imprint device and a microstructure transfer method, by which it is possible to sufficiently spread a resin or other material for forming a pattern layer between a stamper and a patterned material with a lower pressure so as not to damage the stamper or the patterned material, and to form a pattern formation layer having the uniform thickness on the patterned material.
Claims
exact text as granted — not AI-modified1 . A microstructure transfer method comprising a step of contacting a stamper having a fine pattern thereon with a material, and a step of transferring the fine pattern of the stamper to the material by pressing the stamper against the material, so as to form a patterned material,
in the step of transferring, a nonuniform pressure distribution being provided in a patterned region of the patterned material.
2 . A microstructure transfer method according to claim 1 ,
wherein the pressure distribution has the highest pressure point in the patterned region.
3 . The microstructure transfer method according to claim 1 ,
wherein the pressure distribution defines a contour line of the highest pressure point in the patterned region, and the contour line defines a closed region in the patterned region.
4 . The microstructure transfer method according to claim 1 ,
wherein the pressure distribution changes in the patterned region over time.
5 . The microstructure transfer method according to claim 1 further comprising,
a step of pressing one of a first plate provided on one side of the stamper and a second plate provided on one side of the material against the other.
6 . The microstructure transfer method according to claim 1 further comprising,
a step of applying a material on at least one of surfaces of the material and the stamper so as to form a pattern formation layer having the fine pattern, before the stamper is pressed against the material,
the pattern formation layer being formed by spreading the applied material on the surface of the material when the stamper and the material are in contact with each other.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.