Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium

Abstract

A substrate cleaning apparatus for cleaning a substrate back surface includes a first substrate supporting portion supporting the substrate at a first area of the substrate back surface, the back surface facing down; a second substrate supporting portion supporting the substrate at a second area of the substrate back surface, the second area being separated from the first area; a cleaning liquid supplying portion supplying cleaning liquid to the substrate back surface; a drying portion drying the second area of the substrate back surface; and a cleaning portion cleaning a third area of the substrate back surface when the substrate is supported by the first substrate supporting portion, the third area including the second area, and cleaning a fourth area of the substrate back surface when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area.

1 - 26 . (canceled) 
     
     
         27 . A substrate cleaning method for cleaning a back surface of a substrate, comprising steps of:
 supporting a substrate horizontally by suctioning a first area of a back surface of the substrate, the back surface facing down;   switching a supporting area from the first area to a second area that does not overlap with the first area and horizontally supporting the substrate by suctioning the back surface of the substrate;   supplying a cleaning liquid to the back surface of the substrate supported at one of the first area and the second area;   drying the second area before switching the supporting area from the first area to the second area;   cleaning the back surface of the substrate including the second area while supporting the substrate at the first area; and   cleaning the back surface of the substrate excluding the second area while supporting the substrate at the second area.   
     
     
         28 . The substrate cleaning method of  claim 27 , further comprising a step of spinning the substrate so as to dry the back surface of the substrate by throwing off the cleaning liquid remaining on the back surface of the substrate. 
     
     
         29 . The substrate cleaning method of  claim 28 , wherein the step of drying the second area is performed by blowing air onto the back surface of the substrate. 
     
     
         30 . The substrate cleaning method of  claim 27 , wherein the step of drying the second area is performed by blowing air onto the back surface of the substrate. 
     
     
         31 . The substrate cleaning method of  claim 27 , further comprising a step of illuminating the back surface of the substrate with ultraviolet light. 
     
     
         32 . A substrate cleaning method for cleaning a back surface of a substrate, comprising steps of:
 carrying a substrate into a cup body, the substrate being supported by one of a spin chunk configured to support a center of the back surface of the substrate and configured to rotate the substrate and substrate supporting portions provided on both sides of the spin chunk so as to sandwich the spin chuck and configured to support peripheries of the back surface of the substrate, the cup body enclosing the substrate;   supporting the substrate by the supporting portions at a first position higher than an upper surface of a cleaning member configured to clean the back surface of the substrate by contacting the back surface of the substrate while positioning the spin chuck at a second position lower than the upper surface of the cleaning member;   lowering the supporting portions to the second position where the cleaning member contacts the back surface of the substrate and supplying a cleaning liquid to the back surface of the substrate while moving the supporting portions in a direction crossing an arrangement direction of the supporting portions arranged across the spin chuck and cleaning an area without being supported by the supporting portions; and   transferring the substrate from the supporting portions to the spin chuck.   
     
     
         33 . The substrate cleaning method of  claim 32 ,
 wherein the step of transferring the substrate is performed after a center of the back surface of the substrate is cleaned, and includes steps of:   supporting the center of the back surface of the substrate after being cleaned by lifting the spin chuck to the first position where the supporting portions support the substrate when the substrate is transferred from the supporting portions to the spin chuck and lowering the supporting portions; and   cleaning an area that is not supported by the spin chuck by rotating the substrate.   
     
     
         34 . A substrate cleaning apparatus for cleaning a back surface of a substrate, the apparatus comprising:
 a cleaning portion configured to clean a back surface of a substrate by contacting a cleaning member with the back surface of the substrate;   a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate;   a spin chuck configured to be rotatable and movable in a vertical direction in a state of supporting a center of the back surface of the substrate;   a substrate supporting mechanism including supporting portions provided on both sides of the spin chuck so as to sandwich the spin chuck and configured to support peripheries of the back surface of the substrate, the supporting portions being configured to be movable in a direction crossing an arrangement direction of the supporting portions arranged across the spin chuck and in a vertical direction; and   a cup body enclosing the substrate supported by one of the spin chuck and the supporting portions to prevent a cleaning liquid from being dispersed, the cup body having an opening at an upper surface thereof,   wherein the substrate supporting mechanism positions a surface of the supporting portions to support the substrate at a first position higher than an upper surface of the cleaning member while the spin chuck is placed to a second position lower than the upper surface of the cleaning member when the supporting portions support the substrate carried in the cup body through the opening, and the substrate supporting mechanism lowers the supporting portions to the second position where the cleaning member contacts the back surface of the substrate, moves the supporting portions, and transfers the substrate from the supporting portions to the spin chuck after an area that is not supported by the supporting portions when the back surface of the substrate is cleaned.   
     
     
         35 . The substrate cleaning apparatus of  claim 34 , wherein the substrate supporting mechanism transfers the substrate from the supporting portions to the spin chuck after a center of the back surface of the substrate is cleaned. 
     
     
         36 . The substrate cleaning apparatus of  claim 35 , wherein the center of the back surface of the substrate is supported after being cleaned by lifting the spin chuck to the first position where the supporting portions support the substrate, and an area that is not supported by the spin chuck is cleaned by rotating the substrate after the supporting portions are lowered when the substrate is transferred from the supporting portions to the spin chuck. 
     
     
         37 . The substrate cleaning apparatus of  claim 35 , wherein the cleaning portion includes a moving mechanism to move the cleaning member along the back surface of the substrate, and moves the cleaning member so as to clean the back surface of the substrate by drawing a concentric locus on the back surface of the substrate rotated by the spin chuck. 
     
     
         38 . The substrate cleaning apparatus of  claim 35 , wherein a cylindrical body is provided around the spin chuck, the cylindrical body including a plurality of ejection orifices provided at a top thereof and configured to eject a gas toward the back surface of the substrate. 
     
     
         39 . The substrate cleaning apparatus of  claim 35 , wherein the cleaning liquid supplying portion is provided in the cleaning portion. 
     
     
         40 . The substrate cleaning apparatus of  claim 34 , wherein the center of the back surface of the substrate is supported after being cleaned by lifting the spin chuck to the first position where the supporting portions support the substrate, and an area that is not supported by the spin chuck is cleaned by rotating the substrate after the supporting portions are lowered when the substrate is transferred from the supporting portions to the spin chuck. 
     
     
         41 . The substrate cleaning apparatus of  claim 40 , wherein the cleaning portion includes a moving mechanism to move the cleaning member along the back surface of the substrate, and moves the cleaning member so as to clean the hack surface of the substrate by drawing a concentric locus on the back surface of the substrate rotated by the spin chuck. 
     
     
         42 . The substrate cleaning apparatus of  claim 40 , wherein a cylindrical body is provided around the spin chuck, the cylindrical body including a plurality of ejection orifices provided at a top thereof and configured to eject a gas toward the back surface of the substrate. 
     
     
         43 . The substrate cleaning apparatus of  claim 40 , wherein the cleaning liquid supplying portion is provided in the cleaning portion. 
     
     
         44 . The substrate cleaning apparatus of  claim 34 , wherein the cleaning portion includes a moving mechanism to move the cleaning member along the back surface of the substrate, and moves the cleaning member so as to clean the back surface of the substrate by drawing a concentric locus on the back surface of the substrate rotated by the spin chuck. 
     
     
         45 . The substrate cleaning apparatus of  claim 34 , wherein a cylindrical body is provided around the spin chuck, the cylindrical body including a plurality of ejection orifices provided at a top thereof and configured to eject a gas toward the back surface of the substrate. 
     
     
         46 . The substrate cleaning apparatus of  claim 34 , wherein the cleaning liquid supplying portion is provided in the cleaning portion.