Polishing apparatus, method for attaching polishing pad, and method for replacing polishing pad

Abstract

The work of replacing a polishing pad is easily performed, and thermal damage is prevented from occurring in a polishing table. A polishing apparatus 100 includes a polishing table 110 having an attachment surface 110 a to which a polishing pad 108 used to polish a substrate 102 is attached. The polishing apparatus 100 also includes a silicone layer 111 provided on the attachment surface 110 a of the polishing table 110 and interposed between the polishing table 110 and the polishing pad 108 . By interposing the silicone layer 111 , it is possible to easily detach and attach the polishing pad 108 . In addition, since a heat treatment for coating the silicone layer 111 on the polishing table 110 is performed at a relatively low temperature, it is possible to prevent thermal damage from occurring in the polishing table 110 due to the heat treatment.

1 . A polishing apparatus comprising:
 a polishing table having an attachment surface to which a polishing pad used to polish a substrate is attached; and   a silicone layer provided on the attachment surface of the polishing table and interposed between the polishing table and the polishing pad.   
     
     
         2 . The polishing apparatus according to  claim 1 , wherein the silicone layer includes a silicone resin-containing adhesive agent coated on the attachment surface or a silicone resin-containing adhesive sheet bonded to the attachment surface. 
     
     
         3 . The polishing apparatus according to  claim 1 , wherein the silicone layer includes resin-based paint prepared by mixing ceramic with silicon and coated on the attachment surface. 
     
     
         4 . The polishing apparatus according to  claim 1 , wherein the polishing table is formed by containing at least one of silicon carbide, stainless steel, resin, and aluminum oxide. 
     
     
         5 . The polishing apparatus according to  claim 1 , further comprising an adhesive agent of the polishing pad interposed between the silicone layer and the polishing pad. 
     
     
         6 . The polishing apparatus according to  claim 1 , further comprising a control unit configured to pressurize or depressurize a rear surface of the polishing pad attached to the polishing table, the rear surface being a side of the polishing pad opposite to its polishing surface, wherein the control unit pressurizes the rear surface of the polishing pad in a detachment process of detaching the polishing pad from the polishing table, or pressurizes or depressurizes the rear surface of the polishing pad in an attachment process of attaching the polishing pad to the polishing table. 
     
     
         7 . The polishing apparatus according to  claim 1 , further comprising a pressing member configured to press the rear surface of the polishing pad in the detachment process of detaching the polishing pad from the polishing table, wherein the pressing member includes:
 a piston disposed in a hole formed in the attachment surface of the polishing table to which the polishing pad is attached; and   a driving member capable of driving the piston in a direction in which the rear surface of the polishing pad is pressed in the detachment process.   
     
     
         8 . A method for attaching a polishing pad, comprising the steps of:
 providing a silicone layer on an attachment surface of a polishing table having the attachment surface to which the polishing pad used to polish a substrate is attached;   heat-treating the silicone layer provided on the attachment surface; and   attaching the polishing pad onto the heat-treated silicone layer.   
     
     
         9 . A method for replacing a polishing pad including a method for attaching the polishing pad or a method for detaching the polishing pad from a polishing table, the method for attaching the polishing pad comprising the steps of: providing a silicone layer on an attachment surface of the polishing table having the attachment surface to which the polishing pad used to polish a substrate is attached; heat-treating the silicone layer provided on the attachment surface; and attaching the polishing pad onto the heat-treated silicone layer, the method for replacing the polishing pad comprising the step of:
 pressurizing a rear surface of the polishing pad attached to the polishing table in a detachment process of detaching the polishing pad from the polishing table, the rear surface being a side of the polishing pad opposite to its polishing surface, or   pressurizing or depressurizing the rear surface of the polishing pad in an attachment process of attaching the polishing pad to the polishing table.   
     
     
         10 . The method for replacing a polishing pad according to  claim 9 , wherein a piston disposed in a hole formed in the attachment surface of the polishing table to which the polishing pad is attached is driven in a direction in which the rear surface of the polishing pad is pressed in the process of detaching the polishing pad. 
     
     
         11 . The polishing apparatus according to  claim 2 , wherein the silicone layer includes resin-based paint prepared by mixing ceramic with silicon and coated on the attachment surface. 
     
     
         12 . The polishing apparatus according to  claim 11 , wherein the polishing table is formed by containing at least one of silicon carbide, stainless steel, resin, and aluminum oxide. 
     
     
         13 . The polishing apparatus according to  claim 12 , further comprising an adhesive agent of the polishing pad interposed between the silicone layer and the polishing pad. 
     
     
         14 . The polishing apparatus according to  claim 3 , wherein the polishing table is formed by containing at least one of silicon carbide, stainless steel, resin, and aluminum oxide. 
     
     
         15 . The polishing apparatus according to  claim 3 , further comprising an adhesive agent of the polishing pad interposed between the silicone layer and the polishing pad. 
     
     
         16 . The polishing apparatus according to  claim 3 , further comprising a control unit configured to pressurize or depressurize a rear surface of the polishing pad attached to the polishing table, the rear surface being a side of the polishing pad opposite to its polishing surface, wherein the control unit pressurizes the rear surface of the polishing pad in a detachment process of detaching the polishing pad from the polishing table, or pressurizes or depressurizes the rear surface of the polishing pad in an attachment process of attaching the polishing pad to the polishing table. 
     
     
         17 . The polishing apparatus according to  claim 3 , further comprising a pressing member configured to press the rear surface of the polishing pad in the detachment process of detaching the polishing pad from the polishing table, wherein the pressing member includes:
 a piston disposed in a hole formed in the attachment surface of the polishing table to which the polishing pad is attached; and   a driving member capable of driving the piston in a direction in which the rear surface of the polishing pad is pressed in the detachment process.