Compliant polishing pad and polishing module

Abstract

A polishing device includes a housing, a flexible base coupled to the housing, and a contact region disposed on a first side of the flexible base, wherein the flexible base expands and contracts based on pressure contained within the housing and a second side of the flexible base to form a contact area on the first side that is less than a surface area of the flexible base.

The invention claimed is: 
     
       1. A polishing device, comprising:
 a support arm extending in a first direction over a circular chuck from a perimeter of the chuck; 
 a movement mechanism coupled to the support arm; 
 a housing fixed to the support arm in a second direction that is orthogonal to the first direction; 
 a flexible base coupled to the housing; and 
 a contact region disposed on a first side of the flexible base and protruding from the flexible base, the contact region being shaped in an arc having a radius that has a center that is substantially positioned along an axis of rotation of the circular chuck when the support arm is disposed over the circular chuck, wherein the flexible base expands and contracts based on pressure contained within the housing and a second side of the flexible base to form a contact area on the first side that is less than a surface area of the flexible base. 
 
     
     
       2. The device of  claim 1 , wherein the contact region is positioned on the base along an arc segment. 
     
     
       3. The device of  claim 1 , wherein the contact region comprises a plurality of contact pads. 
     
     
       4. The device of  claim 1 , wherein the flexible base comprises a raised lip at a perimeter thereof. 
     
     
       5. The device of  claim 1 , wherein the contact area is adjustable. 
     
     
       6. The device of  claim 5 , wherein the adjustment of the contact area is based on a process recipe. 
     
     
       7. The device of  claim 1 , wherein the contact region is arc-shaped. 
     
     
       8. The device of  claim 1 , wherein the contact region is circular. 
     
     
       9. A polishing module, comprising:
 a rotatable chuck having a substrate receiving surface and a perimeter; 
 a support arm extending in a first direction over the perimeter of the chuck that is movable relative to the chuck; 
 a housing fixed to the support arm in a second direction that is orthogonal to the first direction; and 
 a polishing pad disposed on the housing, the polishing pad comprising a contact region positioned about a center of a flexible base and protruding from the flexible base, the contact region disposed in an arc that is at least concentric with the perimeter of the chuck, wherein the polishing pad is inflatable by pressure application to a backside of the flexible base. 
 
     
     
       10. The module of  claim 9 , wherein the contact region is detachably coupled to the flexible base. 
     
     
       11. The module of  claim 9 , wherein the contact region is arc-shaped. 
     
     
       12. The module of  claim 9 , wherein the contact region is circular. 
     
     
       13. A method of polishing a substrate, comprising:
 providing a support arm positioned about a perimeter of a chuck that is linearly movable relative to the chuck; 
 urging a polishing pad disposed on the support arm positioned in a cantilevered orientation over the chuck against a surface of a substrate positioned on the chuck, the polishing pad being disposed on a flexible base and being shaped in an arc that is concentric with an edge of the substrate; and 
 adjusting a contact area of the polishing pad by adjusting a pressure to a backside of the flexible base, wherein the contact area is less than a surface area of the flexible base and protrudes from the flexible base. 
 
     
     
       14. The method of  claim 13 , wherein the adjusting of the contact area is based on a process recipe. 
     
     
       15. The method of  claim 14 , wherein the contact area conforms to the surface of the substrate. 
     
     
       16. The method of  claim 13 , wherein the contact area is arc-shaped. 
     
     
       17. The method of  claim 16 , wherein the contact area conforms to the surface of the substrate. 
     
     
       18. The method of  claim 13 , wherein the contact area is circular. 
     
     
       19. The method of  claim 18 , wherein the contact area conforms to the surface of the substrate.