USD729753SActiveUtility

Elastic membrane for semiconductor wafer polishing

57
Assignee: EBARA CORPPriority: Dec 28, 2010Filed: Jul 10, 2014Granted: May 19, 2015
Est. expiryDec 28, 2030(~4.4 yrs left)· nominal 20-yr term from priority
Inventors:Makoto FukushimaHozumi YasudaOsamu NabeyaKatsuhide WatanabeKeisuke Namiki
57
PatentIndex Score
7
Cited by
87
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.

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