Inventor · disambiguated record
Shusaku Kido
Also filed as: KIDO SHUSAKU
24 granted patents·25 pending applications·382 citations·filing 2000–2013
96Inventor score
Top patents by PatentIndex Score
49 records- 0195US6707107B2Method of deforming a pattern and semiconductor device formed by utilizing deformed patternNEC LCD TECHNOLOGIES LTD·Filed 2001·Granted Mar 16, 2004·59 cites·59 claims
- 0293US6632696B2Manufacturing method of active matrix substrate plate and manufacturing method thereforNEC CORP·Filed 2000·Granted Oct 14, 2003·63 cites·17 claims
- 0391US6380006B2Pattern formation method and method of manufacturing display using itNEC CORP·Filed 2001·Granted Apr 30, 2002·56 cites·20 claims
- 0487US7554164B2Semiconductor device having a gap between a gate electrode and a dummy gate electrodeNEC LCD TECHNOLOGIES LTD·Filed 2005·Granted Jun 30, 2009·7 cites·2 claims
- 0587US6953976B2Method of deforming a pattern and semiconductor device formed by utilizing deformed patternNEC LCD TECHNOLOGIES LTD·Filed 2002·Granted Oct 11, 2005·21 cites·6 claims
- 0684US7807341B2Method for forming organic mask and method for forming pattern using said organic maskNEC LCD TECHNOLOGIES LTD·Filed 2005·Granted Oct 5, 2010·8 cites·10 claims
- 0781US7033951B2Process for forming pattern and method for producing liquid crystal display apparatusNEC LCD TECHNOLOGIES LTD·Filed 2002·Granted Apr 25, 2006·24 cites·14 claims
- 0880US6767694B2Process for forming pattern and method for producing liquid crystal apparatus employing process for forming patternNEC LCD TECHNOLOGIES LTD·Filed 2002·Granted Jul 27, 2004·24 cites·20 claims
- 0979US6890783B2Active matrix substrate plate and manufacturing method thereforNEC LCD TECHNOLOGIES LTD·Filed 2002·Granted May 10, 2005·20 cites·21 claims
- 1078US7060623B2Method of deforming a pattern and semiconductor device formed by utilizing deformed patternNEC LCD TECHNOLOGIES LTD·Filed 2002·Granted Jun 13, 2006·11 cites·23 claims
- 1178US6740596B2Manufacturing method of active matrix substrateNEC LCD TECHNOLOGIES LTD·Filed 2001·Granted May 25, 2004·27 cites·10 claims
- 1277US6670104B2Pattern forming method and method of manufacturing thin film transistorNEC LCD TECHNOLOGIES LTD·Filed 2001·Granted Dec 30, 2003·20 cites·11 claims
- 1376US7338911B2Method for etching and for forming a contact hole using thereofNEC LCD TECHNOLOGIES LTD·Filed 2005·Granted Mar 4, 2008·4 cites·52 claims
- 1473US6977422B2Method of deforming a pattern and semiconductor device formed by utilizing deformed patternNEC LCD TECHNOLOGIES LTD·Filed 2004·Granted Dec 20, 2005·8 cites·16 claims
- 1571US6949766B2Method of deforming a pattern and semiconductor device formed by utilizing deformed patternNEC LCD TECHNOLOGIES LTD·Filed 2004·Granted Sep 27, 2005·7 cites·5 claims
- 1668US6756187B2Method for removing patterned layer from lower layer through reflowNEC LCD TECHNOLOGIES LTD·Filed 2002·Granted Jun 29, 2004·7 cites·48 claims
- 1767US6791145B2Semiconductor device formed by utilizing deformed patternNEC LCD TECHNOLOGIES LTD·Filed 2004·Granted Sep 14, 2004·5 cites·5 claims
- 1866US7030467B2Method of deforming a pattern and semiconductor device formed by utilizing deformed patternNEC LCD TECHNOLOGIES LTD·Filed 2004·Granted Apr 18, 2006·5 cites·5 claims
- 1964US8663488B2Apparatus for processing substrate and method of doing the sameKIDO SHUSAKU·Filed 2012·Granted Mar 4, 2014·1 cites·11 claims
- 2062US7226865B2Process for forming pattern and method for producing liquid crystal display apparatusNEC LCD TECHNOLOGIES LTD·Filed 2005·Granted Jun 5, 2007·2 cites·6 claims
- 2156US2009263974A1Substrate processing system for performing exposure process in gas atmosphereKIDO SHUSAKU·Filed 2009·Application pending·0 cites
- 2255US9419105B2Method for processing substrate and method for fabricating apparatusGOLD CHARM LTD·Filed 2013·Granted Aug 16, 2016·0 cites·14 claims
- 2355US8293128B2Apparatus for processing substrate and method of doing the sameKIDO SHUSAKU·Filed 2009·Granted Oct 23, 2012·0 cites·3 claims
- 2455US2008145798A1Method of processing substrate and chemical used in the sameNEC LCD TECHNOLOGIES LTD·Filed 2008·Application pending·0 cites
- 2555US2008146801A1Method of processing substrate and chemical used in the sameNEC LCD TECHNOLOGIES LTD·Filed 2008·Application pending·0 cites
- 2655US2009135381A1Apparatus for processing substrate and method of doing the sameNEC LCD TECHNOLOGIES LTD·Filed 2009·Application pending·0 cites
- 2754US2007272355A1Apparatus for processing substrate and method of doing the sameNEC LCD TECHNOLOGIES LTD·Filed 2007·Application pending·0 cites
- 2853US2006115924A1Method of forming a deformed pattern over a substrateNEC LCD TECHNOLOGIES LTD·Filed 2006·Application pending·0 cites
- 2953US2008121173A1Substrate processing system for performing exposure process in gas atmosphereKIDO SHUSAKU·Filed 2007·Application pending·0 cites
- 3052US2008283496A1Method for etching and for forming a contact hole using thereofNEC LCD TECHNOLOGIES LTD·Filed 2007·Application pending·0 cites
- 3151US6617263B2Pattern forming method for flattening an organic film for a liquid crystal display deviceNEC LCD TECHNOLOGIES LTD·Filed 2002·Granted Sep 9, 2003·3 cites·13 claims
- 3250US2006157199A1Substrate processing system for performing exposure process in gas atmosphereKIDO SHUSAKU·Filed 2005·Application pending·0 cites
- 3350US2006070702A1Substrate processing system for performing exposure process in gas atmosphereKIDO SHUSAKU·Filed 2005·Application pending·0 cites
- 3450US2006130759A1Substrate processing system for performing exposure process in gas atmosphereKIDO SHUSAKU·Filed 2005·Application pending·0 cites
- 3550US2006273071A1Method of processing substrate and chemical used in the sameNEC LCD TECHNOLOGIES LTD·Filed 2006·Application pending·0 cites
- 3650US2011229831A1Apparatus for processing substrate and method of doing the sameNEC CORP·Filed 2011·Application pending·0 cites
- 3750US2006090852A1Substrate processing system for performing exposure process in gas atmosphereKIDO SHUSAKU·Filed 2005·Application pending·0 cites
- 3850US2006090853A1Substrate processing system for performing exposure process in gas atmosphereKIDO SHUSAKU·Filed 2005·Application pending·0 cites
- 3946US2010327218A1Chemical solution for selectively treating or removing a deteriorated layer at a surface of an organic film, and method for using suchNEC LCD TECHNOLOGIES LTD·Filed 2010·Application pending·0 cites
- 4045US2008266489A1Method of fabricating light-reflector in liquid crystal display deviceNEC LCD TECHNOLOGIES LTD·Filed 2008·Application pending·0 cites
- 4145US2007224547A1Method of processing substrateNEC LCD TECHNOLOGIES LTD·Filed 2007·Application pending·0 cites
- 4244US7214473B2Method for removing patterned layer from lower layer through reflowNEC LCD TECHNOLOGIES LTD·Filed 2004·Granted May 8, 2007·0 cites·31 claims
- 4344US2005061439A1Method of processing substrate and chemical used in the sameNEC LCD TECHNOLOGIES LTD·Filed 2004·Application pending·0 cites
- 4444US2005064614A1Method of processing substrate and chemical used in the sameNEC LCD TECHNOLOGIES LTD·Filed 2004·Application pending·0 cites
- 4544US2005062952A1Apparatus for processing substrate and method of doing the sameNEC LCD TECHNOLOGIES LTD·Filed 2004·Application pending·0 cites
- 4644US2005087301A1Apparatus for processing substrate and method of doing the sameNEC LCD TECHNOLOGIES LTD·Filed 2004·Application pending·0 cites
- 4743US2003041971A1Substrate processing system for performing exposure process in gas atmosphereNEC CORP·Filed 2002·Application pending·0 cites
- 4840US2006093968A1Method of processing substrate and chemical used in the sameNEC LCD TECHNOLOGIES LTD·Filed 2005·Application pending·0 cites
- 4940US2006093969A1Method of processing substrate and chemical used in the sameNEC LCD TECHNOLOGIES LTD·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →