Inventor · disambiguated record
Geng-Shin Shen
Also filed as: SHEN GENG S · SHEN GENG-SHIN
55 granted patents·25 pending applications·261 citations·filing 2005–2016
98Inventor score
Files withCHIPMOS TECHNOLOGIES INC44SHEN GENG-SHIN17CHIPMOS TECHNOLOGIES BERMUDA6CHEN YU-REN2CHIPMOS TECHNOLOGY INC2
Top patents by PatentIndex Score
80 records- 0198US7662667B2Die rearrangement package structure using layout process to form a compliant configurationCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Feb 16, 2010·63 cites·12 claims
- 0294US7927922B2Dice rearrangement package structure using layout process to form a compliant configurationCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Apr 19, 2011·30 cites·36 claims
- 0394US7915690B2Die rearrangement package structure using layout process to form a compliant configurationCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Mar 29, 2011·26 cites·4 claims
- 0491US7615853B2Chip-stacked package structure having leadframe with multi-piece bus barCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Nov 10, 2009·21 cites·14 claims
- 0590US7663246B2Stacked chip packaging with heat sink structureCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Feb 16, 2010·22 cites·20 claims
- 0688US7816771B2Stacked chip package structure with leadframe having inner leads with transfer padCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Oct 19, 2010·14 cites·3 claims
- 0787US8431437B2Packaging method involving rearrangement of diceCHEN YU-REN·Filed 2011·Granted Apr 30, 2013·8 cites·16 claims
- 0879US7786595B2Stacked chip package structure with leadframe having bus barCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Aug 31, 2010·7 cites·13 claims
- 0978US8431478B2Solder cap bump in semiconductor package and method of manufacturing the sameSHEN GENG-SHIN·Filed 2011·Granted Apr 30, 2013·5 cites·12 claims
- 1077US7576416B2Chip package having with asymmetric molding and turbulent plate downset designCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Aug 18, 2009·7 cites·18 claims
- 1175US8962395B2QFN package and manufacturing process thereofCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Feb 24, 2015·3 cites·5 claims
- 1274US7700412B2Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layersCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Apr 20, 2010·5 cites·14 claims
- 1371US7385282B2Stacked-type chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2005·Granted Jun 10, 2008·4 cites·6 claims
- 1470US7902649B2Leadframe for leadless package, structure and manufacturing method using the sameCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Mar 8, 2011·3 cites·12 claims
- 1570US7851896B2Quad flat non-leaded chip packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Dec 14, 2010·4 cites·13 claims
- 1669US7446407B2Chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2005·Granted Nov 4, 2008·4 cites·13 claims
- 1768US7981725B2Fabricating process of a chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2010·Granted Jul 19, 2011·2 cites·23 claims
- 1867US8426255B2Chip package structure and method for manufacturing the sameSHEN GENG-SHIN·Filed 2011·Granted Apr 23, 2013·2 cites·21 claims
- 1967US7749806B2Fabricating process of a chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Jul 6, 2010·3 cites·13 claims
- 2066US8809088B2Structure of stacking chips and method for manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Aug 19, 2014·2 cites·5 claims
- 2166US7560306B2Manufacturing process for chip package without coreCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jul 14, 2009·3 cites·24 claims
- 2264US7538419B2Stacked-type chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted May 26, 2009·2 cites·7 claims
- 2363US7803666B2Manufacturing process for a Quad Flat Non-leaded chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Sep 28, 2010·2 cites·23 claims
- 2463US7795079B2Manufacturing process for a quad flat non-leaded chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Sep 14, 2010·2 cites·28 claims
- 2563US7504714B2Chip package with asymmetric moldingCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Mar 17, 2009·2 cites·12 claims
- 2662US8786082B2Semiconductor structure having no adjacent bumps between two adjacent padsCHIPMOS TECHNOLOGIES INC·Filed 2012·Granted Jul 22, 2014·1 cites·17 claims
- 2762US8212347B2Stacked chip package structure with leadframe having bus barSHEN GENG-SHIN·Filed 2010·Granted Jul 3, 2012·1 cites·12 claims
- 2862US7960214B2Chip packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Jun 14, 2011·2 cites·18 claims
- 2962US7803667B2Manufacturing process for a quad flat non-leaded chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Sep 28, 2010·2 cites·21 claims
- 3062US7638880B2Chip packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Dec 29, 2009·2 cites·17 claims
- 3161US8207603B2Stacked chip package structure with leadframe having inner leads with transfer padSHEN GENG-SHIN·Filed 2010·Granted Jun 26, 2012·1 cites·8 claims
- 3261US8169061B2Stacked chip package structure with leadframe having bus barSHEN GENG-SHIN·Filed 2010·Granted May 1, 2012·1 cites·11 claims
- 3361US7696629B2Chip-stacked package structureCHIPMOS TECHNOLOGY INC·Filed 2007·Granted Apr 13, 2010·2 cites·13 claims
- 3458US7919358B2Method for fabricating multi-chip stacked packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Apr 5, 2011·1 cites·22 claims
- 3553US7834432B2Chip package having asymmetric moldingCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Nov 16, 2010·0 cites·15 claims
- 3653US2009047754A1Packaging method involving rearrangement of diceCHIPMOS TECHNOLOGIES BERMUDA·Filed 2008·Application pending·0 cites
- 3752US8093106B2Method for manufacturing packaging structureWang jun-yong·Filed 2009·Granted Jan 10, 2012·1 cites·10 claims
- 3852US2009026632A1Chip-to-chip package and process thereofCHIPMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 3951US2010006997A1Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus BarSHEN GENG-SHIN·Filed 2009·Application pending·0 cites
- 4050US9159685B2Conductive structure and method for forming the sameCHIPMOS TECHNOLOGIES INC·Filed 2014·Granted Oct 13, 2015·0 cites·6 claims
- 4149US8426245B2Packaging method involving rearrangement of diceCHEN YU-REN·Filed 2011·Granted Apr 23, 2013·0 cites·14 claims
- 4249US7964940B2Chip package with asymmetric moldingCHIPMOS TECHNOLOGIES·Filed 2008·Granted Jun 21, 2011·0 cites·9 claims
- 4349US7851262B2Manufacturing process for a chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Dec 14, 2010·0 cites·13 claims
- 4448US7851270B2Manufacturing process for a chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Dec 14, 2010·0 cites·15 claims
- 4548US7790514B2Manufacturing process for a chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Sep 7, 2010·0 cites·18 claims
- 4647US8872336B2Conductive structure and method for forming the sameCHIPMOS TECHNOLOGIES INC·Filed 2012·Granted Oct 28, 2014·0 cites·10 claims
- 4747US7847414B2Chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Dec 7, 2010·0 cites·18 claims
- 4847US2009068797A1Manufacturing process for a quad flat non-leaded chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 4947US2007215992A1Chip package and wafer treating method for making adhesive chipsSHEN GENG-SHIN·Filed 2006·Application pending·0 cites
- 5046US8712932B2Computer implemented apparatus for generating and filtering creative proposalSHEN GENG-SHIN·Filed 2012·Granted Apr 29, 2014·0 cites·11 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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