Inventor · disambiguated record
Meihua Shen
Also filed as: SHEN MEIHUA
43 granted patents·29 pending applications·695 citations·filing 2000–2024
98Inventor score
Top patents by PatentIndex Score
72 records- 0199US9431268B2Isotropic atomic layer etch for silicon and germanium oxidesLAM RES CORP·Filed 2015·Granted Aug 30, 2016·135 cites·20 claims
- 0298US9870899B2Cobalt etch backLAM RES CORP·Filed 2015·Granted Jan 16, 2018·32 cites·19 claims
- 0398US9257638B2Method to etch non-volatile metal materialsLAM RES CORP·Filed 2014·Granted Feb 9, 2016·55 cites·18 claims
- 0497US10096487B2Atomic layer etching of tungsten and other metalsLAM RES CORP·Filed 2016·Granted Oct 9, 2018·24 cites·16 claims
- 0597US9130158B1Method to etch non-volatile metal materialsLAM RES CORP·Filed 2014·Granted Sep 8, 2015·44 cites·19 claims
- 0695US9984858B2ALE smoothness: in and outside semiconductor industryLAM RES CORP·Filed 2016·Granted May 29, 2018·10 cites·20 claims
- 0795US9953843B2Chamber for patterning non-volatile metalsLAM RES CORP·Filed 2016·Granted Apr 24, 2018·15 cites·21 claims
- 0895US7064078B2Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemeAPPLIED MATERIALS INC·Filed 2004·Granted Jun 20, 2006·114 cites·23 claims
- 0994US10784086B2Cobalt etch backLAM RES CORP·Filed 2017·Granted Sep 22, 2020·9 cites·14 claims
- 1092US7718081B2Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemesAPPLIED MATERIALS INC·Filed 2006·Granted May 18, 2010·17 cites·20 claims
- 1189US10304659B2Ale smoothness: in and outside semiconductor industryLAM RES CORP·Filed 2018·Granted May 28, 2019·4 cites·20 claims
- 1285US7368394B2Etch methods to form anisotropic features for high aspect ratio applicationsAPPLIED MATERIALS INC·Filed 2006·Granted May 6, 2008·11 cites·20 claims
- 1384US9391267B2Method to etch non-volatile metal materialsLAM RES CORP·Filed 2015·Granted Jul 12, 2016·3 cites·20 claims
- 1483US7504338B2Method of pattern etching a silicon-containing hard maskAPPLIED MATERIALS INC·Filed 2006·Granted Mar 17, 2009·9 cites·33 claims
- 1583US6566270B1Integration of silicon etch and chamber cleaning processesAPPLIED MATERIALS INC·Filed 2000·Granted May 20, 2003·31 cites·26 claims
- 1681US6797188B1Self-cleaning process for etching silicon-containing materialFiled 2000·Granted Sep 28, 2004·32 cites·72 claims
- 1780US9818633B2Equipment front end module for transferring wafers and method of transferring wafersLAM RES CORP·Filed 2014·Granted Nov 14, 2017·5 cites·19 claims
- 1880US6599437B2Method of etching organic antireflection coating (ARC) layersAPPLIED MATERIALS INC·Filed 2001·Granted Jul 29, 2003·25 cites·36 claims
- 1979US6551941B2Method of forming a notched silicon-containing gate structureAPPLIED MATERIALS INC·Filed 2001·Granted Apr 22, 2003·27 cites·88 claims
- 2077US10199235B2Liner and barrier applications for subtractive metal integrationLAM RES CORP·Filed 2018·Granted Feb 5, 2019·2 cites·12 claims
- 2176US11488812B2Method and apparatus for reducing particle defects in plasma etch chambersAPPLIED MATERIALS INC·Filed 2019·Granted Nov 1, 2022·1 cites·9 claims
- 2276US10658161B2Method and apparatus for reducing particle defects in plasma etch chambersWANG XIKUN·Filed 2011·Granted May 19, 2020·4 cites·18 claims
- 2376US7648914B2Method for etching having a controlled distribution of process resultsAPPLIED MATERIALS INC·Filed 2006·Granted Jan 19, 2010·6 cites·20 claims
- 2472US11239420B2Conformal damage-free encapsulation of chalcogenide materialsLAM RES CORP·Filed 2018·Granted Feb 1, 2022·1 cites·17 claims
- 2572US9570320B2Method to etch copper barrier filmLAM RES CORP·Filed 2014·Granted Feb 14, 2017·3 cites·22 claims
- 2672US8501626B2Methods for high temperature etching a high-K material gate structureLIU WEI·Filed 2008·Granted Aug 6, 2013·4 cites·13 claims
- 2771US8722547B2Etching high K dielectrics with high selectivity to oxide containing layers at elevated temperatures with BC13 based etch chemistriesMANI RADHIKA·Filed 2007·Granted May 13, 2014·5 cites·11 claims
- 2871US2024387258A1Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2024·Application pending·0 cites
- 2970US8133817B2Shallow trench isolation etch processSASANO HIROKI·Filed 2008·Granted Mar 13, 2012·7 cites·23 claims
- 3070US6784110B2Method of etching shaped features on a substrateFiled 2002·Granted Aug 31, 2004·14 cites·29 claims
- 3170US6383941B1Method of etching organic ARCs in patterns having variable spacingsAPPLIED MATERIALS INC·Filed 2000·Granted May 7, 2002·13 cites·17 claims
- 3267US7780862B2Device and method for etching flash memory gate stacks comprising high-k dielectricAPPLIED MATERIALS INC·Filed 2006·Granted Aug 24, 2010·2 cites·11 claims
- 3366US11832533B2Conformal damage-free encapsulation of chalcogenide materialsLAM RES CORP·Filed 2021·Granted Nov 28, 2023·0 cites·15 claims
- 3466US8101525B2Method for fabricating a semiconductor device having a lanthanum-family-based oxide layerSHEN MEIHUA·Filed 2009·Granted Jan 24, 2012·4 cites·21 claims
- 3564US7754610B2Process for etching tungsten silicide overlying polysilicon particularly in a flash memoryAPPLIED MATERIALS INC·Filed 2006·Granted Jul 13, 2010·2 cites·35 claims
- 3664US6635573B2Method of detecting an endpoint during etching of a material within a recessAPPLIED MATERIALS INC·Filed 2001·Granted Oct 21, 2003·11 cites·29 claims
- 3763US9899234B2Liner and barrier applications for subtractive metal integrationLAM RES CORP·Filed 2014·Granted Feb 20, 2018·1 cites·17 claims
- 3862US7910488B2Alternative method for advanced CMOS logic gate etch applicationsAPPLIED MATERIALS INC·Filed 2007·Granted Mar 22, 2011·1 cites·30 claims
- 3959US9533332B2Methods for in-situ chamber clean utilized in an etching processing chamberSUN NOEL·Filed 2012·Granted Jan 3, 2017·4 cites·14 claims
- 4059US6933243B2High selectivity and residue free process for metal on thin dielectric gate etch applicationAPPLIED MATERIALS INC·Filed 2002·Granted Aug 23, 2005·8 cites·18 claims
- 4155US11792987B2Self-aligned vertical integration of three-terminal memory devicesLAM RES CORP·Filed 2019·Granted Oct 17, 2023·0 cites·31 claims
- 4254US12080592B2Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2019·Granted Sep 3, 2024·0 cites·8 claims
- 4353US2024381790A1Techniques and apparatuses for processing chalcogenidesLAM RES CORP·Filed 2022·Application pending·0 cites
- 4453US2009221150A1Etch rate and critical dimension uniformity by selection of focus ring materialAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 4551US2008011423A1Device and method for etching flash memory gate stacks comprising high-k dielectricAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4651US2018204738A1Chamber for patterning non-volatile metalsLAM RES CORP·Filed 2018·Application pending·0 cites
- 4750US2025308894A1Hardmask for high aspect ratio dielectric etch at cryo and elevated temperaturesLAM RES CORP·Filed 2023·Application pending·0 cites
- 4848US2009221149A1Multiple port gas injection system utilized in a semiconductor processing systemHAMMOND IV EDWARD P·Filed 2008·Application pending·0 cites
- 4947US2013344701A1Methods for high temperature etching a high-k gate structureLIU WEI·Filed 2013·Application pending·0 cites
- 5047US2007281479A1Process including silo-chloro passivation for etching tungsten silicide overlying polysiliconAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
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