Inventor · disambiguated record
Roy H. Magnuson
Also filed as: MAGNUSON ROY · MAGNUSON ROY H · MAGNUSON ROY HARVEY
36 granted patents·5 pending applications·1,141 citations·filing 1984–2014
98Inventor score
Files withIBM27ENDICOTT INTERCONNECT TECH INC8DAS RABINDRA N2CHO JUNGHYUN1ENDICOTT INTERCONECT TECHNOLOG1
Top patents by PatentIndex Score
41 records- 0198US5487218AMethod for making printed circuit boards with selectivity filled plated through holesIBM·Filed 1994·Granted Jan 30, 1996·284 cites·2 claims
- 0296US6204453B1Two signal one power plane circuit boardIBM·Filed 1998·Granted Mar 20, 2001·173 cites·6 claims
- 0394US7738249B2Circuitized substrate with internal cooling structure and electrical assembly utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 15, 2010·32 cites·22 claims
- 0494US6268016B1Manufacturing computer systems with fine line circuitized substratesIBM·Filed 1996·Granted Jul 31, 2001·89 cites·21 claims
- 0594US5557844AMethod of preparing a printed circuit boardIBM·Filed 1995·Granted Sep 24, 1996·138 cites·1 claims
- 0691US6630743B2Copper plated PTH barrels and methods for fabricatingIBM·Filed 2001·Granted Oct 7, 2003·53 cites·11 claims
- 0790US7442879B2Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrateENDICOTT INTERCONECT TECHNOLOG·Filed 2005·Granted Oct 28, 2008·23 cites·40 claims
- 0889US7541058B2Method of making circuitized substrate with internal optical pathwayENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 2, 2009·20 cites·18 claims
- 0987US7566939B2Fabrication of silicon micro-mechanical structuresIBM·Filed 2005·Granted Jul 28, 2009·10 cites·10 claims
- 1084US7713767B2Method of making circuitized substrate with internal optical pathway using photolithographyENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted May 11, 2010·13 cites·13 claims
- 1184US7353590B2Method of forming printed circuit cardIBM·Filed 2005·Granted Apr 8, 2008·10 cites·15 claims
- 1284US4948707AConditioning a non-conductive substrate for subsequent selective deposition of a metal thereonIBM·Filed 1988·Granted Aug 14, 1990·52 cites·20 claims
- 1382US7169313B2Plating method for circuitized substratesENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jan 30, 2007·13 cites·15 claims
- 1479US6201194B1Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectricIBM·Filed 1998·Granted Mar 13, 2001·43 cites·13 claims
- 1578US7679005B2Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 16, 2010·8 cites·20 claims
- 1676US9451693B2Electrically conductive adhesive (ECA) for multilayer device interconnectsDAS RABINDRA N·Filed 2011·Granted Sep 20, 2016·2 cites·43 claims
- 1776US8882983B2Embedded thin filmsCHO JUNGHYUN·Filed 2009·Granted Nov 11, 2014·1 cites·31 claims
- 1876US6750405B1Two signal one power plane circuit boardIBM·Filed 2000·Granted Jun 15, 2004·19 cites·2 claims
- 1971US6852152B2Colloidal seed formulation for printed circuit board metallizationIBM·Filed 2002·Granted Feb 8, 2005·12 cites·14 claims
- 2070US6436803B2Manufacturing computer systems with fine line circuitized substratesIBM·Filed 2001·Granted Aug 20, 2002·11 cites·33 claims
- 2165US5427895ASemi-subtractive circuitizationIBM·Filed 1993·Granted Jun 27, 1995·27 cites·20 claims
- 2262US6949397B2Fabrication of silicon micro mechanical structuresIBM·Filed 2002·Granted Sep 27, 2005·6 cites·12 claims
- 2362US4623554AMethod for controlling plating rate in an electroless plating systemIBM·Filed 1985·Granted Nov 18, 1986·20 cites·9 claims
- 2461US10064283B2Embedded thin filmsUNIV NEW YORK STATE RES FOUND·Filed 2014·Granted Aug 28, 2018·0 cites·20 claims
- 2559US4904506ACopper deposition from electroless plating bathIBM·Filed 1987·Granted Feb 27, 1990·19 cites·23 claims
- 2658US6986198B2Method of forming printed circuit cardIBM·Filed 2003·Granted Jan 17, 2006·6 cites·6 claims
- 2751US2006121722A1Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical componentsENDICOTT INTERCONNECT TECH INC·Filed 2006·Application pending·0 cites
- 2850US4684545AElectroless plating with bi-level control of dissolved oxygenIBM·Filed 1986·Granted Aug 4, 1987·14 cites·8 claims
- 2950US2005042383A1Colloidal seed formation for printed circuit board metallizationIBM·Filed 2004·Application pending·0 cites
- 3049US6699350B2Dielectric structure and method of formationIBM·Filed 2002·Granted Mar 2, 2004·2 cites·22 claims
- 3149US6495239B1Dielectric structure and method of formationIBM·Filed 1999·Granted Dec 17, 2002·13 cites·6 claims
- 3245US2009035455A1Adhesive bleed prevention method and product produced from sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Application pending·0 cites
- 3343US8685284B2Conducting paste for device level interconnectsDAS RABINDRA N·Filed 2010·Granted Apr 1, 2014·0 cites·9 claims
- 3442US6179990B1Biased acid cleaning of a copper-invar-copper laminateIBM·Filed 1999·Granted Jan 30, 2001·9 cites·18 claims
- 3542US2009241332A1Circuitized substrate and method of making sameLAUFFER JOHN M·Filed 2008·Application pending·0 cites
- 3640US2003209799A1Copper plated PTH barrels and methods for fabricatingIBM·Filed 2003·Application pending·0 cites
- 3738USRE37840EMethod of preparing a printed circuit boardIBM·Filed 1998·Granted Sep 17, 2002·5 cites·23 claims
- 3838US6228246B1Removal of metal skin from a copper-Invar-copper laminateIBM·Filed 1999·Granted May 8, 2001·7 cites·45 claims
- 3934US4666858ADetermination of amount of anionic material in a liquid sampleIBM·Filed 1984·Granted May 19, 1987·4 cites·20 claims
- 4031US7635552B2Photoresist composition with antibacterial agentENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Dec 22, 2009·0 cites·23 claims
- 4130US4967690AElectroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance meansIBM·Filed 1990·Granted Nov 6, 1990·3 cites·2 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →