Inventor · disambiguated record
Boyi Fu
Also filed as: FU BOYI
27 granted patents·13 pending applications·248 citations·filing 2015–2024
96Inventor score
Files withAPPLIED MATERIALS INC32APPLE INC6CHENGDU INFORMATION TECH OF CAS CO LTD1GANAPATHIAPPAN SIVAPACKIA1
Top patents by PatentIndex Score
40 records- 0199US11745302B2Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing processAPPLIED MATERIALS INC·Filed 2021·Granted Sep 5, 2023·5 cites·20 claims
- 0299US10456886B2Porous chemical mechanical polishing padsAPPLIED MATERIALS INC·Filed 2016·Granted Oct 29, 2019·26 cites·20 claims
- 0399US10399201B2Advanced polishing pads having compositional gradients by use of an additive manufacturing processAPPLIED MATERIALS INC·Filed 2016·Granted Sep 3, 2019·24 cites·21 claims
- 0499US10391605B2Method and apparatus for forming porous advanced polishing pads using an additive manufacturing processAPPLIED MATERIALS INC·Filed 2016·Granted Aug 27, 2019·19 cites·12 claims
- 0598US11724362B2Polishing pads produced by an additive manufacturing processAPPLIED MATERIALS INC·Filed 2020·Granted Aug 15, 2023·5 cites·24 claims
- 0698US10211072B2Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Feb 19, 2019·37 cites·17 claims
- 0797US10953515B2Apparatus and method of forming a polishing pads by use of an additive manufacturing processAPPLIED MATERIALS INC·Filed 2016·Granted Mar 23, 2021·16 cites·29 claims
- 0897US10875145B2Polishing pads produced by an additive manufacturing processAPPLIED MATERIALS INC·Filed 2015·Granted Dec 29, 2020·17 cites·19 claims
- 0997US10875153B2Advanced polishing pad materials and formulationsAPPLIED MATERIALS INC·Filed 2016·Granted Dec 29, 2020·16 cites·21 claims
- 1097US10821573B2Polishing pads produced by an additive manufacturing processAPPLIED MATERIALS INC·Filed 2015·Granted Nov 3, 2020·17 cites·25 claims
- 1197US10618141B2Apparatus for forming a polishing article that has a desired zeta potentialAPPLIED MATERIALS INC·Filed 2016·Granted Apr 14, 2020·18 cites·20 claims
- 1297US10384330B2Polishing pads produced by an additive manufacturing processAPPLIED MATERIALS INC·Filed 2015·Granted Aug 20, 2019·22 cites·22 claims
- 1396US10032827B2Systems and methods for transfer of micro-devicesAPPLIED MATERIALS INC·Filed 2016·Granted Jul 24, 2018·13 cites·17 claims
- 1493US11446788B2Precursor formulations for polishing pads produced by an additive manufacturing processAPPLIED MATERIALS INC·Filed 2019·Granted Sep 20, 2022·3 cites·18 claims
- 1589US10692923B2Systems and methods for transfer of micro-devicesAPPLIED MATERIALS INC·Filed 2018·Granted Jun 23, 2020·4 cites·16 claims
- 1686US2024123568A1Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing processAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1785US2023330805A1Porous chemical mechanical polishing padsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1883US11772229B2Method and apparatus for forming porous advanced polishing pads using an additive manufacturing processAPPLIED MATERIALS INC·Filed 2019·Granted Oct 3, 2023·1 cites·18 claims
- 1983US11251226B2Systems and methods for transfer of micro-devicesAPPLIED MATERIALS INC·Filed 2020·Granted Feb 15, 2022·1 cites·9 claims
- 2082US2022402091A1Method and apparatus for forming porous advanced polishing pads using an additive manufacturing processAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2181US12332430B2Seals for optical componentsAPPLE INC·Filed 2023·Granted Jun 17, 2025·0 cites·16 claims
- 2281US2023294239A1Formulations for advanced polishing padsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2380US12157289B2Seals for optical componentsAPPLE INC·Filed 2023·Granted Dec 3, 2024·0 cites·30 claims
- 2480US11826876B2Hydrophilic and zeta potential tunable chemical mechanical polishing padsAPPLIED MATERIALS INC·Filed 2019·Granted Nov 28, 2023·1 cites·19 claims
- 2578US11685014B2Formulations for advanced polishing padsAPPLIED MATERIALS INC·Filed 2019·Granted Jun 27, 2023·1 cites·19 claims
- 2676US11843025B2Methods for transfer of micro-devicesAPPLIED MATERIALS INC·Filed 2022·Granted Dec 12, 2023·0 cites·13 claims
- 2776US2021347005A1Polishing pad with window and manufacturing methods thereofAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2874US11980992B2Integrated abrasive polishing pads and manufacturing methodsAPPLIED MATERIALS INC·Filed 2022·Granted May 14, 2024·0 cites·19 claims
- 2974US11471999B2Integrated abrasive polishing pads and manufacturing methodsAPPLIED MATERIALS INC·Filed 2018·Granted Oct 18, 2022·1 cites·14 claims
- 3073US11964359B2Apparatus and method of forming a polishing article that has a desired zeta potentialAPPLIED MATERIALS INC·Filed 2019·Granted Apr 23, 2024·1 cites·26 claims
- 3171US2019224809A1Porous chemical mechanical polishing padsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3269US11072050B2Polishing pad with window and manufacturing methods thereofAPPLIED MATERIALS INC·Filed 2018·Granted Jul 27, 2021·0 cites·20 claims
- 3363US11644617B1Systems having fibers with antireflection coatingsAPPLE INC·Filed 2021·Granted May 9, 2023·0 cites·20 claims
- 3462US2025028085A1Seals for Optical ComponentsAPPLE INC·Filed 2024·Application pending·0 cites
- 3560US2023382085A1Seals for Optical ComponentsAPPLE INC·Filed 2023·Application pending·0 cites
- 3659US2019181019A1Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3756US2020157265A1Low Viscosity UV-Curable Formulation For 3D PrintingGANAPATHIAPPAN SIVAPACKIA·Filed 2019·Application pending·0 cites
- 3855US2024074665A1Core temperature sensing with wearable electronic deviceAPPLE INC·Filed 2022·Application pending·0 cites
- 3947US2023122927A1Small object detection method and apparatus, readable storage medium, and electronic deviceCHENGDU INFORMATION TECH OF CAS CO LTD·Filed 2022·Application pending·0 cites
- 4041US2019139788A1Apparatus and methods for packaging semiconductor diesAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →