Inventor · disambiguated record
Hidenari Yoshida
Also filed as: YOSHIDA HIDENARI
44 granted patents·6 pending applications·767 citations·filing 2012–2024
98Inventor score
Top patents by PatentIndex Score
50 records- 0199USD770993SReaction tubeHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 8, 2016·485 cites·1 claims
- 0293US10731254B2Protective plate, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 4, 2020·3 cites·10 claims
- 0392US10453735B2Substrate processing apparatus, reaction tube, semiconductor device manufacturing method, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 22, 2019·8 cites·5 claims
- 0491US10950457B2Substrate processing device, manufacturing method for semiconductor device, and reaction tubeKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 16, 2021·5 cites·17 claims
- 0587USD846514SBoat of substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Apr 23, 2019·28 cites·1 claims
- 0686US11685992B2Substrate processing apparatus, quartz reaction tube and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 27, 2023·2 cites·10 claims
- 0785US12062546B2Substrate processing device, manufacturing method for semiconductor device, and reaction tubeKOKUSAI ELECTRIC CORP·Filed 2021·Granted Aug 13, 2024·1 cites·18 claims
- 0885US11155920B2Substrate processing apparatus, and method for manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 26, 2021·1 cites·16 claims
- 0985US10689758B2Substrate processing apparatus, and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Granted Jun 23, 2020·3 cites·14 claims
- 1085US2025101583A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1184US12203167B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jan 21, 2025·0 cites·15 claims
- 1283US11495477B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2018·Granted Nov 8, 2022·2 cites·16 claims
- 1383US10811271B2Substrate processing device, manufacturing method for semiconductor device, and reaction tubeHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 20, 2020·4 cites·12 claims
- 1483US10808318B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 20, 2020·3 cites·10 claims
- 1581USD839219SBoat for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2016·Granted Jan 29, 2019·21 cites·1 claims
- 1681USD772824SReaction tubeHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 29, 2016·21 cites·1 claims
- 1780US11542601B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 3, 2023·2 cites·17 claims
- 1880USD791090SReaction tubeHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 4, 2017·19 cites·1 claims
- 1979US11859280B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jan 2, 2024·0 cites·14 claims
- 2079US10961625B2Substrate processing apparatus, reaction tube and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 30, 2021·2 cites·20 claims
- 2178US11453942B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 27, 2022·1 cites·18 claims
- 2278USD747279SBoat for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Granted Jan 12, 2016·21 cites·1 claims
- 2378USD738329SBoat for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Granted Sep 8, 2015·21 cites·1 claims
- 2475US11952664B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 9, 2024·0 cites·17 claims
- 2575US11222796B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 11, 2022·1 cites·18 claims
- 2675USD734730SBoat of substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Granted Jul 21, 2015·19 cites·1 claims
- 2774USD737785SBoat for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Granted Sep 1, 2015·18 cites·1 claims
- 2872USD847105SBoat of substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Apr 30, 2019·13 cites·1 claims
- 2971US10615061B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2016·Granted Apr 7, 2020·1 cites·14 claims
- 3070US8791031B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Granted Jul 29, 2014·2 cites·10 claims
- 3168USD937385SReturn nozzleKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 30, 2021·10 cites·1 claims
- 3265USD916037SCover of seal cap for reaction chamber for semiconductorKOKUSAI ELECTRIC CORP·Filed 2018·Granted Apr 13, 2021·9 cites·1 claims
- 3364USD872037SCover of seal cap for reaction chamber for semiconductor manufacturingHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 7, 2020·9 cites·1 claims
- 3464USD842823SReaction tubeHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 12, 2019·9 cites·1 claims
- 3562USD843958SReaction tubeHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 26, 2019·8 cites·1 claims
- 3661USD855027SCover of seal cap for reaction chamber of semiconductorHITACHI INT ELECTRIC INC·Filed 2018·Granted Jul 30, 2019·8 cites·1 claims
- 3760US11990359B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted May 21, 2024·0 cites·19 claims
- 3859USD847301SReturn nozzleHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 30, 2019·7 cites·1 claims
- 3956US11898247B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 13, 2024·0 cites·19 claims
- 4051US9111748B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Aug 18, 2015·0 cites·17 claims
- 4147US10923366B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 16, 2021·0 cites·12 claims
- 4244US2015315702A1Substrate Processing ApparatusHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 4342US11001924B2Substrate processing apparatus, nozzle base, and manufacturing method for semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted May 11, 2021·0 cites·11 claims
- 4441US9957616B2Substrate processing apparatus and heating unitHITACHI INT ELECTRIC INC·Filed 2016·Granted May 1, 2018·0 cites·10 claims
- 4541US2019071777A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 4640US2018202043A1Gas supply system, substrate processing apparatus, and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Application pending·0 cites
- 4737US2017183770A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Application pending·0 cites
- 4837US2012258018A1Substrate processing apparatus, and transport deviceNISHITANI EISUKE·Filed 2012·Application pending·0 cites
- 4930USD928106SSupporting column of insulation unit for semiconductor manufacturing apparatusKOKUSAI ELECTRIC CORP·Filed 2018·Granted Aug 17, 2021·0 cites·1 claims
- 5030USD793975SHeater for semiconductor thermal processHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 8, 2017·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →