Inventor · disambiguated record
Kazushige Takaishi
Also filed as: TAKAISHI KAZUSHIGE
26 granted patents·22 pending applications·126 citations·filing 1998–2021
95Inventor score
Top patents by PatentIndex Score
48 records- 0181US7488400B2Apparatus for etching wafer by single-wafer processSUMCO CORP·Filed 2006·Granted Feb 10, 2009·7 cites·7 claims
- 0280US7456106B2Method for producing a silicon waferSUMITOMO MITSUBISHI SILICON·Filed 2004·Granted Nov 25, 2008·23 cites·5 claims
- 0377US7601644B2Method for manufacturing silicon wafersSUMCO CORP·Filed 2005·Granted Oct 13, 2009·6 cites·4 claims
- 0476US7906438B2Single wafer etching methodSUMCO CORP·Filed 2007·Granted Mar 15, 2011·5 cites·5 claims
- 0568US8728942B2Method for producing epitaxial silicon waferOGATA SHINICHI·Filed 2010·Granted May 20, 2014·3 cites·2 claims
- 0667US8466071B2Method for etching single waferKOYATA SAKAE·Filed 2007·Granted Jun 18, 2013·3 cites·2 claims
- 0767US7998867B2Method for manufacturing epitaxial waferSUMCO CORP·Filed 2008·Granted Aug 16, 2011·2 cites·3 claims
- 0866US8147295B2Method of polishing silicon waferKATOH TAKEO·Filed 2009·Granted Apr 3, 2012·4 cites·8 claims
- 0966US8080106B2Epitaxial silicon wafer and production method thereofKIHARA TAKAYUKI·Filed 2009·Granted Dec 20, 2011·2 cites·1 claims
- 1063US8900033B2Wafer polishing methodTAKAISHI KAZUSHIGE·Filed 2010·Granted Dec 2, 2014·3 cites·11 claims
- 1163US8759229B2Method for manufacturing epitaxial waferKOYATA SAKAE·Filed 2007·Granted Jun 24, 2014·2 cites·7 claims
- 1261US7851375B2Alkaline etchant for controlling surface roughness of semiconductor waferSUMCO CORP·Filed 2005·Granted Dec 14, 2010·1 cites·4 claims
- 1361US7648890B2Process for producing silicon waferSUMCO CORP·Filed 2006·Granted Jan 19, 2010·1 cites·7 claims
- 1455US12500089B2Wafer polishing method and wafer producing methodSUMCO CORP·Filed 2021·Granted Dec 16, 2025·0 cites·13 claims
- 1555US7338904B2Method for manufacturing single-side mirror surface waferSUMCO CORP·Filed 2004·Granted Mar 4, 2008·7 cites·3 claims
- 1655US7226864B2Method for producing a silicon waferSUMITOMO MITSUBISHI SILICON·Filed 2004·Granted Jun 5, 2007·6 cites·4 claims
- 1753US7645702B2Manufacturing method of silicon waferSUMCO CORP·Filed 2004·Granted Jan 12, 2010·4 cites·3 claims
- 1853US6146467ATreatment method for semiconductor substratesMITSUBISHI MATERIAL SILICON·Filed 1999·Granted Nov 14, 2000·24 cites·5 claims
- 1953US2009117749A1Etching Method of Single WaferSUMCO CORP·Filed 2008·Application pending·0 cites
- 2052US6296714B1Washing solution of semiconductor substrate and washing method using the sameMITSUBISHI MATERIAL SILICON·Filed 1998·Granted Oct 2, 2001·21 cites·13 claims
- 2152US2009297426A1Silicon waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 2252US2009311460A1Semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 2351US8066896B2Apparatus for etching wafer by single-wafer process and single wafer type method for etching waferKOYATA SAKAE·Filed 2007·Granted Nov 29, 2011·0 cites·4 claims
- 2450US12311496B2Method of double-side polishing work, method of producing work, and double-side polishing apparatus for a workSUMCO CORP·Filed 2021·Granted May 27, 2025·0 cites·16 claims
- 2549US9190267B2Epitaxial silicon wafer and production method thereofKIHARA TAKAYUKI·Filed 2011·Granted Nov 17, 2015·0 cites·4 claims
- 2649US2009211167A1Slurry for wire sawSUMCO CORP·Filed 2009·Application pending·0 cites
- 2748US7601642B2Method of processing silicon waferSUMCO CORP·Filed 2004·Granted Oct 13, 2009·2 cites·3 claims
- 2848US2010009155A1Semiconductor wafer and production method thereofSUMCO CORP·Filed 2009·Application pending·0 cites
- 2948US2009294910A1Silicon waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 3048US2010021688A1Wafer manufacturing method and wafer obtained through the methodSUMCO CORP·Filed 2009·Application pending·0 cites
- 3148US2010006982A1Method of producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 3248US2009294918A1Semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 3347US2009304975A1Epitaxial silicon wafer and method for producing the sameSUMCO CORP·Filed 2009·Application pending·0 cites
- 3447US2009293919A1Method for cleaning semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 3547US2010237470A1Epitaxial waferSUMCO CORP·Filed 2008·Application pending·0 cites
- 3647US2007161247A1Etching method of single waferKOYATA SAKAE·Filed 2006·Application pending·0 cites
- 3746US7955440B2Method for cleaning silicon wafer and apparatus for cleaning the silicon waferSUMCO CORP·Filed 2008·Granted Jun 7, 2011·0 cites·4 claims
- 3846US2009297867A1Semiconductor thin film-attached substrate and production method thereofSUMCO CORP·Filed 2009·Application pending·0 cites
- 3945US7955982B2Method for smoothing wafer surface and apparatus used thereforSUMCO CORP·Filed 2007·Granted Jun 7, 2011·0 cites·7 claims
- 4045US2009298397A1Method of grinding semiconductor wafers and device for grinding both surfaces of semiconductor wafersSUMCO CORP·Filed 2009·Application pending·0 cites
- 4144US7717768B2Wafer polishing apparatus and method for polishing wafersSUMCO CORP·Filed 2006·Granted May 18, 2010·0 cites·3 claims
- 4243US2009042390A1Etchant for silicon wafer surface shape control and method for manufacturing silicon wafers using the sameKOYATA SAKAE·Filed 2007·Application pending·0 cites
- 4342US2009304490A1Method for holding silicon waferKIHARA TAKAYUKI·Filed 2008·Application pending·0 cites
- 4442US2006264158A1Apparatus for polishing wafer and process for polishing waferSUMCO CORP·Filed 2006·Application pending·0 cites
- 4541US2009181546A1Single-Wafer Etching Method for Wafer and Etching Apparatus ThereofKATOH TAKEO·Filed 2008·Application pending·0 cites
- 4640US2008214094A1Method for manufacturing silicon waferKATOH TAKEO·Filed 2008·Application pending·0 cites
- 4737US2007267387A1Processing Method of Silicon WaferKOYATA SAKAE·Filed 2004·Application pending·0 cites
- 4835US2006194441A1Method for etching a silicon wafer and method for performing differentiation between the obverse and the reverse of a silicon wafer using the same methodKOYATA SAKAE·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →