Inventor · disambiguated record
Robert M. Nickerson
Also filed as: NICKERSON ROBERT · NICKERSON ROBERT M
42 granted patents·20 pending applications·413 citations·filing 2003–2025
97Inventor score
Top patents by PatentIndex Score
62 records- 0197US8987918B2Interconnect structures with polymer coreINTEL CORP·Filed 2013·Granted Mar 24, 2015·54 cites·25 claims
- 0296US12107082B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2023·Granted Oct 1, 2024·2 cites·16 claims
- 0395US8742597B2Package substrates with multiple diceNICKERSON ROBERT·Filed 2012·Granted Jun 3, 2014·58 cites·26 claims
- 0494US9159690B2Tall solders for through-mold interconnectINTEL CORP·Filed 2013·Granted Oct 13, 2015·42 cites·10 claims
- 0594US2025391754A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 0693US10121722B1Architecture material and process to improve thermal performance of the embedded die packageINTEL CORP·Filed 2017·Granted Nov 6, 2018·12 cites·25 claims
- 0792US11798932B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2022·Granted Oct 24, 2023·1 cites·10 claims
- 0891US11430724B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2017·Granted Aug 30, 2022·5 cites·24 claims
- 0991US8513792B2Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2009·Granted Aug 20, 2013·20 cites·18 claims
- 1091US7304373B2Power distribution within a folded flex package method and apparatusINTEL CORP·Filed 2004·Granted Dec 4, 2007·83 cites·18 claims
- 1190US11978730B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2022·Granted May 7, 2024·1 cites·9 claims
- 1290US10607976B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2016·Granted Mar 31, 2020·6 cites·11 claims
- 1390US9666549B2Methods for solder for through-mold interconnectINTEL CORP·Filed 2015·Granted May 30, 2017·10 cites·16 claims
- 1488US2025329604A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2025·Application pending·0 cites
- 1586US7358444B2Folded substrate with interposer package for integrated circuit devicesINTEL CORP·Filed 2004·Granted Apr 15, 2008·34 cites·21 claims
- 1686US2024222350A1Offset interposers for large-bottom packages and large-die package-on- package structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1784US12476174B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1884US12417958B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zoneINTEL CORP·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 1983US12347743B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 2082US10446530B2Offset interposers for large-bottom packages and large-die package-on-package structuresMORTENSEN RUSSELL K·Filed 2011·Granted Oct 15, 2019·5 cites·24 claims
- 2181US2024014097A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Application pending·0 cites
- 2279US12406914B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 2379US9691728B2BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibilityINTEL CORP·Filed 2015·Granted Jun 27, 2017·3 cites·5 claims
- 2476US2022344247A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2575US7375978B2Method and apparatus for trace shielding and routing on a substrateINTEL CORP·Filed 2003·Granted May 20, 2008·23 cites·17 claims
- 2672US7190068B2Bottom heat spreaderINTEL CORP·Filed 2004·Granted Mar 13, 2007·19 cites·26 claims
- 2769US10231338B2Methods of forming trenches in packages structures and structures formed therebyINTEL CORP·Filed 2015·Granted Mar 12, 2019·2 cites·23 claims
- 2868US7250684B2Circular wire-bond pad, package made therewith, and method of assembling sameINTEL CORP·Filed 2004·Granted Jul 31, 2007·14 cites·4 claims
- 2967US12406906B2Through mold interconnect drill featureINTEL CORP·Filed 2023·Granted Sep 2, 2025·0 cites·22 claims
- 3067US12394773B2Laser ablation-based surface property modification and contamination removalINTEL CORP·Filed 2023·Granted Aug 19, 2025·0 cites·17 claims
- 3165US12315777B2Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zoneINTEL CORP·Filed 2019·Granted May 27, 2025·0 cites·23 claims
- 3265US6794760B1Integrated circuit interconnectINTEL CORP·Filed 2003·Granted Sep 21, 2004·15 cites·19 claims
- 3364US2020251462A1Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2019·Application pending·0 cites
- 3456US11705383B2Through mold interconnect drill featureINTEL CORP·Filed 2019·Granted Jul 18, 2023·0 cites·23 claims
- 3556US11056466B2Package on package thermal transfer systems and methodsINTEL CORP·Filed 2019·Granted Jul 6, 2021·0 cites·18 claims
- 3656US2016133557A1Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 3755US10128225B2Interconnect structures with polymer coreINTEL CORP·Filed 2017·Granted Nov 13, 2018·0 cites·7 claims
- 3855US8674519B2Microelectronic package and method of manufacturing sameARANA LEONEL R·Filed 2010·Granted Mar 18, 2014·1 cites·15 claims
- 3954US9177911B2Package substrates with multiple diceINTEL CORP·Filed 2014·Granted Nov 3, 2015·0 cites·20 claims
- 4053US12362340B2Laser ablation-based surface property modification and contamination removalINTEL CORP·Filed 2019·Granted Jul 15, 2025·0 cites·24 claims
- 4152US9691727B2Pad-less interconnect for electrical coreless substrateINTEL CORP·Filed 2015·Granted Jun 27, 2017·0 cites·19 claims
- 4251US10438930B2Package on package thermal transfer systems and methodsINTEL CORP·Filed 2017·Granted Oct 8, 2019·0 cites·23 claims
- 4351US9613934B2Interconnect structures with polymer coreINTEL CORP·Filed 2015·Granted Apr 4, 2017·0 cites·10 claims
- 4450US2013292838A1Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2013·Application pending·0 cites
- 4548US2008023820A1Bond finger on via substrate, process of making same, package made thereby, and method of assembling sameINTEL CORP·Filed 2007·Application pending·0 cites
- 4648US2014159250A1Bbul top side substrate layer enabling dual sided silicon interconnect and stacking flexibilityNICKERSON ROBERT M·Filed 2011·Application pending·0 cites
- 4747US9049807B2Processes of making pad-less interconnect for electrical coreless substrateSOTO JAVIER·Filed 2008·Granted Jun 2, 2015·0 cites·19 claims
- 4847US7818878B2Integrated circuit device mounting with folded substrate and interposerINTEL CORP·Filed 2008·Granted Oct 26, 2010·0 cites·9 claims
- 4947US2008014436A1Circular wire-bond pad, package made therewith, and method of assembling sameINTEL CORP·Filed 2007·Application pending·0 cites
- 5046US2007184644A1Ball grid array copper balancingINTEL CORP·Filed 2007·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →