Inventor · disambiguated record
Sriram Muthukumar
Also filed as: MUTHUKUMAR SRIRAM · MUTHUKUMAR SRIRAM KABISTHALAM
32 granted patents·11 pending applications·226 citations·filing 2002–2023
97Inventor score
Top patents by PatentIndex Score
43 records- 0191US7851269B2Method of stiffening coreless package substrateINTEL CORP·Filed 2009·Granted Dec 14, 2010·16 cites·17 claims
- 0291US7443030B2Thin silicon based substrateINTEL CORP·Filed 2006·Granted Oct 28, 2008·18 cites·10 claims
- 0388US7750487B2Metal-metal bonding of compliant interconnectINTEL CORP·Filed 2004·Granted Jul 6, 2010·41 cites·14 claims
- 0486US10186480B2Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing sameMUTHUKUMAR SRIRAM·Filed 2013·Granted Jan 22, 2019·7 cites·20 claims
- 0585US10134689B1Warpage compensation metal for wafer level packaging technologyMAXIM INTEGRATED PRODUCTS·Filed 2016·Granted Nov 20, 2018·5 cites·19 claims
- 0685US10006882B2Biosensing system and methods using electron-ionic mechanisms at fluid-sensor interfacesENLISENSE LLC·Filed 2015·Granted Jun 26, 2018·6 cites·16 claims
- 0785US8143110B2Methods and apparatuses to stiffen integrated circuit packageKARPUR PRASANNA·Filed 2009·Granted Mar 27, 2012·17 cites·18 claims
- 0882US7882628B2Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-viasINTEL CORP·Filed 2007·Granted Feb 8, 2011·13 cites·15 claims
- 0982US7841080B2Multi-chip packaging using an interposer with through-viasINTEL CORP·Filed 2007·Granted Nov 30, 2010·10 cites·8 claims
- 1080US11217516B2Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing sameINTEL CORP·Filed 2018·Granted Jan 4, 2022·2 cites·14 claims
- 1177US8502400B2Methods and apparatuses to stiffen integrated circuit packageKARPUR PRASANNA·Filed 2012·Granted Aug 6, 2013·5 cites·15 claims
- 1277US7400030B2Schottky diode with silver layer contacting the ZnO and MgxZn1−xO filmsUNIV RUTGERS·Filed 2005·Granted Jul 15, 2008·4 cites·24 claims
- 1377US6979489B2Zinc oxide nanotip and fabricating method thereofUNIV RUTGERS·Filed 2002·Granted Dec 27, 2005·11 cites·27 claims
- 1476US2023408499A1Multi-configurable sensing array and methods of using sameENLISENSE LLC·Filed 2023·Application pending·0 cites
- 1575US7589424B2Thin silicon based substrateINTEL CORP·Filed 2008·Granted Sep 15, 2009·5 cites·10 claims
- 1672US7279391B2Integrated inductors and compliant interconnects for semiconductor packagingINTEL CORP·Filed 2005·Granted Oct 9, 2007·5 cites·6 claims
- 1771US7049208B2Method of manufacturing of thin based substrateINTEL CORP·Filed 2004·Granted May 23, 2006·13 cites·8 claims
- 1869US6846731B2Schottky diode with silver layer contacting the ZnO and MgxZn1-xO filmsUNIV RUTGERS·Filed 2002·Granted Jan 25, 2005·12 cites·20 claims
- 1967US7800402B1Look-up table overdrive circuitsALTERA CORP·Filed 2007·Granted Sep 21, 2010·5 cites·18 claims
- 2066US8860205B2Method of stiffening coreless package substrateMUTHUKUMAR SRIRAM·Filed 2010·Granted Oct 14, 2014·1 cites·20 claims
- 2165US9806047B2Wafer level device and method with cantilever pillar structureMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Oct 31, 2017·1 cites·17 claims
- 2265US7378742B2Compliant interconnects for semiconductors and micromachinesINTEL CORP·Filed 2004·Granted May 27, 2008·18 cites·22 claims
- 2361US7400041B2Compliant multi-composition interconnectsMUTHUKUMAR SRIRAM·Filed 2004·Granted Jul 15, 2008·10 cites·11 claims
- 2460US8387240B2Methods for making multi-chip packaging using an interposerMUTHUKUMAR SRIRAM·Filed 2010·Granted Mar 5, 2013·1 cites·20 claims
- 2558US12422396B2Systems and methods for multi-modal and multiplexed electrochemical detection and reporting of environmental contaminantsENLISENSE LLC·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 2658US11782055B2Multi-configurable sensing array and methods of using sameENLISENSE LLC·Filed 2017·Granted Oct 10, 2023·0 cites·20 claims
- 2754US2021325380A1Disease diagnostics using a multi-configurable sensing arrayENLISENSE LLC·Filed 2021·Application pending·0 cites
- 2853US2010327419A1Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing sameMUTHUKUMAR SRIRAM·Filed 2009·Application pending·0 cites
- 2953US2007151508A1Zinc oxide nanotip and fabricating method thereofUNIV RUTGERS·Filed 2005·Application pending·0 cites
- 3049US12076143B2Wearable biosensors with room temperature ionic liquid bufferENLISENSE LLC·Filed 2018·Granted Sep 3, 2024·0 cites·19 claims
- 3148US8030782B2Metal-metal bonding of compliant interconnectINTEL CORP·Filed 2010·Granted Oct 4, 2011·0 cites·10 claims
- 3248US2008023791A1High performance integrated inductorMUTHUKUMAR SRIRAM·Filed 2007·Application pending·0 cites
- 3347US7294525B2High performance integrated inductorINTEL CORP·Filed 2005·Granted Nov 13, 2007·0 cites·21 claims
- 3447US2022160265A1Machine-learning based biosensor systemSANKHALA DEVANGSINGH GAJENDARSINGH·Filed 2021·Application pending·0 cites
- 3546US2007290362A1Integrated inductors and compliant interconnects for semiconductor packagingHSU ROCKWELL·Filed 2007·Application pending·0 cites
- 3645US9728515B2Integrated WLUF and SOD processINTEL CORP·Filed 2016·Granted Aug 8, 2017·0 cites·18 claims
- 3744US10379592B2Power management of an NZE IoT deviceINTEL CORP·Filed 2017·Granted Aug 13, 2019·0 cites·20 claims
- 3841US2008217183A1Electropolishing metal features on a semiconductor waferMUTHUKUMAR SRIRAM·Filed 2007·Application pending·0 cites
- 3938US9349698B2Integrated WLUF and SOD processMAHMUD RUBAYAT·Filed 2012·Granted May 24, 2016·0 cites·11 claims
- 4037US2006286487A1Process for coating thick resist over polymer featuresHILL CHARLES D·Filed 2005·Application pending·0 cites
- 4137US2006264021A1Offset solder bump method and apparatusINTEL CORP·Filed 2005·Application pending·0 cites
- 4235US2006290000A1Composite metal layer formed using metal nanocrystalline particles in an electroplating bathWORWAG WOJCIECH·Filed 2005·Application pending·0 cites
- 4334US12310725B2High density analog multipexingENLISENSE LLC·Filed 2019·Granted May 27, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →